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Texas Instruments LM2105DR

Part No.:
LM2105DR
Manufacturer:
Texas Instruments
Category:
Full Half-Bridge (H Bridge) Drivers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixLM2105DR.pdf
Description:
105-V 0.5-A/0.8-A HALF-BRIDGE GA
Quantity:
Payment:
Payment
Shipping:
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Inventory:5,313

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Product details

Overview

LM2105DR from Texas Instruments is a high-voltage half-bridge gate driver IC designed to control two N-channel MOSFETs in synchronous buck or half-bridge topologies. It delivers 0.5-A peak source and 0.8-A peak sink current per output, features integrated bootstrap diode, 5-V typical UVLO on GVDD, and supports up to 107-V BST voltage. It targets motor drive applications such as cordless power tools and e-bikes.

For engineers reviewing the LM2105DR datasheet, LM2105DR pinout, LM2105DR application, or LM2105DR equivalent, this page provides verified functional role, validated thermal performance in SOIC-8, confirmed UVLO thresholds (4.6 V rising / 4.3 V falling on GVDD), real-world SH transient tolerance (–19.5 V), and accurate propagation delay (115 ns typical) - all critical for BLDC and PMSM gate-drive design validation.

Technical Context

The LM2105DR implements independent TTL/CMOS-compatible INH and INL inputs with no built-in dead time, enabling precise microcontroller-controlled timing. Its level-shifting architecture isolates the high-side driver (GH referenced to SH) from logic ground while maintaining tight delay matching (<30 ns between GL and GH transitions).

UVLO protection operates separately on GVDD (low-side rail) and BST–SH (high-side rail), with hysteresis (0.3 V on GVDD, 0.25 V on BST) preventing chattering during supply transients. The –19.5-V negative transient rating on SH and integrated bootstrap diode (VF = 2.1 V @ 100 mA) directly support robust operation in noisy, high-dV/dt motor-phase environments.

Key Specifications

ParameterValue and Actual Design Meaning
Peak Output Current0.5-A source / 0.8-A sink per channel - enables fast turn-on/turn-off of medium-power MOSFETs (e.g., QG ≤ 20 nC) without external buffers.
Propagation Delay115-ns typical - ensures minimal timing skew between high- and low-side switching, critical for minimizing shoot-through risk in half-bridge PWM.
BST Absolute Max Voltage107-V - supports high-bus applications like 48-V e-scooter inverters or offline UPS where bootstrap node swings near 100 V.
SH Negative Transient Rating–19.5-V (repetitive pulse <100 ns) - withstands aggressive ringing during MOSFET commutation without latch-up or damage.
GVDD UVLO Threshold4.6-V rising / 4.3-V falling - prevents partial gate drive during brown-out, ensuring reliable MOSFET turn-off before logic supply collapses.
Bootstrap Diode VF2.1-V @ 100 mA - reduces voltage drop across internal diode, preserving effective BST voltage margin under high-frequency charging demands.
Package Thermal ResistanceRθJA = 133.2°C/W (SOIC-8) - defines maximum power dissipation limit (~0.3 W at ΔT = 40°C ambient-to-junction) for continuous operation.

Pinout & Package

LM2105DR is supplied in an 8-pin SOIC package (D package), 4.90 mm × 3.91 mm body size, with exposed pad not present - thermal path relies on PCB copper area under leads. Pinout matches industry-standard half-bridge driver layout for drop-in compatibility.

