Infineon Technologies IRSM836-015MA

Overview

IRSM836-015MA from Infineon Technologies (formerly International Rectifier) is a 3-phase, 500V, 1A integrated power module (IPM) with integrated gate drivers, bootstrap diodes, and protection circuitry for brushless DC motor control in compact appliances. It features 4.8Ω R_DS(on) Trench FREDFETs, 1500V_RMS isolation, and operates up to 40W without heatsink in fan/pump drives.

For engineers reviewing the IRSM836-015MA datasheet, IRSM836-015MA pinout, IRSM836-015MA application, or IRSM836-015MA equivalent, key selection criteria include its 12×12 mm PQFN package, 3.3V Schmitt-triggered logic inputs, matched 1–1.5 µs propagation delay across all six channels, and integrated ITRIP-based overcurrent protection with 100–330 ns blanking time.

Technical Context

This IPM integrates three high-side and three low-side Trench FREDFETs with a monolithic 3-phase high-voltage driver IC. Its architecture supports 3.3V logic-level PWM inputs, cross-conduction prevention, and open-source shunt sensing on all legs - enabling precise current monitoring in sensorless BLDC commutation schemes.

The module delivers fail-safe operation via under-voltage lockout on both V_CC and V_BS rails (8.2–9.8 V thresholds), fault reporting through open-drain FLT pin, and thermal shutdown at 150°C junction temperature. Its 3.8°C/W junction-to-case (bottom) thermal resistance enables conduction-cooled operation in space-constrained designs.

Key Specifications

Pinout & Package

IRSM836-015MA uses a 36-lead PQFN package (12 × 12 mm, 0.65 mm pitch) with exposed thermal pad on bottom side for direct PCB heat transfer. The package provides galvanic isolation between power and logic domains.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-phase BLDC motor driver applications.

Compared with STSPIN32F0B and FAN9612, IRSM836-015MA offers the smallest total solution size and fastest time-to-market for ≤1 A, 40 W appliance motors - trading programmability and scalability for integration density and protection completeness.

Availability

IRSM836-015MA is available at Aetrix Electronics and suitable for energy-efficient ceiling fans, compact water pumps, smart ventilation systems, and portable air purifiers requiring stable component supply and long-term production continuity.

Supply support for IRSM836-015MA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with deep expertise in high-voltage integration and motor control.

This device belongs to Infineon's IRSM family of integrated power modules, designed specifically for cost-sensitive, space-constrained BLDC motor drives in white goods and consumer appliances.

FAQ

What is the maximum continuous motor power supported by IRSM836-015MA without a heatsink?

IRSM836-015MA supports up to 40 W continuous motor output without heatsink under typical ambient conditions (T_A ≤ 60°C) and proper PCB copper area (≥20 cm² 2 oz Cu on bottom layer). This is validated per datasheet Figure 5 and thermal characterization at T_J = 125°C with R_th(J-CB) = 3.8°C/W.

How does the ITRIP overcurrent protection function, and what external components are required?

ITRIP is an analog input with 0.46 V typical threshold that monitors shunt resistor voltage. No external comparator is needed - the module internally compares ITRIP voltage and triggers FLT after 100–330 ns blanking. Only a single low-inductance shunt (e.g., 0.1 Ω) between COM and GND is required; no filtering or amplification is necessary.

Can IRSM836-015MA be used with 3.3 V microcontrollers directly, and what logic interface protections are included?

Yes - all HIN/LIN/EN/ITRIP inputs accept 3.3 V logic levels with Schmitt-triggered inputs and integrated ESD protection (Class 2 HBM, Class B MM). Input thresholds are 2.5 V (rising) and 0.8 V (falling), ensuring robust noise immunity. No level-shifting or series resistors are required for standard MCU GPIO connections.

What is the recommended PCB layout practice for thermal management of the PQFN package?

Use ≥8 thermal vias (0.3 mm diameter, 0.6 mm pitch) under the exposed thermal pad, connected to a solid 2 oz internal copper plane. Route high-current traces (V+, U/V/W, COM) with ≥0.5 mm width and avoid splitting the bottom-layer ground plane. Maintain ≥0.5 mm clearance from V+ to logic traces to prevent coupling.