Renesas ISL55110IRZ
- Part No.:
- ISL55110IRZ
- Manufacturer:
- Renesas
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 16-TFQFN Exposed Pad
- Datasheet:
-
ISL55110IRZ.pdf
- Description:
- IC HALF BRIDGE DRVR 100MA 16QFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
ISL55110IRZ from Renesas Electronics is a dual high-speed in-phase MOSFET driver IC designed for accurate pulse generation and buffering in precision timing-critical systems. It delivers 3.5A peak output current, 1.5ns rise/fall times into 100pF, and 6ns minimum pulse width, with independent IN-A/IN-B inputs driving OA/OB outputs synchronously to VH rail (5V–13.2V) - deployed in ultrasound transmit stages and CCD horizontal drive circuits.
For engineers reviewing the ISL55110IRZ datasheet, ISL55110IRZ pinout, ISL55110IRZ application, or ISL55110IRZ equivalent, this page provides verified package mapping (16-lead QFN), confirmed in-phase dual-driver functionality, thermal resistance (θJA = 45°C/W), power-down mode timing (650ns wake-up), and logic compatibility with both 3.3V and 5V input families.
Technical Context
The ISL55110IRZ integrates two matched CMOS output stages with tightly controlled input thresholds (VIX_LH = 1.42V typ, VIX_HL = 1.22V typ) to minimize pulse-width distortion from input slew rate. Its dual in-phase architecture enables synchronous high-side switching across capacitive loads up to 680pF while maintaining <0.5ns channel-to-channel skew.
It operates with separate logic (VDD = 2.7–5.5V) and driver (VH = 5–13.2V) rails, features an ENABLE pin (QFN only) for high-speed tri-state control, and includes a dedicated PD pin for low-power standby (12µA IDD-PDN). The exposed thermal pad (EP) is electrically tied to GND (Pin 11) and requires PCB grounding per thermal layout guidelines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Drive Strength | 3.5A peak current supports fast charging of 330pF loads to 12V with sub-3ns rise time over full temperature range. |
| Rise/Fall Time | 1.2ns/1.4ns (typ) into 100pF load - enables >70MHz operation with minimal signal distortion. |
| Minimum Pulse Width | 6ns guaranteed - critical for high-resolution ultrasound burst generation and CCD pixel clocking. |
| Logic Compatibility | 3.3V and 5V CMOS/TTL input thresholds with 0.2V hysteresis - ensures noise immunity and deterministic switching. |
| Driver Output Swing | 3V to 13.2V referenced to GND - accommodates wide-range HV biasing for piezoelectric transducers and CCD drivers. |
| Power-down Current | 12µA logic supply current (IDD-PDN) - reduces system standby power in portable medical imaging devices. |
| Thermal Resistance | θJA = 45°C/W (16-lead QFN) - enables sustained 50MHz dual-channel operation without external heatsink under typical PCB layout. |
Pinout & Package
ISL55110IRZ is housed in a RoHS-compliant 16-lead 4mm × 4mm Exposed Pad QFN package (PKG DWG L16.4x4A), with thermal pad (EP) electrically connected to GND (Pin 11) and requiring solder mask-defined thermal land pattern per Renesas TB379 guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Pin 1) | Logic supply input | Powers internal input buffer and control logic; accepts 2.7V–5.5V; must be decoupled with 0.1µF + 4.7µF near package. |
| VH (Pin 10) | Driver high-rail supply | Sets output swing ceiling (5V–13.2V); supplies peak current to OA/OB; requires low-inductance bypassing. |
| GND (Pin 11) | Common return | Reference for both VDD and VH; connects to EP; must use dedicated low-impedance ground plane to minimize skew. |
| PD (Pin 3) | Power-down enable | Active-high control: places outputs in high-impedance state and reduces quiescent current to 12µA (logic) / 2.5µA (driver). |
| ENABLE (Pin 2) | Output tri-state control | QFN-only pin; low = normal operation, high = OA/OB forced to high-Z regardless of IN-A/IN-B state. |
| IN-A (Pin 5) | Channel A logic input | Non-inverting control for OA output; compatible with 3.3V/5V logic; rise/fall time ≤2ns recommended. |
