Infineon Technologies IRG4BC30K-S
- Part No.:
- IRG4BC30K-S
- Manufacturer:
- Infineon Technologies
- Category:
- Single IGBTs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IRG4BC30K-S.pdf
- Description:
- IGBT 600V 28A 100W D2PAK
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
IRG4BC30K-S from Infineon Technologies (formerly International Rectifier) is a short-circuit-rated 600 V, 28 A (TC = 25°C) n-channel D2PAK IGBT optimized for motor control inverters and UPS systems. It delivers VCE(on) = 2.21 V @ 16 A/15 V, tsc = 10 µs at 360 V, and Eoff = 0.51 mJ, enabling robust 3-phase inverter stages in HVAC and industrial drives.
For engineers reviewing the IRG4BC30K-S datasheet, IRG4BC30K-S pinout, IRG4BC30K-S application, or IRG4BC30K-S equivalent, key selection criteria include short-circuit withstand time, gate charge (Qg = 67 nC), thermal resistance (RθJC = 1.2 °C/W), and clamped inductive load capability (ILM = 58 A).
Technical Context
This IGBT employs a trench-gate field-stop structure with integrated freewheeling diode optimization, supporting high-efficiency hard-switched topologies up to 20 kHz. Its gate threshold voltage (VGE(th) = 3.0–6.0 V) and negative temperature coefficient of VCE(on) enable stable parallel operation under thermal stress.
Designed for 400–480 V DC bus applications, it features low Cies = 920 pF and Cres = 27 pF at 30 V, minimizing Miller-induced turn-on risk. The 10 µs short-circuit rating is validated at VCE(start) = 360 V, TJ = 125°C, and VGE = 15 V with RG = 23 Ω.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCES | 600 V - Withstands 480 V DC bus with 25% margin for transient overvoltage in industrial inverters. |
| IC @ TC = 25°C | 28 A - Supports continuous 1.5 kW motor drive output with standard heatsinking. |
| tsc | 10 µs - Enables hardware-level fault response without external desaturation detection in 3-phase bridge legs. |
| Qg | 67 nC (typ.) - Determines gate driver power requirement (~1 W @ 20 kHz, 15 V swing) and switching loss trade-off. |
| RθJC | 1.2 °C/W - Allows 58 W dissipation at 100°C case temperature before exceeding 150°C junction limit. |
| Eoff | 0.51 mJ @ 480 V - Sets minimum dead-time and snubber sizing for 16 A load current in hard-switched PFC or inverter stages. |
| VCE(on) | 2.21 V @ 16 A/15 V - Contributes ≤ 35 W conduction loss per device in 30 A RMS motor phase leg. |
Pinout & Package
D2PAK (TO-263) surface-mount package with isolated tab; 3-pin configuration optimized for low-inductance PCB layout and direct heatsink mounting via screw (M3/6-32, 1.1 N·m torque).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 – Gate | Control input | Receives 15 V logic-level drive; requires <23 Ω series resistance to limit dV/dt-induced turn-on during switching. |
| 2 – Drain | High-side switch node | Connected to DC+ bus; carries full load current and must be routed with minimal loop inductance to suppress voltage spikes. |
| 3 – Source | Emitter return path | Serves as local ground reference for gate driver; shared with freewheeling diode cathode in half-bridge configuration. |
Key Features
| Feature | Design Value |
|---|---|
| Short-circuit rated | tsc = 10 µs at 360 V, TJ = 125°C - Eliminates need for fast desaturation circuitry in cost-sensitive motor drives. |
| Low VCE(on) + high speed | VCE(on) = 2.21 V @ 16 A + Ets = 0.87 mJ - Balances conduction and switching losses for 10–20 kHz PWM in HVAC compressors. |
| Tighter parameter distribution | ±10% VCE(on) and ±15% Qg across lot - Enables reliable paralleling without current-sharing resistors in high-power modules. |
| Optimized for HEXFRED™ diodes | Matched recovery characteristics with IR's ultrafast soft-recovery diodes - Reduces EMI and diode reverse recovery loss by >40% vs. standard FRD. |
Applications
| Industrial Motor Drives | HVAC Inverter Compressors |
|---|---|
Use Scenario: 3-phase 2–5 kW variable-frequency drives for pumps and conveyors operating at 400 V AC input. IC Role / Device Role / Timing Role: Main switching device in inverter leg; handles 16 A RMS phase current with 10 µs fault clearance timing. Use Value: Enables compact heatsink design due to RθJC = 1.2 °C/W and eliminates external SC protection circuitry. | Use Scenario: Hermetic compressor inverters in residential and light-commercial air conditioners. IC Role / Device Role / Timing Role: High-side switch in 20 kHz PWM inverter stage; operates at TJ = 125°C with 10 µs short-circuit tolerance. Use Value: Reduces system size by 22% vs. previous-generation IGBTs while maintaining 15-year reliability under thermal cycling. |
| Uninterruptible Power Supplies | Induction Heating Half-Bridge |
Use Scenario: Online double-conversion UPS with 480 V DC link and 5 kVA output capacity. IC Role / Device Role / Timing Role: Inverter-stage IGBT; switches 28 A peak current with Eoff = 0.51 mJ limiting snubber losses. Use Value: Achieves >95.2% efficiency at full load by minimizing combined conduction (2.21 V) and switching (0.87 mJ) losses. | Use Scenario: 20–50 kW resonant induction heating systems using asymmetrical half-bridge topology. IC Role / Device Role / Timing Role: Low-side switch handling 58 A pulsed collector current (ICM) during resonant peaks. Use Value: Supports 50 kHz operation with low Cres = 27 pF, reducing Miller feedback and enabling clean zero-voltage switching transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar IGBT switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRG4PH40KD-EP | Higher VCES = 1200 V, lower IC = 20 A, tsc = 10 µs unchanged | Targeted at 600–800 V DC bus industrial welders and traction inverters | Select when system DC link exceeds 600 V or higher avalanche energy (EARV = 420 mJ) is required. |
| FGA25N120ANTD | Same 600 V rating but higher IC = 35 A, Qg = 95 nC, no specified tsc | Designed for high-current UPS and solar inverters requiring higher continuous current | Choose when conduction loss dominates and short-circuit protection is handled externally via controller. |
Compared with IRG4BC30K-S, IRG4PH40KD-EP trades lower current for higher voltage ruggedness and avalanche margin, while FGA25N120ANTD offers higher current headroom at the cost of increased gate drive demand and no guaranteed short-circuit rating-making IRG4BC30K-S optimal for thermally constrained, fault-tolerant motor control.
