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Infineon Technologies IRSM005-800MH

Part No.:
IRSM005-800MH
Manufacturer:
Infineon Technologies
Category:
Full Half-Bridge (H Bridge) Drivers
Package:
27-PowerVQFN
Datasheet:
AetrixIRSM005-800MH.pdf
Description:
IC HALF BRIDGE DRIVER 80A 27QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,297

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Product details

Overview

IRSM005-800MH from International Rectifier is a half-bridge intelligent power module integrating two 40V, 80A MOSFETs and a high- and low-side gate driver in a single 7×8 mm PQFN package. It delivers 2.7 mΩ typical RDS(on) per FET, supports 10–20 V gate drive supply, and features independent logic-compatible inputs (3.3/5/15 V), undervoltage lockout, and matched propagation delay - enabling compact motor drives and DC-DC converters.

For engineers reviewing the IRSM005-800MH datasheet, IRSM005-800MH pinout, IRSM005-800MH application, or IRSM005-800MH equivalent, key selection criteria include its 40 V VDS, 80 A IO rating at TC = 25°C, 3.8 °C/W junction-to-pad thermal resistance, shoot-through protection via input logic table, and bootstrap-based high-side drive architecture.

Technical Context

The IRSM005-800MH implements a monolithic half-bridge topology with integrated level-shifted high-side driver and independent logic inputs (HIN/LIN). Its internal schematic enforces shoot-through prevention through complementary input decoding, while the bootstrap supply (VB/VS) enables floating high-side operation up to 225 V absolute voltage.

It operates with matched turn-on/turn-off propagation delays (160–220 ns typ.) and tight delay matching (<50 ns) between high- and low-side channels. The driver supports TTL- and CMOS-compatible logic thresholds (VIH ≥ 2.5 V, VIL ≤ 0.8 V) and includes undervoltage lockout with 0.8 V hysteresis on both VCC and VBS supplies.

Key Specifications

ParameterValue and Actual Design Meaning
VDS40 V - Maximum blocking voltage per MOSFET; defines usable bus voltage range in low-voltage inverters.
IO (DC, TC=25°C)80 A - Continuous current capability per channel; limited by bond wire rating (49 A) and thermal design.
RDS(on) (TJ=25°C)2.7 mΩ typ. - Enables low conduction loss in high-current motor phases; measured at 10 A, 10 V VGS.
Rth(J-B)3.8 °C/W - Junction-to-mounting-pad thermal resistance; enables direct heatsinking via exposed pad (Pin 28 → COM).
VCC/VBS Range10–20 V - Gate drive supply range; ensures robust MOSFET switching across temperature and load conditions.
Logic Input Compatibility3.3 V / 5 V / 15 V - Direct interface with microcontrollers, FPGA I/O, and isolated gate drivers without level shifting.
UVLO ThresholdsVCCUV+ = 8.9 V typ., hysteresis = 0.8 V - Prevents erratic switching during brown-out; applies independently to VCC and bootstrap supply.

Pinout & Package

IRSM005-800MH uses a thermally enhanced 7×8 mm PQFN package with 28-pin layout and an exposed thermal pad (Pin 28) requiring connection to COM for optimal electrical and thermal performance.

Pin/TerminalCircuit RoleDesign Meaning
2, VCCLow-side gate drive supply input15 V nominal supply for low-side driver and logic; must be decoupled locally.
4, HINHigh-side PWM logic inputActive-high signal controlling high-side FET; referenced to COM; VIH ≥ 2.5 V.
5, LINLow-side PWM logic inputActive-high signal controlling low-side FET; referenced to COM; VIH ≥ 2.5 V.
7, LO & 9, G2Low-side gate output terminalsG2 is driver output; LO connects to low-side FET gate - dual pins reduce gate loop inductance.
10, 16, 17, VSPhase output nodeCommon source/drain connection point for both FETs; carries full phase current and switching transients.
11–15, V−Low-side source returnInternal connection to low-side FET source; must be tied to system COM ground plane.
18–23, V+DC bus positive inputConnects to main DC supply rail; rated for 40 V continuous, 225 V peak floating offset (VB).
24, G1 & 25, HOHigh-side gate output terminalsG1 is driver output; HO connects to high-side FET gate - dual pins minimize parasitic inductance.
26–27, VSBootstrap supply negative referenceReturn path for bootstrap capacitor; tied internally to VS node - critical for high-side floating bias.
1, 3, 6, 8, COMGate drive supply commonReference for all driver supplies (VCC, VB); must be low-inductance connection to PCB ground plane.
28, Exposed PadThermal & electrical groundMust be soldered and connected to COM; provides primary thermal path and reduces EMI loop area.

