Infineon Technologies IRG4IBC30UDPBF
- Part No.:
- IRG4IBC30UDPBF
- Manufacturer:
- Infineon Technologies
- Category:
- Single IGBTs
- Package:
- TO-220-3 Full Pack
- Datasheet:
-
IRG4IBC30UDPBF.pdf
- Description:
- IGBT 600V 17A 45W TO220FP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
IRG4IBC30UDPBF from Infineon Technologies is a 600 V, 17 A insulated gate bipolar transistor co-packaged with an ultrafast soft-recovery HEXFRED diode in a TO-220 FullPAK package. It delivers 1.95 V typical VCE(on) at 12 A/15 VGE, 42 ns diode reverse recovery time (trr) at 25 °C, and 0.54 mJ total switching loss at 25 °C - optimized for hard-switched PFC and motor drives operating at 8–40 kHz.
For engineers reviewing the IRG4IBC30UDPBF datasheet, IRG4IBC30UDPBF pinout, IRG4IBC30UDPBF application, or IRG4IBC30UDPBF equivalent, key selection criteria include its 2.8 °C/W IGBT junction-to-case thermal resistance, 2.5 kV isolation rating, tight parameter distribution, and integrated antiparallel diode with <60 ns trr and <6 A IRRM at 125 °C.
Technical Context
This IGBT employs a trench-gate field-stop structure enabling low conduction loss while maintaining fast, soft turn-off behavior. Its co-packaged HEXFRED diode features low Qrr (80–180 nC), controlled di/dt during recovery (<200 A/µs), and minimized EMI generation in high-frequency switching topologies.
The device supports gate drive with ±20 V maximum VGE, exhibits -11 mV/°C threshold voltage drift, and maintains stable VCE(on) up to 150 °C (2.09 V at 12 A). Thermal design is enabled by isolated mounting (2.5 kV RMS) and 4.8 mm creepage distance to heatsink.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCES | 600 V - Withstands DC bus voltages up to 480 V nominal with 25% safety margin in industrial PFC stages. |
| IC @ TC = 25°C | 17 A - Sustains continuous output current for 1–2 kW motor inverter legs without forced cooling. |
| VCE(on) typ. | 1.95 V @ 12 A, 15 VGE - Enables <2.3 W conduction loss per device at rated current, reducing heatsink size. |
| trr (diode) | 42 ns @ 25 °C - Limits reverse recovery energy (Erec) and prevents voltage overshoot in bridge-leg commutation. |
| RθJC (IGBT) | 2.8 °C/W - Allows direct thermal interface to heatsink; enables 45 W power dissipation at ≤25 °C case rise. |
| Ets total | 0.54 mJ @ 25 °C - Defines total energy loss per switching cycle at 480 V, 12 A, critical for efficiency modeling. |
| Visol | 2500 V RMS - Supports reinforced insulation in Class I safety designs without additional barrier materials. |
Pinout & Package
TO-220 FullPAK package with electrically isolated tab (mounting surface), 3-pin configuration, and lead-free finish. The case serves as the collector terminal and provides galvanic isolation from heatsink.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Collector (Tab) | Main power output / high-side switch node | Electrically isolated metal tab; connects directly to heatsink while maintaining 2.5 kV isolation barrier. |
| Emitter | Power return path / low-side reference | Common emitter for both IGBT and antiparallel diode; forms low-inductance return loop with driver ground. |
| Gate | Control input for IGBT channel | High-impedance MOS-controlled terminal requiring 15 V for full enhancement; sensitive to ringing due to Cies = 1100 pF. |
Key Features
| Feature | Design Value |
|---|---|
| Co-packaged HEXFRED diode | Reduces board space and parasitic inductance vs. discrete diode placement; eliminates layout-dependent recovery mismatch. |
| UltraFast soft recovery | Diode trr ≤ 60 ns and IRRM ≤ 6 A at 125 °C enable clean zero-voltage switching transitions in resonant LLC converters. |
| Tight parameter distribution | ±10% VCE(on) and ±15% Qg across production lot ensures consistent gate drive sizing and thermal margin across parallel devices. |
| Isolated TO-220 FullPAK | Eliminates need for insulating washer or silicone pad; simplifies mechanical assembly and improves long-term thermal reliability. |
| Lead-free and RoHS compliant | Meets IPC-J-STD-020 moisture sensitivity level 1; supports standard reflow profiles without pre-bake requirement. |
Applications
| Industrial Motor Drives | Server Power Factor Correction |
|---|---|
Use Scenario: 3-phase inverter stage in 1.5 kW HVAC compressor drive operating at 16 kHz PWM frequency. IC Role / Device Role / Timing Role: High-side IGBT switch with integrated antiparallel diode handling regenerative braking current and freewheeling paths. Use Value: Soft diode recovery limits dv/dt-induced shoot-through risk during commutation; 2.8 °C/W RθJC enables natural convection cooling. |
Use Scenario: Boost PFC stage in 80 PLUS Titanium server PSU delivering 1.2 kW at >98% efficiency. IC Role / Device Role / Timing Role: Active switch in continuous conduction mode (CCM) boost converter, switching at 30 kHz with 50% duty cycle. Use Value: Low 1.95 V VCE(on) reduces conduction loss; 0.54 mJ Ets minimizes switching loss contribution at high line frequency. |
| Solar Microinverters | Induction Cooking Systems |
Use Scenario: H-bridge inverter in single-phase 300 W microinverter interfacing with 36–60 V PV string. IC Role / Device Role / Timing Role: Half-bridge leg switch operating in unipolar modulation at 40 kHz with synchronous rectification. Use Value: 42 ns trr prevents cross-conduction during dead-time; 2.5 kV isolation meets IEC 62109 photovoltaic system safety requirements. |
