Infineon Technologies IRSM506-076PA

Overview

IRSM506-076PA from Infineon Technologies is a 600V, 4A 3-phase integrated power module (IPM) for small-appliance motor drives, featuring trench IGBTs with 1.7V max V_CE(sat) at 25°C/1A, integrated high-voltage gate drivers, and NTC-based temperature feedback. It supports open-emitter shunt current sensing and operates with 3.3V logic inputs in energy-efficient fan and pump applications.

For engineers reviewing the IRSM506-076PA datasheet, IRSM506-076PA pinout, IRSM506-076PA application, or IRSM506-076PA equivalent, key selection criteria include its 1900V_RMS isolation rating, matched propagation delay across all six channels, dV/dt-optimized EMI performance, and DIP23 package compatibility with industrial motor control PCB layouts.

Technical Context

This IPM integrates three half-bridge HVICs with independent floating high-side supplies (VB1–VB3), low-side logic supplies (VCC1–VCC3), and dedicated input pins (HIN/LIN per phase). Its internal architecture enables simultaneous PWM control of U/V/W phases while maintaining shoot-through protection via advanced input filtering and 400ns built-in deadtime.

The module implements under-voltage lockout on both VCC and VB rails (10.9V typical threshold), supports ±20V high-side offset tolerance (VS1–VS3), and delivers thermal monitoring via an integrated 47kΩ NTC thermistor (R₂₅) with B=4050K, accessible at pin 11 (VTH).

Key Specifications

Pinout & Package

DIP23 package: 23-pin dual-in-line, 1900V_RMS isolation, creepage ≥5.0mm, suitable for through-hole mounting in space-constrained appliance PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-phase inverter applications.

Compared with IRSM516-076PA, the IRSM506-076PA adds integrated thermal monitoring without altering footprint or drive capability; versus FAN7382MX, it delivers full power integration at the expense of flexibility in device selection and thermal path design.

Availability

IRSM506-076PA is available at Aetrix Electronics and suitable for energy-efficient ceiling fans, smart HVAC blowers, and compact water pumps requiring stable component supply and long-lifecycle support.

Supply support for IRSM506-076PA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with headquarters in Munich, Germany.

The IRSM506-076PA belongs to Infineon's µIPM™-DIP family, engineered specifically for cost-sensitive, space-constrained small-appliance motor drives requiring integrated protection, thermal feedback, and high-voltage isolation.

FAQ

What is the maximum continuous output current rating for IRSM506-076PA?

The IRSM506-076PA is rated for 4.0A DC output current per IGBT at TC = 25°C, with pulsed current capability up to 15A (100µs single pulse). Derating is required above 25°C case temperature per the R_th(J-C) = 7.2°C/W specification for the high-side V-phase IGBT.

How does the VTH pin function and what circuitry is needed to use it?

VTH provides access to an internal 47kΩ NTC thermistor (±5% at 25°C, B=4050K). A simple voltage divider with a fixed resistor to VCC and ADC measurement at VTH yields temperature readings; application note AN-1157 details calibration and linearization methods for accurate junction temperature estimation.

Can IRSM506-076PA operate with a 12V logic supply instead of 15V?

Yes - the VCC supply range is specified from 13.5V to 16.5V, so 12V is below minimum operating voltage. Using 12V risks unreliable UVLO behavior and insufficient gate drive strength; a regulated 15V supply is mandatory for full-spec operation and robust noise immunity.

What is the purpose of the NC pins (6 and 16) and how should they be handled on the PCB?

Pins 6 and 16 are not internally bonded and serve no electrical function. They must remain unconnected on the PCB - neither routed nor soldered - to avoid mechanical stress or unintended coupling. No copper pour or trace should contact these pads per Infineon's mechanical drawing A0123-412W.