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Infineon Technologies IRGP35B60PDPBF

Part No.:
IRGP35B60PDPBF
Manufacturer:
Infineon Technologies
Category:
Single IGBTs
Package:
TO-247-3
Datasheet:
AetrixIRGP35B60PDPBF.pdf
Description:
IGBT NPT 600V 60A TO247AC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,818

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Product details

Overview

IRGP35B60PDPBF from Infineon (formerly International Rectifier) is a 600V, 35A NPT IGBT with co-packaged HEXFRED ultrafast soft-recovery diode in TO-247AC package. It delivers VCE(on) = 1.85V @ 22A/15V, 150kHz max switching frequency, and minimal tail current for high-efficiency telecom/server SMPS and PFC circuits.

For engineers reviewing the IRGP35B60PDPBF datasheet, IRGP35B60PDPBF pinout, IRGP35B60PDPBF application, or IRGP35B60PDPBF equivalent, key selection factors include its 0.41°C/W IGBT RθJC, 42ns diode trr at 25°C, parallel operation capability, and tight parameter distribution for consistent system-level performance.

Technical Context

This IGBT uses Non-Punch-Through (NPT) technology with positive temperature coefficient for stable parallel operation. Its gate threshold voltage (VGE(th)) is 4.0V typ. with -10mV/°C tempco, enabling predictable turn-on across temperature.

The integrated HEXFRED diode provides soft reverse recovery (Qrr = 80nC typ. @ 25°C, trr = 42ns), minimizing voltage overshoot and EMI in ZVS topologies. Switching losses are optimized via low Cies (3715pF) and Coes (265pF), supporting efficient operation up to 150kHz.

Key Specifications

ParameterValue and Actual Design Meaning
VCES600V - supports 400V DC bus designs with 50% safety margin in telecom/server SMPS
IC @ TC=25°C60A - enables high-current single-device solutions without forced air cooling
VCE(on) typ.1.85V @ 22A/15V - reduces conduction loss vs. comparable MOSFETs in 10–100kHz range
Eoff typ.215µJ @ 22A/390V - enables lower heat sink requirements in high-frequency PFC stages
trr typ.42ns @ 15A/200V/25°C - suppresses diode-induced voltage spikes in hard-switched converters
RθJC (IGBT)0.41°C/W - allows direct mounting to heatsink with minimal thermal interface resistance
Qg typ.160nC - determines gate driver power requirement and influences switching speed control

Pinout & Package

TO-247AC package with isolated tab (collector-connected), standard 3-pin layout for high-power discrete mounting. Thermal pad on collector side requires electrically insulating but thermally conductive interface material.

Pin/TerminalCircuit RoleDesign Meaning
Collector (C)Main current path inputConnected to high-side switch node; carries full load current and must be routed with low-inductance layout
Gate (G)Control terminalRequires low-impedance drive (RG = 3.3Ω typical) to manage Qg = 160nC and prevent oscillation
Emitter (E)Current return pathServes as common reference for gate drive and current sensing; must be low-inductance connection to minimize VCE measurement error

Key Features

FeatureDesign Value
NPT structure with positive VCE(on) tempcoEnables stable current sharing in paralleled configurations without external ballasting resistors
Co-packaged HEXFRED diodeReduces board space and parasitic inductance vs. discrete diode placement; soft recovery cuts EMI filter cost
Low tail currentMinimizes switching loss during turn-off transition, critical for efficiency in 50–150kHz PFC stages
Tighter parameter distributionReduces design margin requirements and improves batch-to-batch consistency in production SMPS assemblies
Lead-free and RoHS-compliantMeets global environmental compliance mandates without derating or process change for assembly

Applications

Telecom Server SMPSPFC Circuits

Use Scenario: Primary-side switching in 1–3kW telecom rectifiers and server PSUs operating at 100kHz.

IC Role / Device Role / Timing Role: High-voltage, high-current main switch in forward or half-bridge topology.

Use Value: 1.85V VCE(on) and 215µJ Eoff reduce total losses by ~12% vs. prior-gen 600V IGBTs at 22A load.

Use Scenario: Boost switch in active PFC front-end for industrial UPS and medical power systems.

IC Role / Device Role / Timing Role: Fast-switching, low-loss boost transistor handling 35A peak current at 65–150kHz.

Use Value: 42ns diode trr and soft recovery eliminate snubber networks, cutting BOM cost and layout area.

ZVS SMPSUninterruptible Power Supplies

Use Scenario: Resonant switch in LLC or phase-shifted full-bridge converters for data center PSUs.

IC Role / Device Role / Timing Role: Zero-voltage switched main device requiring low Coes (265pF) and controlled turn-off.

Use Value: Coes eff. (ER) = 179pF ensures predictable energy storage during VCE rise, enabling accurate ZVS timing design.