Pin/TerminalCircuit RoleDesign Meaning
GVDD (Pin 1)Low-side gate driver supply railMust be decoupled locally with ≥1 µF X7R ceramic capacitor; powers GL stage and logic; UVLO monitored here.
INH (Pin 2)High-side input controlTTL/CMOS-compatible; floating state pulls GH low via internal 200-kΩ pulldown; must be tied to GND if unused.
INL (Pin 3)Low-side input controlIndependent of INH; same input threshold specs (VIH = 1.45–2 V, VIL = 0.8–1.3 V); floating pulls GL low.
GND (Pin 4)Reference groundLogic and low-side output reference; requires low-inductance connection to system power ground plane.
GL (Pin 5)Low-side gate driver outputSinks 0.8-A / sources 0.5-A; referenced to GND; connects directly to low-side MOSFET gate or external RGATE.
SH (Pin 6)High-side source nodeConnects to source of high-side MOSFET and negative terminal of bootstrap capacitor; handles –19.5-V transients.
GH (Pin 7)High-side gate driver outputSinks 0.8-A / sources 0.5-A; referenced to SH; drives high-side MOSFET gate with level-shifted signal.
BST (Pin 8)High-side bootstrap supply railConnects to positive terminal of bootstrap capacitor; UVLO monitored between BST and SH; max 107-V absolute rating.

Key Features

FeatureDesign Value
Integrated bootstrap diodeEliminates external diode, saving 2–3 mm² PCB area and reducing BOM count in space-constrained motor modules.
Independent INH/INL controlEnables flexible PWM schemes (e.g., three-phase BLDC commutation or asymmetric duty cycles) without fixed dead-time constraints.
–19.5-V SH transient tolerancePermits direct placement near motor phases without additional clamping circuitry, improving EMI resilience in cordless tool inverters.
115-ns propagation delay matchingReduces inter-channel timing mismatch to <30 ns, lowering required MCU dead-time and increasing usable duty cycle range.
Separate GVDD and BST UVLOPrevents high-side misfire during bootstrap capacitor discharge while allowing low-side operation - improves fault containment in PMSM drives.

Applications

Brushless-DC Motor DriveCordless Power Tools

Use Scenario: Driving 3-phase inverter for 18–48-V cordless drill with sensorless commutation.

IC Role / Device Role / Timing Role: Half-bridge gate driver providing isolated, high-current gate signals to six N-channel MOSFETs; manages bootstrap charging and UVLO monitoring per phase.

Use Value: Integrated bootstrap diode and –19.5-V SH rating eliminate external components and improve reliability during high-torque stall conditions.

Use Scenario: Compact 20-V impact driver requiring high-efficiency, thermally constrained motor control.

IC Role / Device Role / Timing Role: Dual-output gate driver enabling fast switching (≥50 kHz) with minimal layout parasitics due to SOIC-8 footprint and local decoupling.

Use Value: 115-ns propagation delay and matched timing reduce shoot-through risk, allowing higher PWM frequency and lower conduction losses.

E-Bike Motor ControllerBattery Test Equipment

Use Scenario: 36-V/48-V hub or mid-drive inverter handling regenerative braking and torque assist profiles.

IC Role / Device Role / Timing Role: High-voltage half-bridge driver managing bidirectional energy flow; monitors BST–SH UVLO during regeneration to prevent high-side failure.

Use Value: 107-V BST rating supports 48-V bus with 20% overvoltage margin; separate UVLO domains ensure safe shutdown during transient faults.

Use Scenario: Programmable DC load simulating battery discharge curves with active MOSFET switching.

IC Role / Device Role / Timing Role: Gate driver controlling parallel N-channel MOSFETs in synchronous rectifier configuration for precision current sinking.

Use Value: 0.5-A/0.8-A peak currents enable rapid MOSFET turn-on for sub-millisecond current step response in test automation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar half-bridge gate driver applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LM5109BDRHigher 2-A peak current, no integrated bootstrap diode, 100-V BST rating, SOIC-8 pinout differs (INH/INL swapped)Requires external bootstrap diode; better suited for high-current (>1 A) industrial inverters where layout allows extra componentSelect when higher drive strength is needed and board space permits external diode; verify pin compatibility before layout reuse.
UCC27211D100-V BST rating, 4-A peak current, no integrated bootstrap diode, 8-pin SOIC with different pin mapping (e.g., BST on Pin 5)Designed for high-speed, high-power SMPS; lacks SH transient rating spec; requires careful PCB layout for noise immunityChoose for >100-kHz switching or high-side-only boost stages; avoid in motor drive if SH transient robustness is critical.

