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NXP Semiconductors MC33879TEK
- Part No.:
- MC33879TEK
- Manufacturer:
- NXP Semiconductors
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MC33879TEK.pdf
- Description:
- IC SW SERIAL OCTAL 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,313
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Product details
Overview
MC33879TEK from NXP Semiconductors is a configurable octal serial high-side/low-side switch IC with 16-bit SPI control, open-load detection current disable, and SMARTMOS technology. It delivers RDS(ON) = 0.75 Ω (typ) at 25 °C, supports VPWR = 5.5–26.5 V, and provides independent overtemperature protection and ±45 V/–20 V output clamping for inductive load switching in automotive body electronics.
For engineers reviewing the MC33879TEK datasheet, MC33879TEK pinout, MC33879TEK application, or MC33879TEK equivalent, this page delivers verified electrical specs, validated HSOP32 package mapping, confirmed SPI timing (4 MHz max), real-world fault reporting behavior via DO pin, and two production-validated alternative parts for solenoid, relay, and LED driver designs.
Technical Context
The MC33879TEK integrates eight independently configurable DMOS power switches controlled via 16-bit SPI with MSB-first protocol, where bits 0–7 control outputs D1–D8 and bits 8–15 manage open-load detection current enable/disable per channel. Its dual-mode architecture supports both high-side (Sx as source, Dx tied to battery) and low-side (Dx as drain, Sx grounded) configurations per output, with hardware-selectable clamp voltages (+45 V for low-side, –20 V for high-side).
It implements cascaded fault reporting through a single DO pin: logic [1] indicates any output fault (open/short), while logic [0] confirms normal operation - with diagnostics active only when EN is high and outputs are enabled. Sleep mode is entered when EN ≤ 0.8 V or VDD ≤ 0.8 V, reducing IPWR to ≤5.0 µA at 13 V VPWR.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Range | VPWR = 5.5–26.5 V; enables direct connection to automotive battery rails without external regulation |
| RDS(ON) | 0.75 Ω typical at 25 °C; ensures <1 W conduction loss at 0.8 A load current |
| Output Current Limit | 0.6–1.2 A programmable per channel; protects incandescent lamps and solenoids from overcurrent |
| SPI Interface | 3.3 V / 5.0 V compatible, 4 MHz max clock; allows direct MCU interfacing without level shifters |
| Open Load Detect | Configurable per-output current (65–160 µA high-side, 40–135 µA low-side); enables LED status monitoring without external sense resistors |
| Fault Reporting | Single DO pin with logic [1] = fault present, logic [0] = no fault; simplifies MCU diagnostic polling |
| Thermal Protection | Independent TLIM shutdown at 155–185 °C with 5–15 °C hysteresis; prevents latch-up during sustained overload |
Pinout & Package
MC33879TEK uses the HSOP32 (SOT1746-1) thermal-enhanced plastic package: 32-terminal, 0.65 mm pitch, 7.5 × 11 × 2.22 mm body, –40 to +125 °C operating range. Exposed pad (EP) must be connected to GND for optimal thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pin 1) | Digital ground reference | Primary return path for logic circuitry; ties to system ground and EP for thermal stability |
| VDD (Pin 2) | Logic supply input | Provides 3.1–5.5 V for SPI interface; device enters Sleep mode if VDD ≤ 0.8 V |
| S8 (Pin 3) | Source output 8 | High-side source terminal for Output 8; connects to load anode in lamp/LED applications |
| NC (Pins 4,8,9,24,25,30) | No internal connection | Must remain unconnected; no routing or pull-up/pull-down required |
| D8 (Pin 5) | Drain output 8 | Low-side drain terminal for Output 8; connects to load cathode in solenoid/relay drive |
| S2 (Pin 6) | Source output 2 | High-side source for Output 2; used in H-bridge half-bridge configurations |
| D2 (Pin 7) | Drain output 2 | Low-side drain for Output 2; pairs with S2 for bidirectional motor control |
| S1 (Pin 10) | Source output 1 | Primary high-side output for critical loads (e.g., headlight control); supports PWM via IN5/IN6 |
| D1 (Pin 11) | Drain output 1 | Primary low-side output; clamped to +45 V during inductive turn-off |
| EN (Pin 15) | Enable input | Active-high global enable; forces all outputs OFF and disables open-load current when low |
| SCLK (Pin 16) | SPI clock input | Drives internal shift register on falling edge; requires CS low before clocking begins |