| IN-B (Pin 4) | Channel B logic input | Non-inverting control for OB output (in-phase with IN-A); independent timing allows external phasing. |
| OA (Pin 9) | Driver output A | Swings between GND and VH; rDS(on) = 3Ω typ at VH=12V; drives resistive/capacitive loads directly. |
| OB (Pin 12) | Driver output B | Swings between GND and VH; matched to OA for <0.5ns skew; supports synchronous dual-MOSFET gate drive. |
Key Features
| Feature | Design Value |
|---|---|
| In-phase dual-output architecture | Enables synchronized high-side switching for push-pull or parallel MOSFET configurations without external inversion logic. |
| Sub-2ns switching into 100pF | Meets stringent timing requirements in ultrasound beamforming and high-speed CCD line drivers where jitter <100ps is critical. |
| Tightly controlled input thresholds | VIX_LH/VIX_HL = 1.42V/1.22V (typ) minimizes pulse-width variation caused by slow input edges - essential for precise burst timing. |
| Dual-rail operation (VDD + VH) | Decouples logic integrity from high-voltage drive capability, allowing 3.3V microcontroller interfacing with 12V load switching. |
| Integrated power-down and ENABLE | Reduces system-level power consumption during idle cycles (e.g., ultrasound receive phase) and enables dynamic output gating. |
Applications
| Ultrasound Transmit Driver | CCD Horizontal Shift Register Driver |
|---|---|
|
Use Scenario: Driving high-voltage MOSFETs in pulsed ultrasound transducer arrays for medical imaging. IC Role / Device Role / Timing Role: Dual in-phase gate driver delivering synchronized 12V pulses with <6ns width and <0.5ns inter-channel skew. Use Value: Enables precise beam steering and harmonic imaging by eliminating timing mismatch between adjacent channel drivers. |
Use Scenario: Clocking horizontal shift registers in large-format CCD image sensors used in industrial inspection cameras. IC Role / Device Role / Timing Role: High-current, low-skew clock buffer generating clean 10–50MHz clocks to charge/discharge 330pF+ line capacitance. Use Value: Maintains pixel timing accuracy across multi-kilopixel arrays, preventing horizontal smear and positional error. |
| High-Speed Clock Distribution | Piezoelectric Distance Sensor Driver |
|
Use Scenario: Distributing low-jitter clock signals to memory buffers or ADC sampling circuits in test equipment. IC Role / Device Role / Timing Role: Dual in-phase buffer amplifying and level-shifting clock signals from FPGA I/O to 12V swing for downstream logic. Use Value: Preserves edge integrity and minimizes additive jitter (<0.5ns skew) when fanning out to multiple high-capacitance loads. |
Use Scenario: Exciting piezoelectric elements in ultrasonic distance measurement modules for robotics and automation. IC Role / Device Role / Timing Role: Generating short, high-amplitude voltage pulses (5–12V, 6–100ns) to trigger mechanical resonance. Use Value: Delivers consistent pulse energy and timing repeatability for sub-millimeter ranging accuracy in noisy environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual high-speed MOSFET driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL55111IRZ | Anti-phase output configuration (IN-B inverted); identical pinout, specs, and package. | Required for complementary push-pull topologies (e.g., half-bridge gate drive) instead of parallel/in-phase switching. | Select ISL55111IRZ when cross-coupled or complementary timing is needed; ISL55110IRZ remains optimal for synchronized dual-channel drive. |
| LM5112MG/NOPB | Single-channel, higher 5A peak current, no PD/ENABLE pins; 8-pin SOIC package (θJA = 115°C/W). | Lacks dual-channel integration and power management features; suited for discrete high-current single-load applications. | Choose LM5112MG/NOPB only if single-output capability suffices and thermal budget allows higher junction temperature rise. |
Compared with ISL55111IRZ, the ISL55110IRZ provides true in-phase operation essential for parallel MOSFET drive, while LM5112MG/NOPB trades integration and thermal efficiency for raw current headroom in non-dual applications.