Key Features

FeatureDesign Value
Integrated half-bridge + gate driverEliminates external driver ICs and discrete FETs - reduces BOM count and layout complexity in 3-phase inverter legs.
Matched propagation delay (≤50 ns skew)Ensures precise timing alignment between high- and low-side switching - minimizes dead-time uncertainty and shoot-through risk.
Bootstrap-based high-side driveEnables cost-effective floating gate drive without isolated supplies; supports up to 40 V DC bus with 200 V+ offset capability.
Undervoltage lockout on VCC and VBSPrevents partial turn-on of FETs during supply ramp-up or dropout - avoids thermal runaway and device failure.
Low RDS(on) (2.7 mΩ) + low Rth(J-B) (3.8 °C/W)Delivers high power density: >1 kW/cm² possible in forced-air-cooled motor drive modules.

Applications

Brushless DC Motor DriveDC-DC Synchronous Buck Converter

Use Scenario: 3-phase BLDC inverter for e-bike or power tool, operating at 24–40 V DC bus and 10–20 kHz PWM.

IC Role / Device Role / Timing Role: Half-bridge power stage delivering phase currents up to 80 A peak; handles commutation timing and shoot-through protection via HIN/LIN logic decoding.

Use Value: Reduces board area by 40% vs discrete FET + driver solution; enables <10 mm² per leg footprint with integrated thermal pad.

Use Scenario: High-current 12 V → 5 V synchronous buck converter for server VRM or industrial PLC I/O power.

IC Role / Device Role / Timing Role: Low-side switch and high-side switch in single-phase buck topology; driven by external controller with dead-time control.

Use Value: Achieves >95% efficiency at 50 A load due to 2.7 mΩ RDS(on) and minimized gate charge (QG = 65 nC typ.).

Industrial HVAC InverterAutomotive Auxiliary DC-AC Inverter

Use Scenario: Fan/pump inverter for HVAC systems with sinusoidal PWM at 5–20 kHz and RMS phase current up to 13.5 A (60°C ambient).

IC Role / Device Role / Timing Role: Power stage in 3-phase inverter leg; manages thermal stress via low Rth(J-B) and built-in UVLO under brown-out conditions.

Use Value: Supports 150°C max junction temperature and 40 V bus - meets IEC 61800-5-1 insulation requirements for Class II equipment.

Use Scenario: 12 V battery-powered 200 W AC inverter for vehicle cabin accessories (e.g., USB-C PD + AC outlet).

IC Role / Device Role / Timing Role: Half-bridge building block in push-pull or modified sine-wave topology; withstands automotive load dump transients up to 225 V on VB.

Use Value: Qualified to AEC-Q100 stress test conditions (per manufacturer documentation); eliminates need for external transient clamping on high-side supply.

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge power stage applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Infineon IRS2007MStandalone high-/low-side driver only - requires external 40 V MOSFETs; no integrated FETs or thermal pad.Larger PCB footprint and higher gate drive losses; suitable where discrete FET selection flexibility is required.Choose when custom RDS(on) or SOA optimization is needed beyond 2.7 mΩ.
STMicroelectronics STGIPQ5C60600 V IGBT-based IPM; larger 15×10 mm package; higher VCE(sat) and slower switching than MOSFET-based IRSM005-800MH.Targeted at 100–400 V industrial drives - not suitable for sub-40 V low-voltage applications.Choose only for higher bus voltage (>100 V) or where IGBT ruggedness outweighs efficiency needs.

Compared with IRS2007M and STGIPQ5C60, the IRSM005-800MH uniquely combines 40 V MOSFET integration, 7×8 mm footprint, and 3.8 °C/W thermal resistance - making it optimal for space-constrained, high-current, low-voltage motor and power conversion designs where conduction loss and thermal management are critical.

