Infineon Technologies IRGP6650DPBF
- Part No.:
- IRGP6650DPBF
- Manufacturer:
- Infineon Technologies
- Category:
- Single IGBTs
- Package:
- TO-247-3
- Datasheet:
-
IRGP6650DPBF.pdf
- Description:
- IGBT 600V 80A TO247AC
- Quantity:
- Payment:

- Shipping:

Inventory:12,315
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRGP6650DPBF from Infineon Technologies (formerly International Rectifier) is a 600 V, 80 A rated insulated gate bipolar transistor with integrated ultrafast soft-recovery diode in TO-247AC package. It delivers 1.65 V typical VCE(on) at 35 A/15 VGE/25°C, 5 µs short-circuit withstand capability, and square RBSOA up to 175°C junction temperature-designed for high-efficiency welding inverters and H-bridge DC-AC converters.
For engineers reviewing the IRGP6650DPBF datasheet, IRGP6650DPBF pinout, IRGP6650DPBF application, or IRGP6650DPBF equivalent, key selection criteria include clamped inductive load current (140 A), thermal resistance RθJC (0.49 °C/W for IGBT), reverse recovery energy (165 µJ at 175°C), and gate charge (75 nC), all critical for hard-switched industrial power stages.
Technical Context
This device integrates an IGBT and co-packaged ultrafast soft-recovery diode in a single TO-247AC housing, enabling compact full-bridge topologies without discrete diode placement. Its positive VCE(on) temperature coefficient ensures stable current sharing in parallel configurations.
The 5 µs short-circuit safe operating area (SCSOA) at 150°C case temperature and 400 V bus voltage supports robust overcurrent protection in welder primary-side switching. Square RBSOA up to 175°C and 140 A peak clamped inductive current confirm ruggedness under transient overload conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCES | 600 V - Withstands 80% of rating (480 V) in RBSOA testing; enables 400 V bus designs with margin. |
| IC @ TC = 100°C | 50 A - Continuous output current derated for thermal management in enclosed welder enclosures. |
| VCE(on) typ. | 1.65 V @ 35 A/15 VGE/25°C - Directly determines conduction loss (57.8 W at 35 A), critical for thermal design. |
| Etotal @ 175°C | 1570 µJ @ 35 A/400 V - Total switching loss defines minimum gate drive strength and heatsink sizing. |
| RθJC (IGBT) | 0.49 °C/W - Enables direct mounting to heatsink; sets maximum allowable case-to-ambient ΔT for 153 W dissipation. |
| tSC | 5 µs - Minimum guaranteed short-circuit withstand time before desaturation triggers protection circuitry. |
| Qg | 75 nC - Determines gate driver peak current requirement (≥7.5 A for 10 ns rise time). |
| Erec | 165 µJ @ 175°C - Diode reverse recovery energy directly adds to turn-off loss and EMI generation. |
Pinout & Package
IRGP6650DPBF uses the TO-247AC package: three-terminal through-hole outline with isolated tab (collector), standard lead pitch (5.4 mm), and 1.1 N·m mounting torque specification. The metal tab is electrically connected to the collector terminal.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Collector (Tab) | Main high-side power path | Electrically tied to metal tab; requires insulating washer when mounted to grounded heatsink. |
| Gate | Control input for IGBT channel | High-impedance MOS-controlled terminal; ±20 V absolute max rating prevents oxide damage. |
| Emitter | Power return and diode cathode | Shared emitter node for IGBT and anti-parallel diode; low-inductance layout essential for dI/dt stability. |
Key Features
| Feature | Design Value |
|---|---|
| Ultrafast soft-recovery diode | 165 µJ reverse recovery energy at 175°C enables low EMI and reduced snubber stress in hard-switched bridges. |
| Square RBSOA at 175°C | Supports 140 A clamped inductive current at 480 V, enabling reliable operation during motor stall or arc faults. |
| Positive VCE(on) tempco | Ensures inherent current balancing in parallel IGBT configurations without external ballasting resistors. |
| 5 µs short-circuit rating | Allows time for detection and shutdown in welder primary circuits where fault currents exceed 100 A. |
| Lead-free, RoHS-compliant | Meets environmental compliance for industrial equipment sold in EU, China, and North America markets. |
Applications
| Welding Inverter Primary Switch | H-Bridge Motor Drive |
|---|---|
|
Use Scenario: High-frequency DC-AC inversion in IGBT-based stick/TIG welders operating at 20–50 kHz with 400 V DC bus. IC Role / Device Role / Timing Role: Main switching element in full-bridge topology; handles 50 A RMS output with 140 A peak clamped inductive loads during arc ignition. Use Value: Low 1.65 V VCE(on) reduces conduction loss by ~12% vs. comparable 650 V devices, improving thermal margin in sealed enclosures. |
Use Scenario: Bidirectional DC motor control in industrial servo drives requiring regenerative braking and direction reversal. IC Role / Device Role / Timing Role: Half-bridge leg switch with integrated anti-parallel diode; conducts 35 A continuous while recovering 165 µJ per cycle during freewheeling. Use Value: Soft diode recovery minimizes voltage overshoot during commutation, reducing snubber size and system EMI filter cost. |
| Induction Heating Inverter | UPS Inverter Stage |
|
Use Scenario: Resonant tank switching in medium-frequency (20–100 kHz) induction heating systems with 300–600 V DC link. IC Role / Device Role / Timing Role: High-side switch in series-resonant half-bridge; sustains 5 µs short-circuit events during coil detuning faults. Use Value: Square RBSOA up to 175°C allows sustained operation at elevated case temperatures common in air-cooled induction cabinets. |
