Renesas ISL55111IVZ-T
- Part No.:
- ISL55111IVZ-T
- Manufacturer:
- Renesas
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 8-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
ISL55111IVZ-T.pdf
- Description:
- IC HALF BRIDGE DRVR 100MA 8TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,000
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Product details
Overview
ISL55111IVZ-T from Renesas Electronics is a dual high-speed anti-phase MOSFET driver optimized for precise pulse generation and buffering in time-critical imaging and sensing systems. It delivers 3.5A peak output current, 1.5ns rise/fall times (100pF), <0.5ns channel-to-channel skew, and operates with 5V–13.2V driver rail (VH) and 2.7V–5.5V logic supply (VDD). It is used in CCD array horizontal drivers where low skew and fast edge fidelity preserve pixel timing integrity.
For engineers reviewing the ISL55111IVZ-T datasheet, ISL55111IVZ-T pinout, ISL55111IVZ-T application, or ISL55111IVZ-T equivalent, key selection criteria include anti-phase output configuration, 8-pin TSSOP package thermal performance (θJA = 140°C/W), power-down mode (12µA IDD-PDN), and compatibility with 3.3V/5V logic families without level-shifting circuitry.
Technical Context
The ISL55111IVZ-T implements two independent CMOS output stages with tightly controlled input thresholds (VIX_LH = 1.42V typ, VIX_HL = 1.22V typ) to minimize input rise-time sensitivity on output pulse width. Its anti-phase architecture ensures complementary drive signals for push-pull or differential load configurations without external inversion logic.
Each channel features low-impedance sourcing/sinking (rDS = 3–6Ω), rail-to-rail swing (within 30mV of VH/GND), and supports loads up to 680pF while maintaining sub-15ns propagation delay (tpdR = 14.5ns max at 680pF). Power-down (PD) and - in QFN variants only - ENABLE control provide flexible system-level power management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Configuration | Anti-phase dual driver: IN-B inverted relative to IN-A, enabling true complementary signal generation without external inverters. |
| Peak Output Current | 3.5A - sufficient to rapidly charge/discharge 330pF loads to 12V within <3.0ns rise time across full temperature range. |
| Rise/Fall Time | 1.2ns/1.4ns (100pF) - enables >70MHz operation with minimal edge distortion in high-frequency clock or pulse applications. |
| Channel Skew | <0.5ns - critical for synchronized driving of large CCD arrays where inter-pixel timing errors must be sub-nanosecond. |
| Logic Compatibility | 3.3V and 5V CMOS/TTL - eliminates need for level translators when interfacing with FPGA I/O banks or microcontroller GPIOs. |
| Power-down Current | 12µA (IDD-PDN) - reduces standby power in portable ultrasound or battery-powered piezoelectric sensors. |
| Operating Temperature | −40°C to +85°C - validated for industrial and medical equipment deployed in uncontrolled ambient environments. |
Pinout & Package
The ISL55111IVZ-T is housed in an 8-lead TSSOP package (M8.173) with exposed pad not present; thermal dissipation relies on PCB copper area under leads. GND (Pin 8) serves as common return for both VH and VDD supplies.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | VDD | Logic supply input (2.7V–5.5V); powers internal buffers and control logic; requires local 0.1µF + 4.7µF bypassing. |
| 2 | PD | Active-high power-down enable; places outputs in high-impedance state and reduces quiescent current to 12µA. |
| 3 | IN-B | Inverting logic input; drives OB output with 180° phase shift relative to IN-A - defines anti-phase behavior of ISL55111. |
| 4 | IN-A | Non-inverting logic input; directly controls OA output state (high/low) without inversion. |
| 5 | OB | Driver output referenced to GND; swings rail-to-rail (GND to VH) with 3.5A peak capability and <6ns min pulse width. |
| 6 | VH | High-side driver supply (5V–13.2V); sets output voltage swing ceiling; requires robust local decoupling due to high di/dt. |
| 7 | OA | Driver output referenced to GND; mirrors IN-A with no inversion; matched propagation delay and skew to OB. |
| 8 | GND | Common ground reference for VH, VDD, and all outputs; must be low-inductance connection to minimize skew and ringing. |
Key Features
| Feature | Design Value |
|---|---|
| Anti-phase output topology | Eliminates external inverter components in push-pull gate drive circuits, reducing BOM count and layout area in CCD horizontal shift register designs. |
| Tightly controlled input thresholds | VIX_LH/VIX_HL hysteresis (0.2V) ensures consistent pulse width across varying input slew rates - essential for accurate time-of-flight distance sensing. |
