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Infineon Technologies IRGPC30FD2

Part No.:
IRGPC30FD2
Manufacturer:
Infineon Technologies
Category:
Single IGBTs
Package:
TO-247-3
Datasheet:
AetrixIRGPC30FD2.pdf
Description:
IGBT W/DIODE 600V 31A TO-247AC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,554

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Product details

Overview

IRGPC30FD2 from Infineon Technologies is a co-packaged n-channel IGBT with integrated ultrafast soft-recovery HEXFRED™ diode in TO-247AC package, rated for 600 V VCES, 31 A continuous collector current at TC = 25°C, and 2.1 V VCE(sat) @ 15 V VGE, 17 A - optimized for 1–10 kHz motor control, UPS, and industrial power supplies.

For engineers reviewing the IRGPC30FD2 datasheet, IRGPC30FD2 pinout, IRGPC30FD2 application, or IRGPC30FD2 equivalent, key selection criteria include total switching loss (3.0–4.6 mJ), diode reverse recovery time (42–120 ns), junction-to-case thermal resistance (1.2 °C/W IGBT / 2.5 °C/W diode), and gate charge (27–30 nC) under 400 V bus conditions.

Technical Context

This device integrates a planar-gate IGBT and a soft-recovery diode in a single TO-247AC thermally optimized package, enabling reduced layout parasitics and simplified thermal management in high-current half-bridge configurations. Its gate threshold voltage (3.0–5.5 V) and negative temperature coefficient of VGE(th) (−11 mV/°C) support stable parallel operation across temperature.

Switching behavior is characterized by low tail current and controlled diode reverse recovery: trr = 42–120 ns, Qrr = 80–600 nC, and di(rec)M/dt up to 180 A/µs at 25°C - critical for minimizing voltage overshoot and EMI in hard-switched inverters.

Key Specifications

Parameter Value and Actual Design Meaning
VCES 600 V - maximum blocking voltage for 400 V DC-link applications with 50% safety margin
IC @ TC = 25°C 31 A - continuous current capability with heatsink at ambient-referenced case temperature
VCE(sat) ≤2.1 V @ 15 V VGE, 17 A - low conduction loss enabling <1.5 W static dissipation at rated current
Ets 3.0–4.6 mJ @ 480 V, 17 A - total switching energy including IGBT tail and diode recovery losses
trr 42–120 ns - soft reverse recovery time ensuring low dv/dt stress on adjacent devices
RθJC (IGBT) 1.2 °C/W - enables 83 W power dissipation before reaching 150°C junction limit at 25°C case
Qg 27–30 nC - determines gate driver peak current requirement (~1.3 A for 23 Ω RG, 15 V drive)

Pinout & Package

TO-247AC package with isolated mounting base; three-terminal configuration: Collector (tab), Gate (pin 1), Emitter (pin 2). Thermal path optimized via direct copper die attach to metal tab.

Pin/Terminal Circuit Role Design Meaning
Collector (Tab) Main high-side current path and thermal interface Electrically connected to heatsink; requires insulating washer if non-isolated mounting
Gate (Pin 1) Control terminal for IGBT turn-on/turn-off Low-impedance input requiring <30 nC charge; sensitive to ESD and overvoltage (>±20 V absolute max)
Emitter (Pin 2) Common reference for gate drive and load return path Carries full load current plus diode freewheeling current; must minimize stray inductance (<13 nH internal LE)

Key Features

Feature Design Value
Co-packaged HEXFRED™ diode Soft reverse recovery (trr ≤120 ns, Qrr ≤600 nC) reduces voltage spikes and EMI in inductive switching
Optimized for 1–10 kHz operation Switching loss profile balanced for motor drive PWM frequencies - avoids excessive tail loss at medium speed
Low RθJC (1.2 °C/W) Enables higher power density in compact heatsinks without forced air cooling
Integrated emitter inductance ≤13 nH Minimizes gate oscillation risk and improves turn-off controllability in high-di/dt circuits
Rated for clamped inductive loads (ILM = 120 A) Supports robust short-circuit withstand in motor phase-leg protection schemes

Applications

Industrial Motor Drives Uninterruptible Power Supplies (UPS)

Use Scenario: Three-phase inverter stage in 5–10 kW HVAC compressors and pump drives operating at 4–8 kHz PWM frequency.

IC Role / Device Role / Timing Role: High-side switch in half-bridge topology; handles 31 A RMS output current with soft diode commutation during regeneration.

Use Value: Low VCE(sat) and controlled trr reduce conduction + switching losses by ~18% versus standard fast diode IGBTs at 6 kHz.

Use Scenario: Output inverter stage in online double-conversion UPS systems delivering clean 50/60 Hz sine wave under battery backup.

IC Role / Device Role / Timing Role: Final power stage switch; conducts bidirectional current during line/battery transfer with zero-crossing synchronization.

Use Value: Co-packaged diode eliminates discrete anti-parallel diode placement error, reducing layout-induced shoot-through risk by >90%.

Welding Power Supplies Induction Heating Generators

Use Scenario: Primary-side inverter in IGBT-based inverter welders delivering pulsed 200–500 A DC output with 10–20 kHz burst modulation.

IC Role / Device Role / Timing Role: High-current switching element handling repetitive 120 A pulsed loads; diode recovers during inter-pulse freewheeling.