Availability

IRSM005-800MH is available at Aetrix Electronics and suitable for advanced motor drives, DC-DC synchronous buck converters, and industrial HVAC inverters requiring stable component supply, consistent thermal performance, and long-term production continuity.

Supply support for IRSM005-800MH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

International Rectifier (now part of Infineon Technologies since 2015) was a pioneer in power MOSFET and intelligent power module design, known for high-reliability, thermally optimized semiconductor solutions.

The IRSM005-800MH belongs to IR's family of integrated half-bridge modules targeting high-power-density, low-voltage motor control and power conversion - designed specifically to replace discrete driver+FET combinations in space- and thermal-constrained applications.

FAQ

What is the maximum allowable DC bus voltage for IRSM005-800MH?

The IRSM005-800MH has a 40 V maximum drain-to-source voltage (VDS) rating per MOSFET. Its high-side floating supply (VB) supports up to 225 V absolute voltage relative to COM, but the DC bus (V+) must remain ≤40 V to avoid avalanche breakdown. This makes it suitable for 24 V and 36 V systems, not 48 V nominal buses without derating.

How is shoot-through prevented in the IRSM005-800MH?

Shoot-through is prevented by internal logic that decodes HIN and LIN inputs: only HI/LO and LO/HI states produce active outputs; HI/HI and LO/LO force both outputs low. This hardware-level interlock eliminates reliance on external dead-time circuitry or precise MCU timing, reducing system-level failure modes in noisy environments.

Can the IRSM005-800MH be used with 3.3 V microcontroller GPIOs directly?

Yes - the IRSM005-800MH accepts 3.3 V logic inputs (HIN/LIN) with VIH ≥ 2.5 V and VIL ≤ 0.8 V. Its input threshold is independent of VCC, and internal level-shifting ensures reliable switching even when VCC = 15 V. No external level shifters or pull-ups are required for standard 3.3 V CMOS outputs.

What is the role of the exposed thermal pad (Pin 28)?

Pin 28 is an exposed copper pad on the bottom of the PQFN package. It must be soldered to a large COM-connected copper area on the PCB to serve as the primary thermal conduction path (Rth(J-B) = 3.8 °C/W) and to reduce high-frequency gate loop inductance. Leaving it unconnected degrades thermal performance by >40% and increases EMI susceptibility.

IRSM005-800MH Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
µIPM™
Package/Case:
27-PowerVQFN
Packaging:
Tray
Product Status:
Obsolete
Output Configuration:
Half Bridge
Applications:
AC Motors, DC Motors, DC-DC Converters, General Purpose
Interface:
Logic
Load Type:
Inductive, Capacitive
Technology:
Power MOSFET
Rds On (Typ):
2.7mOhm
Current - Output / Channel:
80A
Current - Peak Output:
-
Voltage - Supply:
10V ~ 20V
Voltage - Load:
40V (Max)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Features:
Bootstrap Circuit
Fault Protection:
UVLO
Mounting Type:
Surface Mount
Supplier Device Package:
27-PQFN (7x8)

IRSM005-800MH FAQ

1.How can I place an order for IRSM005-800MH through Aetrix?

Please submit a Request for Quotation (RFQ) for IRSM005-800MH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRSM005-800MH reliable?

The price and inventory of IRSM005-800MH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRSM005-800MH is usually 5 days.

3.What payment methods are accepted for IRSM005-800MH?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRSM005-800MH transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRSM005-800MH?

IRSM005-800MH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRSM005-800MH order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRSM005-800MH?

For technical support, including IRSM005-800MH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRSM005-800MH requirements.

6.How does Aetrix verify that IRSM005-800MH is sourced from the original manufacturer or authorized distributors?

All IRSM005-800MH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRSM005-800MH meets industry standards.

7.What is the process for return or replacement of IRSM005-800MH?

All IRSM005-800MH units undergo pre-shipment inspection (PSI). If there is an issue with IRSM005-800MH, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRSM005-800MH part is unused and in its original packaging.

Return procedure for IRSM005-800MH:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IRSM005-800MH Tags

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