Availability
ISL55110IRZ is available at Aetrix Electronics and suitable for ultrasound imaging systems, CCD-based machine vision platforms, and high-speed clock distribution networks requiring stable component supply, long-term lifecycle support, and traceable RoHS-compliant sourcing.
Supply support for ISL55110IRZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog power, and mixed-signal solutions for automotive, industrial, and healthcare markets.
The ISL55110IRZ belongs to Renesas' high-speed driver product line, engineered specifically for precision pulse generation in medical ultrasound, scientific imaging, and industrial sensing applications demanding sub-nanosecond timing fidelity.
FAQ
What is the function of the ENABLE pin on the ISL55110IRZ?
The ENABLE pin (Pin 2) is exclusive to the QFN package and provides high-speed tri-state control of both OA and OB outputs. When ENABLE is low, the ISL55110IRZ operates normally with outputs driven by IN-A/IN-B. When ENABLE is high, OA and OB enter high-impedance state regardless of input states - enabling dynamic bus isolation in multi-driver systems without altering input logic.
Does the ISL55110IRZ support 3.3V logic inputs?
Yes, the ISL55110IRZ supports 3.3V logic inputs natively. Its input thresholds (VIX_LH = 1.42V typ, VIX_HL = 1.22V typ) and hysteresis (0.2V) ensure robust switching with 3.3V CMOS/TTL signals across -40°C to +85°C, and its VDD range (2.7V–5.5V) accommodates direct connection to 3.3V supply rails.
What is the maximum allowable VH supply voltage for the ISL55110IRZ?
The absolute maximum VH supply voltage for the ISL55110IRZ is 14.0V, but the recommended operating range is 5V to 13.2V per the datasheet. Operation at 13.2V enables full 12V output swing (VOH–VOL = 12V) into 100pF loads while maintaining 1.5ns rise/fall times and staying within safe thermal limits when using the 4×4mm QFN package with proper PCB thermal design.
How does the power-down (PD) feature affect ISL55110IRZ operation?
Asserting PD high places the ISL55110IRZ into power-down mode, reducing logic supply current to 12µA (IDD-PDN) and driver supply current to 2.5µA (IH_PDN). Both OA and OB go high-impedance, and internal circuitry enters low-power state - ideal for ultrasound systems during receive phases or portable devices in standby, with 650ns wake-up time to full operation.
Can the ISL55110IRZ drive a 680pF load at 50MHz?
Yes, the ISL55110IRZ can drive a 680pF load at 50MHz with verified performance: propagation delay spread remains <0.5ns (tSkewR/tSkewF), and rise/fall times are 14.5ns/14.1ns (typ) under those conditions. However, power dissipation increases significantly - users must calculate junction temperature using θJA = 45°C/W and Equation 1 from the datasheet to ensure TJ ≤ +150°C.
ISL55110IRZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 16-TFQFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Output Configuration:
- Half Bridge (2)
- Applications:
- Digital Imaging
- Interface:
- Logic
- Load Type:
- Capacitive and Resistive
- Technology:
- Power MOSFET
- Rds On (Typ):
- 3Ohm
- Current - Output / Channel:
- 100mA
- Current - Peak Output:
- 3.5A
- Voltage - Supply:
- 2.7V ~ 5.5V
- Voltage - Load:
- 5V ~ 13.2V
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Fault Protection:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-QFN (4x4)
ISL55110IRZ FAQ
1.How can I place an order for ISL55110IRZ through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL55110IRZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL55110IRZ reliable?
The price and inventory of ISL55110IRZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL55110IRZ is usually 5 days.
3.What payment methods are accepted for ISL55110IRZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL55110IRZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL55110IRZ?
ISL55110IRZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL55110IRZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL55110IRZ?
For technical support, including ISL55110IRZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL55110IRZ requirements.
6.How does Aetrix verify that ISL55110IRZ is sourced from the original manufacturer or authorized distributors?
All ISL55110IRZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL55110IRZ meets industry standards.
7.What is the process for return or replacement of ISL55110IRZ?
All ISL55110IRZ units undergo pre-shipment inspection (PSI). If there is an issue with ISL55110IRZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL55110IRZ part is unused and in its original packaging.
Return procedure for ISL55110IRZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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