| Low-output impedance (3–6Ω) | Minimizes IR drop under 3.5A peak load, preserving voltage margin at the MOSFET gate during fast switching transitions. |
| Sub-15ns propagation delay (680pF) | Supports high-resolution CCD readout at >10MHz pixel rates without inter-line timing jitter accumulation. |
| RoHS-compliant TSSOP package | M8.173 footprint enables automated assembly and reflow compatibility with standard SnPb and Pb-free processes per J-STD-020 MSL Level 1. |
Applications
| Ultrasound Transmit Beamformer | CCD Array Horizontal Driver |
|---|---|
Use Scenario: Driving high-voltage MOSFETs in multi-element ultrasound transducer arrays to generate precisely timed acoustic pulses. IC Role / Device Role / Timing Role: Dual anti-phase driver delivering synchronized, high-current gate pulses to transmit/receive switch FETs with <0.5ns skew between channels. Use Value: Enables sub-microsecond inter-element firing delays required for dynamic beam steering and focusing without timing-induced image artifacts. | Use Scenario: Controlling horizontal shift register clocks in large-format scientific CCD imagers used in astronomy or microscopy. IC Role / Device Role / Timing Role: Anti-phase driver generating complementary clock edges to advance pixel data across parallel CCD registers with minimal skew-induced smearing. Use Value: Maintains pixel alignment accuracy across >4k-pixel arrays by ensuring <0.5ns inter-channel timing consistency at 10–20MHz clock rates. |
| Piezoelectric Distance Sensor | Clock Distribution for Memory Arrays |
Use Scenario: Exciting piezoelectric transducers in industrial proximity sensors or automotive parking assist modules. IC Role / Device Role / Timing Role: High-speed dual driver producing clean, high-amplitude bipolar excitation pulses with fast edge rates to maximize transducer bandwidth. Use Value: Achieves 1mm resolution in time-of-flight measurements by supporting <6ns minimum pulse width and <1.5ns edge fidelity. | Use Scenario: Distributing low-skew clock signals to DDR SDRAM or SRAM banks on high-performance microprocessor carrier boards. IC Role / Device Role / Timing Role: Dual buffer amplifying and splitting clock signals while maintaining tight inter-channel alignment for synchronous memory access. Use Value: Prevents setup/hold violations in 100+ MHz memory interfaces by limiting skew to <0.5ns across clock distribution paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual high-speed MOSFET driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL55111IRZ-T | 16-lead QFN package (L16.4x4A) with exposed thermal pad; θJA = 45°C/W vs. TSSOP's 140°C/W; includes ENABLE pin not present in TSSOP. | Better thermal performance for continuous high-frequency operation (>50MHz); ENABLE allows dynamic output tri-state control not available in ISL55111IVZ-T. | Select ISL55111IRZ-T when board space permits QFN and thermal headroom is constrained; avoid if legacy TSSOP footprint or cost-sensitive volume production is required. |
| LM5112MMX/NOPB | Single-channel 5A driver (vs. dual 3.5A); no built-in anti-phase logic; requires external inverter for complementary outputs; wider VDD range (4.5–14V). | Higher per-channel current but lacks integrated anti-phase functionality; suited for discrete half-bridge gate drive rather than CCD/ultrasound timing-critical dual outputs. | Choose LM5112MMX/NOPB only when single-channel high-current drive dominates design requirements and anti-phase coordination is handled externally. |
Compared with ISL55111IVZ-T, the ISL55111IRZ-T offers superior thermal management and dynamic enable control but requires PCB redesign, while the LM5112MMX/NOPB provides higher per-channel current at the cost of added complexity for anti-phase operation - making ISL55111IVZ-T optimal for space-constrained, timing-critical dual-output applications where thermal load is moderate.
Availability
ISL55111IVZ-T is available at Aetrix Electronics and suitable for ultrasound imaging systems, scientific CCD cameras, industrial piezoelectric sensors, and high-speed memory clock distribution requiring stable component supply across extended production lifecycles.
Supply support for ISL55111IVZ-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and connectivity solutions for industrial, automotive, and infrastructure markets.
The ISL55111IVZ-T belongs to Renesas' high-speed interface and driver product line, engineered specifically for precision timing-critical applications such as medical ultrasound, scientific imaging, and industrial sensing where nanosecond-level skew and edge fidelity are non-negotiable.