Use Scenario: Online double-conversion UPS output stage converting 400 V DC to 230 V AC at 50/60 Hz with active PFC front-end. IC Role / Device Role / Timing Role: Full-bridge inverter switch handling 35 A RMS load current; diode recovers 165 µJ during zero-voltage switching transitions. Use Value: 0.49 °C/W RθJC enables direct heatsink mounting without thermal interface pads, simplifying mechanical assembly and improving long-term reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current IGBT with integrated diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IXYS IXGN60N60C3 | 600 V/60 A; lower Qg (55 nC); higher VCE(on) (1.85 V typ.); TO-247AD package. | Limited to ≤60 A continuous; less suitable for 80 A welder primaries but better for space-constrained 40 A motor drives. | Select when gate drive power budget is tight and peak current demand is ≤60 A. |
| STMicroelectronics STGW40H65DFB | 650 V/40 A; faster tf (15 ns); lower Eoff (420 µJ); TO-247 long leads. | Optimized for high-frequency SMPS (100+ kHz); insufficient current rating for welding or high-torque motor drives. | Prefer for >100 kHz resonant converters where switching loss dominates over conduction loss. |
Compared with IXGN60N60C3 and STGW40H65DFB, IRGP6650DPBF uniquely balances 80 A current capacity, 5 µs short-circuit ruggedness, and integrated soft diode-making it the only choice among the three for 400 V, 50–100 kHz welding inverters requiring ≥70 A RMS output.
Availability
IRGP6650DPBF is available at Aetrix Electronics and suitable for welding inverters, H-bridge motor drives, induction heating systems, and UPS inverter stages requiring stable component supply across multi-year production cycles.
Supply support for IRGP6650DPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and energy applications.
This device belongs to Infineon's legacy High Voltage IGBT portfolio, originally developed by International Rectifier for rugged industrial switching applications demanding high current density, short-circuit robustness, and integrated diode performance.
FAQ
What is the maximum continuous collector current at 100°C case temperature?
The IRGP6650DPBF supports 50 A continuous collector current at TC = 100°C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limits of the TO-247AC package and internal chip design, not electrical degradation. Operation above this value risks exceeding 175°C junction temperature even with adequate heatsinking.
Does the integrated diode share the same thermal path as the IGBT die?
Yes-the diode and IGBT are co-packaged in a single TO-247AC housing with shared case-to-sink thermal interface. Thermal resistance RθJC is separately specified as 0.49 °C/W for the IGBT and 3.35 °C/W for the diode, confirming distinct but thermally coupled junctions. Both contribute to total power dissipation measured at the case.
Can IRGP6650DPBF be paralleled with identical units without external current-sharing components?
Yes-its positive VCE(on) temperature coefficient ensures automatic current balancing during steady-state conduction. However, matched gate drive loop inductance and layout symmetry are mandatory to prevent dynamic imbalance during switching transients, especially at high dI/dt (>1 kA/µs).
What is the recommended gate resistor value for 400 V, 35 A hard-switched operation at 175°C junction temperature?
Based on Figure 17 in the datasheet, a 10 Ω gate resistor achieves ~120 ns td(off) and ~60 ns tf at 175°C, balancing switching speed against Eoff (930 µJ) and voltage overshoot. Lower values (<5 Ω) increase EMI risk; higher values (>15 Ω) raise total switching loss beyond 1570 µJ, compromising thermal design.
IRGP6650DPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- TO-247-3
- Packaging:
- Bulk
- Product Status:
- Active
- IGBT Type:
- -
- Voltage - Collector Emitter Breakdown (Max):
- 600 V
- Current - Collector (Ic) (Max):
- 80 A
- Current - Collector Pulsed (Icm):
- 105 A
- Vce(on) (Max) @ Vge, Ic:
- 1.95V @ 15V, 35A
- Power - Max:
- 306 W
- Switching Energy:
- 300µJ (on), 630µJ (off)
- Input Type:
- Standard
- Gate Charge:
- 75 nC
- Td (on/off) @ 25°C:
- 40ns/105ns
- Test Condition:
- 400V, 35A, 10Ohm, 15V
- Reverse Recovery Time (trr):
- 50 ns
- Operating Temperature:
- -40°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247AC
IRGP6650DPBF FAQ
1.How can I place an order for IRGP6650DPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRGP6650DPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRGP6650DPBF reliable?
The price and inventory of IRGP6650DPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRGP6650DPBF is usually 5 days.
3.What payment methods are accepted for IRGP6650DPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRGP6650DPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRGP6650DPBF?
IRGP6650DPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRGP6650DPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRGP6650DPBF?
For technical support, including IRGP6650DPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRGP6650DPBF requirements.
6.How does Aetrix verify that IRGP6650DPBF is sourced from the original manufacturer or authorized distributors?
All IRGP6650DPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRGP6650DPBF meets industry standards.
7.What is the process for return or replacement of IRGP6650DPBF?
All IRGP6650DPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRGP6650DPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRGP6650DPBF part is unused and in its original packaging.
Return procedure for IRGP6650DPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRGP6650DPBF Tags
;;2.jpg)
-
STGD3NB60SDT4
STMicroelectronics

-
HGTD1N120BNS9A
onsemi

-
STGF7NB60SL
STMicroelectronics

-
FGD5T120SH
onsemi

-
STGB3NC120HDT4
STMicroelectronics

-
IKP20N60TXKSA1
Infineon Technologies

-
STGW30H60DFB
STMicroelectronics

-
STGB30M65DF2
STMicroelectronics

-
IKB20N60TATMA1
Infineon Technologies

-
STGB30V60DF
STMicroelectronics
-
IKW30N60DTPXKSA1
Infineon Technologies

-
ISL9V3040P3
onsemi
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