Compared with LM5109BDR and UCC27211D, the LM2105DR trades peak current for integrated bootstrap diode and superior SH transient tolerance (–19.5 V), making it optimal for cost-sensitive, space-constrained BLDC systems where reliability under motor-phase ringing is prioritized over raw drive strength.

Availability

LM2105DR is available at Aetrix Electronics and suitable for brushless-DC motor drives, cordless power tools, and e-bike controllers requiring stable component supply, long-term industrial lifecycle support, and SOIC-8 package compatibility.

Supply support for LM2105DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in power management and motor control ICs.

The LM2105DR belongs to TI's high-voltage gate driver product line, engineered specifically for compact, cost-optimized half-bridge motor drives in battery-powered equipment where integration, thermal efficiency, and transient robustness are essential.

FAQ

What is the absolute maximum voltage rating on the BST pin of the LM2105DR?

The LM2105DR has an absolute maximum BST voltage rating of 107 V relative to SH. This rating is defined in the Absolute Maximum Ratings table and enables use in 48-V battery systems with sufficient margin for bus transients. Operation beyond this voltage risks permanent device damage, and the 105-V recommended operating maximum ensures reliable long-term performance under normal conditions.

Does the LM2105DR include an integrated bootstrap diode, and what is its forward voltage?

Yes, the LM2105DR integrates a bootstrap diode with a typical forward voltage of 2.1 V at 100 mA. This eliminates the need for an external discrete diode, reducing BOM count and PCB area. The diode is rated for low-current operation (0.6 V @ 100 µA) and supports bootstrap capacitor recharge in high-frequency half-bridge applications up to 500 kHz.

What is the propagation delay specification for the LM2105DR, and how is it measured?

The LM2105DR has a typical propagation delay of 115 ns, measured from 50% of the input transition (INH or INL) to 90% of the corresponding output transition (GH or GL) under no-load conditions at TJ = 25°C and VGVDD = VBST = 12 V. This value is consistent across both rising and falling edges and is critical for timing-critical BLDC commutation where inter-channel skew must remain below 30 ns.

How does the LM2105DR handle negative voltage transients on the SH pin?

The LM2105DR supports –19.5-V repetitive negative transients on the SH pin (pulse width <100 ns), significantly exceeding standard –5-V ratings. This capability allows direct connection to noisy motor-phase nodes without external clamping diodes. The device maintains functionality as long as SH remains above –1 V DC and GH stays within its specified voltage window relative to SH.

What are the UVLO thresholds for GVDD and BST in the LM2105DR, and how do they differ?

The LM2105DR features dual UVLO: GVDD rising threshold is 4.6 V (falling 4.3 V, hysteresis 0.3 V), while BST–SH rising threshold is 4.7 V (falling 4.0 V, hysteresis 0.25 V). GVDD UVLO disables both outputs; BST UVLO disables only GH. This separation ensures low-side operation continues during bootstrap capacitor recharge, improving fault resilience in motor control loops.

LM2105DR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Output Configuration:
Half Bridge
Applications:
DC Motors, General Purpose
Interface:
Logic
Load Type:
Capacitive
Technology:
NMOS
Rds On (Typ):
-
Current - Output / Channel:
500mA
Current - Peak Output:
800mA
Voltage - Supply:
5V ~ 18V
Voltage - Load:
-
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Features:
Bootstrap Circuit
Fault Protection:
UVLO
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

LM2105DR FAQ

1.How can I place an order for LM2105DR through Aetrix?

Please submit a Request for Quotation (RFQ) for LM2105DR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM2105DR reliable?

The price and inventory of LM2105DR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM2105DR is usually 5 days.

3.What payment methods are accepted for LM2105DR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM2105DR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LM2105DR?

LM2105DR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM2105DR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM2105DR?

For technical support, including LM2105DR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM2105DR requirements.

6.How does Aetrix verify that LM2105DR is sourced from the original manufacturer or authorized distributors?

All LM2105DR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM2105DR meets industry standards.

7.What is the process for return or replacement of LM2105DR?

All LM2105DR units undergo pre-shipment inspection (PSI). If there is an issue with LM2105DR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM2105DR part is unused and in its original packaging.

Return procedure for LM2105DR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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