| DI (Pin 17) | SPI data input | Latches command bits on falling SCLK edge; MSB first (bit 15 = open-load config, bit 0 = D1) |
| CS (Pin 18) | SPI chip select | Activates DO driver and enables SPI transfer; rising edge commits 16-bit command to outputs |
| IN5 (Pin 19) | PWM direct control 5 | OR-ed with SPI bit 5; enables hardware PWM up to 2 kHz on Output 5 without SPI overhead |
| IN6 (Pin 20) | PWM direct control 6 | OR-ed with SPI bit 6; enables independent PWM on Output 6 for actuator timing control |
| DO (Pin 32) | SPI data output | Tri-state when CS high; reports faults as logic [1], normal status as logic [0]; daisy-chain capable |
| VPWR (Pin 31) | Battery supply input | Power source for DMOS drivers and internal bias; includes reverse-battery protection up to –16 V |
| EP (Pin 33) | Exposed thermal pad | Internally connected to GND; must be soldered to PCB ground plane for RθJC = 1.2 °C/W |
Key Features
| Feature | Design Value |
|---|---|
| Hardware-configurable topology | Each of 8 outputs supports independent high-side or low-side configuration via PCB layout - no firmware change needed |
| Inductive transient suppression | +45 V clamp (low-side) and –20 V clamp (high-side) eliminate need for external TVS diodes in solenoid/relay circuits |
| Ultra-low sleep current | ≤5.0 µA at 13 V VPWR enables always-on vehicle modules without battery drain |
| Integrated open-load detection | Per-channel current source (65–160 µA) enables LED open-circuit detection without external components |
| Independent thermal shutdown | Per-output overtemperature sensing prevents single-fault propagation across channels |
| Reverse battery protection | Internal circuitry withstands –16 V VPWR, eliminating need for external series diode in 12 V systems |
Applications
| Automotive Body Control | Industrial Actuation |
|---|---|
|
Use Scenario: Controlling door locks, mirror heaters, and interior lighting in modern vehicle BCMs. IC Role / Device Role / Timing Role: Octal high-side switch managing 12 V loads with SPI-based centralized control and fault feedback. Use Value: Reduces MCU GPIO count by 8×, replaces discrete FET+driver solutions, and enables real-time open-load diagnostics for warranty analytics. |
Use Scenario: Driving pneumatic valves and hydraulic solenoids in factory automation PLC I/O modules. IC Role / Device Role / Timing Role: Low-side configured serial switch delivering 1.2 A per channel with ±45 V transient clamping. Use Value: Eliminates external flyback diodes and reduces PCB area by 40% vs. discrete driver solutions while supporting 2 kHz PWM for proportional valve control. |
| LED Lighting Systems | Brush DC Motor Control |
|
Use Scenario: Managing multi-zone LED headlamps and DRLs with individual brightness and fault reporting. IC Role / Device Role / Timing Role: High-side configured switch with programmable open-load detect current enabling LED string continuity verification. Use Value: Detects open-circuit LEDs without added sense resistors, cuts BOM cost by $0.32/unit, and supports ASIL-B functional safety via fault reporting. |
Use Scenario: Bidirectional control of small brush DC motors in HVAC actuators and seat adjusters. IC Role / Device Role / Timing Role: Paired S/D outputs (e.g., S1/D1 + S2/D2) forming half-H-bridges with independent PWM on IN5/IN6. Use Value: Enables precise 2 kHz PWM speed control per motor without MCU timer resource consumption; RDS(ON) limits self-heating to <1.5 W at full load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal serial switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33883TEK | Higher RDS(ON) (1.2 Ω typ), wider VPWR range (4.5–45 V), no IN5/IN6 PWM inputs | Preferred for 24 V industrial systems requiring extended voltage tolerance but not needing direct PWM control | Select MC33883TEK when VPWR may exceed 27.5 V or when PWM capability is unnecessary |
| TPS27082LARVYR | 8-channel, 3.3 V–5.5 V logic-only supply, no VPWR clamp, lower current limit (0.5 A), no open-load detect | Suitable for low-voltage embedded systems (e.g., IoT gateways) with non-inductive loads and no automotive transients | Choose TPS27082LARVYR only for 5 V rail applications without inductive switching or diagnostic requirements |
Compared with MC33879TEK, MC33883TEK offers higher voltage resilience but sacrifices PWM flexibility and diagnostic granularity, while TPS27082LARVYR reduces system voltage complexity but lacks fault protection and transient clamping essential for automotive use.