FAQ
What is the anti-phase functionality of the ISL55111IVZ-T and how does it differ from the ISL55110?
The ISL55111IVZ-T features an inverted IN-B input, causing OB to toggle opposite to IN-A - producing true complementary outputs without external logic. In contrast, the ISL55110 has non-inverted IN-B, yielding in-phase outputs. This distinction makes ISL55111IVZ-T ideal for push-pull gate drive and differential clocking, while ISL55110 suits parallel signal buffering. Both share identical pinout, timing, and drive specs in the 8-lead TSSOP package.
Does the ISL55111IVZ-T support 3.3V logic inputs when powered by a 5V VDD supply?
Yes, the ISL55111IVZ-T supports 3.3V logic inputs with VDD = 5V. Its input thresholds (VIX_LH = 1.42V typ, VIX_HL = 1.22V typ) and hysteresis (0.2V) ensure reliable switching across the full 2.7V–5.5V VDD range. Input voltage tolerance extends from (GND − 0.5V) to (VDD + 0.5V), allowing direct interface with 3.3V FPGA I/O banks even when VDD is set to 5V for noise margin.
What is the maximum capacitive load the ISL55111IVZ-T can drive while maintaining specified rise/fall times?
The ISL55111IVZ-T maintains 1.2ns/1.4ns rise/fall times up to 100pF. At 330pF, rise time degrades to <3.0ns over temperature; at 680pF, it reaches 6.9ns (fall) and 6.2ns (rise). The device remains functional beyond 680pF but with progressively slower edges - design validation is required for loads >680pF. For ISL55111IVZ-T, always use local VH bypassing (0.1µF + 4.7µF) to sustain peak current delivery into heavy capacitive loads.
How does the power-down (PD) feature affect output states and timing in the ISL55111IVZ-T?
When PD is driven high, both OA and OB enter high-impedance (tri-state) mode regardless of IN-A/IN-B states, and quiescent current drops to 12µA (IDD-PDN). Propagation delay and skew specifications do not apply in power-down mode. Recovery time from PD high to active operation is 650ns (PDEN), after which full timing specs resume. This enables low-power standby in portable ultrasound probes without disrupting system-level timing coordination.
Can the ISL55111IVZ-T operate with VH = 13.2V and VDD = 2.7V simultaneously?
Yes, the ISL55111IVZ-T is fully specified for simultaneous operation at VH = 13.2V (max) and VDD = 2.7V (min). DC electrical specs confirm rDS = 3–6Ω and tR/tF = 1.2/1.4ns hold across this combined range. However, thermal design must account for increased power dissipation at high VH; the 8-lead TSSOP's θJA = 140°C/W necessitates adequate PCB copper area to maintain junction temperature ≤+150°C under sustained 3.5A peak loads.
ISL55111IVZ-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Half Bridge (2)
- Applications:
- Digital Imaging
- Interface:
- Logic
- Load Type:
- Capacitive and Resistive
- Technology:
- Power MOSFET
- Rds On (Typ):
- 3Ohm
- Current - Output / Channel:
- 100mA
- Current - Peak Output:
- 3.5A
- Voltage - Supply:
- 2.7V ~ 5.5V
- Voltage - Load:
- 5V ~ 13.2V
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Fault Protection:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSSOP
ISL55111IVZ-T FAQ
1.How can I place an order for ISL55111IVZ-T through Aetrix?
Please submit a Request for Quotation (RFQ) for ISL55111IVZ-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ISL55111IVZ-T reliable?
The price and inventory of ISL55111IVZ-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ISL55111IVZ-T is usually 5 days.
3.What payment methods are accepted for ISL55111IVZ-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ISL55111IVZ-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ISL55111IVZ-T?
ISL55111IVZ-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ISL55111IVZ-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ISL55111IVZ-T?
For technical support, including ISL55111IVZ-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ISL55111IVZ-T requirements.
6.How does Aetrix verify that ISL55111IVZ-T is sourced from the original manufacturer or authorized distributors?
All ISL55111IVZ-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ISL55111IVZ-T meets industry standards.
7.What is the process for return or replacement of ISL55111IVZ-T?
All ISL55111IVZ-T units undergo pre-shipment inspection (PSI). If there is an issue with ISL55111IVZ-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ISL55111IVZ-T part is unused and in its original packaging.
Return procedure for ISL55111IVZ-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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