Use Scenario: Resonant inverter driving 20 kHz induction coil in 3.5 kW domestic cooktop. IC Role / Device Role / Timing Role: Main switching device in series-resonant topology, conducting pulsed currents up to 68 A peak. Use Value: ILM = 68 A clamped inductive load rating supports high peak current without secondary breakdown; soft diode limits EMI during ZVS transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar IGBT + integrated diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STGP30NC60WD | 600 V/30 A, higher IC rating but 2.4 V VCE(on); no isolation rating specified; TO-247 package. | Requires insulating hardware; better suited for higher-current 3 kW inverters where thermal headroom is critical. | Select when higher continuous current (>20 A) is required and isolation is managed externally. |
| IXYS IXGN30N60B3 | 600 V/30 A, 1.85 V VCE(on), 35 ns trr, but non-isolated TO-247; higher Qg (105 nC) demands stronger gate driver. | Lacks 2.5 kV isolation; unsuitable for safety-critical AC-connected systems without added barriers. | Prefer for high-efficiency resonant converters where isolation is handled at system level and gate drive capability exists. |
Compared with STGP30NC60WD and IXGN30N60B3, IRG4IBC30UDPBF uniquely combines certified 2.5 kV isolation, TO-220 FullPAK simplicity, and balanced 1.95 V/42 ns performance - making it optimal for cost-sensitive, safety-compliant 1–2 kW industrial and consumer power stages where board space and assembly complexity matter.
Availability
IRG4IBC30UDPBF is available at Aetrix Electronics and suitable for industrial motor drives, server PFC modules, solar microinverters, and induction cooking systems requiring stable component supply, long-lifecycle support, and certified isolation compliance.
Supply support for IRG4IBC30UDPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and automotive ICs, with global manufacturing and quality certification to ISO 9001 and IATF 16949.
This device belongs to Infineon's "UltraFast CoPack" IGBT family, engineered specifically for high-frequency hard-switched and resonant power conversion where low-loss switching, soft recovery, and integrated isolation reduce system-level EMI and thermal design burden.
FAQ
What is the maximum gate resistor value recommended for reliable turn-off?
With RG = 23 Ω, td(off) is 91–140 ns and Eoff is 0.16 mJ at 25 °C. Increasing RG beyond 33 Ω extends td(off) nonlinearly and raises Eoff sharply - especially above 100 °C - risking thermal runaway. For 12 A operation, 15–23 Ω is optimal to balance speed and loss.
Can IRG4IBC30UDPBF be used in parallel configurations?
Yes - its positive VCE(on) temperature coefficient (0.63 V/°C) and tight parameter distribution (±10%) support current sharing. Parallel operation requires matched gate resistors, symmetrical PCB layout, and shared heatsink mounting to maintain ΔTJ < 5 °C between devices.
Does the isolation rating apply to continuous or transient conditions?
The 2500 V RMS isolation voltage is rated for 60 seconds per UL 60950-1 and IEC 60747-5-2. It is not a continuous working voltage; sustained voltage across the isolation barrier must remain below 500 V RMS for long-term reliability.
What is the safe operating area (SOA) limitation at 100 °C case temperature?
At TC = 100 °C, the DC SOA is limited to 8.9 A at VCE ≤ 200 V. For pulse operation (≤100 µs), the device supports up to 68 A at VCE ≤ 400 V, provided peak power does not exceed 45 W and junction temperature stays within -55 to +150 °C.
IRG4IBC30UDPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- TO-220-3 Full Pack
- Packaging:
- Tube
- Product Status:
- Obsolete
- IGBT Type:
- -
- Voltage - Collector Emitter Breakdown (Max):
- 600 V
- Current - Collector (Ic) (Max):
- 17 A
- Current - Collector Pulsed (Icm):
- 68 A
- Vce(on) (Max) @ Vge, Ic:
- 2.1V @ 15V, 12A
- Power - Max:
- 45 W
- Switching Energy:
- 380µJ (on), 160µJ (off)
- Input Type:
- Standard
- Gate Charge:
- 50 nC
- Td (on/off) @ 25°C:
- 40ns/91ns
- Test Condition:
- 480V, 12A, 23Ohm, 15V
- Reverse Recovery Time (trr):
- 42 ns
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220AB Full-Pak
IRG4IBC30UDPBF FAQ
1.How can I place an order for IRG4IBC30UDPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRG4IBC30UDPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRG4IBC30UDPBF reliable?
The price and inventory of IRG4IBC30UDPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRG4IBC30UDPBF is usually 5 days.
3.What payment methods are accepted for IRG4IBC30UDPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRG4IBC30UDPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRG4IBC30UDPBF?
IRG4IBC30UDPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRG4IBC30UDPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRG4IBC30UDPBF?
For technical support, including IRG4IBC30UDPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRG4IBC30UDPBF requirements.
6.How does Aetrix verify that IRG4IBC30UDPBF is sourced from the original manufacturer or authorized distributors?
All IRG4IBC30UDPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRG4IBC30UDPBF meets industry standards.
7.What is the process for return or replacement of IRG4IBC30UDPBF?
All IRG4IBC30UDPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRG4IBC30UDPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRG4IBC30UDPBF part is unused and in its original packaging.
Return procedure for IRG4IBC30UDPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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