Use Value: 120 A ILM rating and 150°C TJ operation enable reliable 300% overload tolerance for arc ignition transients.

Use Scenario: Resonant half-bridge in 3–10 kW induction cooktops and industrial heating systems operating at 20–50 kHz.

IC Role / Device Role / Timing Role: Hard-switched resonant inverter switch; diode provides zero-voltage turn-on path via L-C tank ringback.

Use Value: Soft recovery minimizes diode reverse recovery energy (Erec ≤0.35 mJ), preventing thermal runaway at 40 kHz switching.

Equivalent & Alternatives

The following parts are listed as comparable options for similar IGBT + integrated diode applications.

Alternative Part Technical Difference Application Difference Selection Advice
IXYS IXGN30N60B3 600 V, 30 A, VCE(sat) = 2.2 V, trr = 55 ns, RθJC = 1.4 °C/W Higher VCE(sat) and thermal resistance; lower Qg (22 nC) Better for gate-drive-limited designs but requires larger heatsink for same power dissipation
STMicroelectronics STGP30NC60WD 600 V, 30 A, VCE(sat) = 2.0 V, trr = 35 ns, RθJC = 1.3 °C/W, TO-247 long leads Faster diode recovery but higher internal inductance due to leadframe geometry Preferred for EMI-sensitive resonant converters where trr <40 ns is mandatory

Compared with IXGN30N60B3 and STGP30NC60WD, IRGPC30FD2 offers the lowest total switching loss (3.0 mJ min) at 10 kHz and best thermal resistance (1.2 °C/W), making it optimal for space-constrained industrial inverters prioritizing efficiency over ultra-low EMI.

Availability

IRGPC30FD2 is available at Aetrix Electronics and suitable for industrial motor drives, uninterruptible power supplies, welding equipment, and induction heating generators requiring stable component supply and long-term production continuity.

Supply support for IRGPC30FD2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, automotive ICs, and security solutions, with global manufacturing and R&D centers.

This device belongs to Infineon's legacy "Fast CoPack" IGBT family, designed specifically for cost-sensitive, medium-frequency industrial inverters where integration, thermal performance, and soft switching reliability are prioritized over ultra-high-speed operation.

FAQ

What is the maximum recommended gate resistor value for reliable turn-off?

The datasheet specifies td(off) and tf increase significantly above RG = 23 Ω, with Eoff rising to 2.1 mJ at 23 Ω and exceeding 3.5 mJ at 100 Ω. For 480 V, 17 A operation, RG ≤ 33 Ω maintains Eoff <2.5 mJ and ensures safe SOA compliance per Fig. 12. Higher values risk overvoltage during inductive turn-off.

Can IRGPC30FD2 be used in parallel configurations?

Yes - its negative VGE(th) temperature coefficient (−11 mV/°C) and flat output characteristics (Fig. 2, 5) enable current sharing across multiple devices. Design requires matched gate drive impedance, symmetrical layout, and individual emitter resistors (0.1 Ω) to balance dynamic current distribution during switching transitions.

Is the integrated diode suitable for synchronous rectification?

No - the HEXFRED™ diode is optimized for freewheeling and clamping, not unidirectional forward conduction. Its VF = 1.4–1.7 V at 12 A is higher than Schottky or MOSFET synchronous rectifiers, and its reverse recovery behavior is not tailored for ZVS/ZCS synchronous topologies requiring near-zero Qrr.

What is the minimum gate drive voltage required for full saturation?

VGE(th) ranges from 3.0 to 5.5 V, but full saturation (VCE(sat) ≤2.1 V) requires VGE ≥15 V per Fig. 2 and Table. At 12 V, VCE(sat) rises to ~2.6 V at 17 A, increasing conduction loss by 30%. 15 V ±10% is the validated drive level for rated performance.

IRGPC30FD2 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
TO-247-3
Packaging:
Bag
Product Status:
Obsolete
IGBT Type:
-
Voltage - Collector Emitter Breakdown (Max):
600 V
Current - Collector (Ic) (Max):
31 A
Current - Collector Pulsed (Icm):
-
Vce(on) (Max) @ Vge, Ic:
2.1V @ 15V, 17A
Power - Max:
100 W
Switching Energy:
-
Input Type:
Standard
Gate Charge:
-
Td (on/off) @ 25°C:
-
Test Condition:
-
Reverse Recovery Time (trr):
-
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-247AC

IRGPC30FD2 FAQ

1.How can I place an order for IRGPC30FD2 through Aetrix?

Please submit a Request for Quotation (RFQ) for IRGPC30FD2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRGPC30FD2 reliable?

The price and inventory of IRGPC30FD2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRGPC30FD2 is usually 5 days.

3.What payment methods are accepted for IRGPC30FD2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRGPC30FD2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRGPC30FD2?

IRGPC30FD2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRGPC30FD2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRGPC30FD2?

For technical support, including IRGPC30FD2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRGPC30FD2 requirements.

6.How does Aetrix verify that IRGPC30FD2 is sourced from the original manufacturer or authorized distributors?

All IRGPC30FD2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRGPC30FD2 meets industry standards.

7.What is the process for return or replacement of IRGPC30FD2?

All IRGPC30FD2 units undergo pre-shipment inspection (PSI). If there is an issue with IRGPC30FD2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRGPC30FD2 part is unused and in its original packaging.

Return procedure for IRGPC30FD2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IRGPC30FD2 Tags

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