Texas Instruments LMG2610RRGT

Overview

LMG2610 from Texas Instruments is a 650-V GaN half-bridge power stage integrating asymmetric high-side (248 mΩ) and low-side (170 mΩ) GaN FETs, dual gate drivers with programmable slew-rate control, current-sense emulation, and bootstrap diode functionality - all in a 9×7 mm QFN package. It targets <75-W active-clamp flyback (ACF) converters for high-density AC/DC adapters and USB wall chargers.

For engineers reviewing the LMG2610 datasheet, LMG2610 pinout, LMG2610 application, or LMG2610 equivalent, this page delivers verified technical context, confirmed pin functions, real-world ACF converter design implications, and validated alternative options - all grounded in TI's production-grade SNOSDE2A documentation.

Technical Context

The LMG2610 implements a monolithic GaN half-bridge with integrated level-shifting high-side driver and smart-switched bootstrap FET - eliminating external diode reverse-recovery charge and enabling fast high-side startup (<8 µs). Its asymmetric R_DS(on) values (248 mΩ HS / 170 mΩ LS) are optimized specifically for ACF topology voltage stress and conduction loss distribution.

Current-sense emulation provides 1 mA/A scaling with 35 ns settling time and replaces discrete sense resistors, allowing SL thermal pad connection to PCB power ground. Protection includes cycle-by-cycle overcurrent (5.4–6.4 A LS / 3–4 A HS), overtemperature shutdown (150 °C trip), and interlocked gate-drive logic preventing shoot-through.

Key Specifications

Pinout & Package

Package: 40-pin VQFN (RRG), 9.00 mm × 7.00 mm body with dual exposed thermal pads (PADH = SW node, PADL = SL/AGND node).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar GaN half-bridge power stage applications.

Compared with LMG2610, LMG3425R030 offers higher current handling but demands more external components and lacks ACF-specific features; NV6136 provides lower R_DS(on) symmetry but omits slew-rate tuning and smart bootstrap - making LMG2610 uniquely suited for production-ready, high-efficiency ACF implementations.

Availability

LMG2610 is available at Aetrix Electronics and suitable for AC/DC USB wall outlet power supplies, active-clamp flyback converters, and AC/DC auxiliary power supplies requiring stable component supply, long-term lifecycle support, and consistent parametric performance across manufacturing lots.

Supply support for LMG2610 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with decades of expertise in GaN technology development and high-reliability power system integration.

The LMG2610 belongs to TI's GaN power stage product line, engineered specifically for high-frequency, high-efficiency active-clamp flyback converters - emphasizing integration, thermal performance, and ease of use in space-constrained adapter and charger designs.

FAQ

What is the maximum bus voltage the LMG2610 can safely switch in an active-clamp flyback design?

The LMG2610 is rated for 650 V drain-source voltage under normal operation, with surge ratings up to 720 V and transient peak tolerance of 800 V. In active-clamp flyback applications, it reliably handles reflected output voltages plus clamp voltage spikes - supporting typical 400 V DC bus designs with sufficient margin for line surges and ringing. Always observe layout best practices to avoid exceeding V_DS limits during switching transitions.

How does the LMG2610's current-sense emulation differ from using a physical shunt resistor?

The LMG2610's current-sense emulation outputs a 1 mA/A proportional current (with ±50 µA offset) that replaces the traditional low-side shunt resistor. This eliminates I²R losses, thermal drift, and PCB area consumed by the resistor - while enabling the SL thermal pad to connect directly to power ground instead of signal ground. The 35 ns settling time ensures accurate current sampling for fast-control-loop ACF controllers.

Can the LMG2610 be used in topologies other than active-clamp flyback?

The LMG2610 is specifically optimized for active-clamp flyback (ACF) converters, with asymmetric R_DS(on) values, fast high-side startup (<8 µs), and integrated clamp-energy-handling features. While it functions as a generic half-bridge, its protection thresholds, timing characteristics, and thermal design are tuned for ACF - using it in LLC or totem-pole PFC may require additional external circuitry and yield suboptimal efficiency or reliability.

What is the purpose of the RDRVL and RDRVH pins on the LMG2610?

RDRVL and RDRVH are external resistor terminals that set the low-side and high-side GaN FET turn-on slew rates, respectively. Connecting defined resistance values (e.g., 0–120 kΩ) between RDRVL–AGND and RDRVH–SW selects one of four discrete dV/dt settings (20–140 V/ns LS, 20–165 V/ns HS). This enables precise EMI tuning and ringing suppression without altering gate drive strength or layout.

Does the LMG2610 require external bootstrap diodes or level shifters?

No - the LMG2610 integrates a smart-switched GaN bootstrap FET (replacing conventional diodes) and a high-side gate-drive level shifter. This eliminates external diodes, avoids reverse-recovery losses, prevents overcharging of the BST capacitor, and removes noise susceptibility associated with discrete level-shifting circuits - simplifying bill-of-materials and improving system robustness.