Use Scenario: Inverter-stage switching in line-interactive and online UPS systems delivering 2–5kVA output.

IC Role / Device Role / Timing Role: High-reliability, high-current switch in DC-AC H-bridge with 120A pulse rating.

Use Value: 120A ICM and 150°C TJ rating support overload tolerance and extended thermal margin during battery backup mode.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-frequency IGBT applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IXYS IXGN35N60B3Higher VCE(on) = 2.0V typ., lower Qg = 130nC, same 600V/35A ratingBetter suited for gate-drive-limited designs; slightly higher conduction lossPrefer when gate driver output current is constrained below 2A peak
STMicroelectronics STGW35H60DLFIntegrated fast diode with trr = 55ns, RθJC = 0.45°C/W, same TO-247 packageHigher diode recovery time increases snubber demand in ZVS circuitsChoose where diode softness is less critical than cost or local supply chain preference

Compared with IXGN35N60B3 and STGW35H60DLF, IRGP35B60PDPBF offers the lowest combined conduction + switching loss at 100–150kHz due to its 1.85V VCE(on) and 42ns trr, making it optimal for efficiency-critical telecom and server SMPS.

Availability

IRGP35B60PDPBF is available at Aetrix Electronics and suitable for telecom server SMPS, PFC circuits, and uninterruptible power supplies requiring stable component supply and long-term industrial lifecycle support.

Supply support for IRGP35B60PDPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and energy applications.

This device belongs to Infineon's WARP2 series of high-frequency IGBTs, engineered specifically for efficiency-critical switching power supplies operating above 50kHz with integrated soft-recovery diodes.

FAQ

What is the maximum recommended gate resistor value for reliable switching?

The datasheet specifies RG = 3.3Ω for characterization at 125°C. For robust operation across temperature, use 2.2–4.7Ω with ≥1W rating. Higher values increase switching time and Eon/Eoff; lower values risk gate oscillation due to 1.7Ω internal RG and PCB inductance.

Can IRGP35B60PDPBF replace a MOSFET in a 100kHz flyback converter?

No - this IGBT is not suitable for flyback topologies. Its minority-carrier nature causes excessive tail current and slow turn-off at light loads, leading to instability and loss. It is designed for hard-switched or resonant forward, half-bridge, and PFC boost stages where 22–35A continuous current and 100–150kHz operation are required.

Is the TO-247AC package electrically insulated?

No - the metal tab is internally connected to the collector terminal. Electrical isolation from the heatsink is mandatory using mica washers or ceramic insulators. The RθCS = 0.24°C/W rating assumes a flat, greased interface surface; silicone grease must be applied uniformly to avoid thermal hotspots.

Does the diode share the same thermal path as the IGBT die?

Yes - both dies are mounted on the same copper base in the TO-247AC package, sharing the 0.41°C/W IGBT RθJC and 1.7°C/W diode RθJC paths. Thermal design must account for combined power dissipation (IGBT + diode) when calculating junction temperature, especially in PFC where diode conduction dominates during AC zero-crossings.

IRGP35B60PDPBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
TO-247-3
Packaging:
Tube
Product Status:
Obsolete
IGBT Type:
NPT
Voltage - Collector Emitter Breakdown (Max):
600 V
Current - Collector (Ic) (Max):
60 A
Current - Collector Pulsed (Icm):
120 A
Vce(on) (Max) @ Vge, Ic:
2.55V @ 15V, 35A
Power - Max:
308 W
Switching Energy:
220µJ (on), 215µJ (off)
Input Type:
Standard
Gate Charge:
160 nC
Td (on/off) @ 25°C:
26ns/110ns
Test Condition:
390V, 22A, 3.3Ohm, 15V
Reverse Recovery Time (trr):
42 ns
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-247AC

IRGP35B60PDPBF FAQ

1.How can I place an order for IRGP35B60PDPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRGP35B60PDPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRGP35B60PDPBF reliable?

The price and inventory of IRGP35B60PDPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRGP35B60PDPBF is usually 5 days.

3.What payment methods are accepted for IRGP35B60PDPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRGP35B60PDPBF transactions.

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4.How is shipping managed for IRGP35B60PDPBF?

IRGP35B60PDPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRGP35B60PDPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRGP35B60PDPBF?

For technical support, including IRGP35B60PDPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRGP35B60PDPBF requirements.

6.How does Aetrix verify that IRGP35B60PDPBF is sourced from the original manufacturer or authorized distributors?

All IRGP35B60PDPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRGP35B60PDPBF meets industry standards.

7.What is the process for return or replacement of IRGP35B60PDPBF?

All IRGP35B60PDPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRGP35B60PDPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRGP35B60PDPBF part is unused and in its original packaging.

Return procedure for IRGP35B60PDPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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