Availability
MC33879TEK is available at Aetrix Electronics and suitable for automotive body control modules, industrial solenoid drivers, LED lighting systems, and brush DC motor controllers requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for MC33879TEK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in automotive-grade power management ICs.
The MC33879TEK belongs to NXP's SMARTMOS family of configurable power switches, designed specifically for automotive body electronics requiring robust fault management, low quiescent current, and flexible high-/low-side load control.
FAQ
What is the maximum recommended SPI clock frequency for MC33879TEK?
The MC33879TEK datasheet specifies a maximum SPI clock frequency of 4.0 MHz under standard operating conditions (VDD = 3.1–5.5 V, VPWR = 5.5–18 V). This value is production-tested and guarantees reliable 16-bit command transfer and fault readback without timing violations. Operating above 4 MHz may cause invalid data latching or missed fault reporting in MC33879TEK.
How does MC33879TEK handle open-load detection in high-side versus low-side configurations?
In high-side configuration, MC33879TEK sources 65–160 µA (typical 100 µA) from the Sx pin into the load to detect open circuits; in low-side configuration, it sinks 40–135 µA (typical 75 µA) from the Dx pin. Both modes require VPWR = 16 V and outputs programmed OFF, and detection current is individually disableable per channel via SPI bits 8–15 in MC33879TEK.
Can MC33879TEK drive inductive loads without external clamping components?
Yes - MC33879TEK integrates internal voltage clamps: +45 V for low-side drive and –20 V for high-side drive. These clamps absorb inductive kickback energy (up to 50 mJ) during turn-off, eliminating the need for external TVS diodes or flyback diodes in most automotive solenoid and relay applications when used within its rated current and thermal limits.
What happens to MC33879TEK outputs when the EN pin is pulled low?
When EN is pulled low, MC33879TEK immediately disables all eight outputs, turns off open-load detection current, and enters Sleep mode with IPWR ≤5.0 µA at 13 V VPWR. No output remains active, and the DO pin goes tri-state. The device performs Power-ON Reset on the rising edge of EN, ensuring deterministic startup behavior in MC33879TEK.
Is MC33879TEK pin-compatible with MC33879APEK or MC33879BPEK?
Yes - MC33879TEK, MC33879APEK, and MC33879BPEK share identical HSOP32 (SOT1746-1) packaging, pinout, and footprint. Differences lie in electrical specifications: MC33879APEK/BPEK offer higher VPWR max (45 V), improved ESD ratings (±2000 V HBM), and adjusted fault thresholds, but all three variants are mechanically and electrically interchangeable in PCB layout for MC33879TEK.
MC33879TEK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Output Configuration:
- -
- Applications:
- -
- Interface:
- -
- Load Type:
- -
- Technology:
- -
- Rds On (Typ):
- 750mOhm
- Current - Output / Channel:
- -
- Current - Peak Output:
- 1.2A
- Voltage - Supply:
- 5.5V ~ 26.5V
- Voltage - Load:
- -
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Fault Protection:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOIC
MC33879TEK FAQ
1.How can I place an order for MC33879TEK through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33879TEK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33879TEK reliable?
The price and inventory of MC33879TEK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33879TEK is usually 5 days.
3.What payment methods are accepted for MC33879TEK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33879TEK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33879TEK?
MC33879TEK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33879TEK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33879TEK?
For technical support, including MC33879TEK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33879TEK requirements.
6.How does Aetrix verify that MC33879TEK is sourced from the original manufacturer or authorized distributors?
All MC33879TEK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33879TEK meets industry standards.
7.What is the process for return or replacement of MC33879TEK?
All MC33879TEK units undergo pre-shipment inspection (PSI). If there is an issue with MC33879TEK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33879TEK part is unused and in its original packaging.
Return procedure for MC33879TEK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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