Availability
IRG4BC30K-S is available at Aetrix Electronics and suitable for industrial motor drives, HVAC inverter compressors, and uninterruptible power supplies requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for IRG4BC30K-S includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, sensor, and automotive ICs, headquartered in Munich, Germany.
This device belongs to Infineon's legacy Short-Circuit Rated UltraFast IGBT product line, engineered specifically for high-reliability motor control inverters where fault tolerance and thermal stability are critical.
FAQ
What is the maximum gate-emitter voltage rating for IRG4BC30K-S?
The absolute maximum VGE is ±20 V. Operation above ±15 V increases gate oxide stress and reduces long-term reliability; typical gate drive uses +15 V for turn-on and –5 V to –10 V for turn-off to ensure robust noise immunity and prevent spurious turn-on during high dV/dt events.
Can IRG4BC30K-S be paralleled without emitter resistors?
Yes-its negative temperature coefficient of VCE(on) and tight parameter distribution (±10% VCE(on), ±15% Qg) enable stable current sharing across devices. However, matched gate drive impedance (<5% variation) and symmetrical PCB layout are mandatory to avoid dynamic imbalance during switching transients.
What thermal interface material is recommended for the D2PAK tab?
A silicone-based thermal grease with 0.5–1.0 W/m·K conductivity and 0.05–0.1 mm bond line thickness is recommended. Avoid non-curing pastes that pump out under thermal cycling; use conformal-coated heatsinks or insulating pads only if isolation voltage >2500 VRMS is required.
Does IRG4BC30K-S include an integrated body diode?
No-it does not have a monolithically integrated body diode. External freewheeling diodes (e.g., IR's HEXFRED™ series) must be used in anti-parallel configuration. This architecture avoids reverse recovery losses inherent in IGBT-integrated diodes and enables optimized diode selection for specific EMI and efficiency targets.
IRG4BC30K-S Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tube
- Product Status:
- Obsolete
- IGBT Type:
- -
- Voltage - Collector Emitter Breakdown (Max):
- 600 V
- Current - Collector (Ic) (Max):
- 28 A
- Current - Collector Pulsed (Icm):
- 58 A
- Vce(on) (Max) @ Vge, Ic:
- 2.7V @ 15V, 16A
- Power - Max:
- 100 W
- Switching Energy:
- 360µJ (on), 510µJ (off)
- Input Type:
- Standard
- Gate Charge:
- 67 nC
- Td (on/off) @ 25°C:
- 26ns/130ns
- Test Condition:
- 480V, 16A, 23Ohm, 15V
- Reverse Recovery Time (trr):
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
IRG4BC30K-S FAQ
1.How can I place an order for IRG4BC30K-S through Aetrix?
Please submit a Request for Quotation (RFQ) for IRG4BC30K-S on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRG4BC30K-S reliable?
The price and inventory of IRG4BC30K-S are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRG4BC30K-S is usually 5 days.
3.What payment methods are accepted for IRG4BC30K-S?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRG4BC30K-S transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRG4BC30K-S?
IRG4BC30K-S orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRG4BC30K-S order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRG4BC30K-S?
For technical support, including IRG4BC30K-S datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRG4BC30K-S requirements.
6.How does Aetrix verify that IRG4BC30K-S is sourced from the original manufacturer or authorized distributors?
All IRG4BC30K-S products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRG4BC30K-S meets industry standards.
7.What is the process for return or replacement of IRG4BC30K-S?
All IRG4BC30K-S units undergo pre-shipment inspection (PSI). If there is an issue with IRG4BC30K-S, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRG4BC30K-S part is unused and in its original packaging.
Return procedure for IRG4BC30K-S:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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