Monolithic Power Systems Inc. MP86883GQKT-P
- Part No.:
- MP86883GQKT-P
- Manufacturer:
- Monolithic Power Systems Inc.
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 34-PowerWFQFN
- Datasheet:
-
MP86883GQKT-P.pdf
- Description:
- IC HALF BRIDGE DRIVER 55A 34TQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MP86883GQKT-P from Monolithic Power Systems is a monolithic half-bridge Intelli-Phase™ solution integrating high-side and low-side MOSFETs with gate drivers in a single TQFN-34 (6mm × 6mm) package. It delivers 55A continuous output current, operates from 4.5V to 14V input, supports 100kHz–1MHz switching, and features integrated current sense (±4% accuracy at 30A), temperature sense (10mV/°C), and tri-state PWM interface - optimized for server core voltage regulation.
For engineers reviewing the MP86883GQKT-P datasheet, MP86883GQKT-P pinout, MP86883GQKT-P application, or MP86883GQKT-P equivalent, key selection criteria include its 55A continuous current rating, built-in bootstrap switch, fault reporting via open-drain FAULT# pin, and compatibility with multi-phase VR controllers requiring precise per-phase current and thermal monitoring.
Technical Context
The MP86883GQKT-P implements a fully integrated half-bridge power stage with synchronous rectification, dead-time control (3ns rising / 8ns falling), and internal level-shifting for high-side drive. Its block diagram confirms independent HS/LS FET control, cycle-by-cycle overcurrent protection (80A HS / –30A LS), and analog current sensing referenced to SW node with 10μA/A gain.
It interfaces directly with tri-state PWM controllers (e.g., MP2935), supports diode emulation mode via SYNC pin, and provides real-time junction temperature monitoring through VTEMP (–100mV offset +10mV/°C). Thermal shutdown triggers at 170°C with 30°C hysteresis, and fault latching requires EN or VDD toggle to reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 55A - enables single-phase core rail delivery in high-density server VRMs without external FETs or driver ICs. |
| Input Voltage Range | 4.5V to 14V - supports 5V, 12V intermediate bus architectures common in CPU/GPU VR applications. |
| Switching Frequency Range | 100kHz to 1MHz - allows optimization of inductor size vs. efficiency trade-offs in multi-phase buck converters. |
| Current Sense Accuracy | ±4% at 30A - enables accurate phase-current balancing and active droop control without DCR sensing calibration. |
| Junction Temp Sensing | –100mV offset +10mV/°C - permits direct ADC reading of die temperature for dynamic thermal throttling in multi-phase systems. |
| HS/Low-Side Current Limit | 80A HS / –30A LS - provides asymmetric overcurrent protection aligned with buck converter conduction asymmetry. |
| Dead Time | 3ns (rising) / 8ns (falling) - minimizes shoot-through risk while preserving high-efficiency operation at MHz frequencies. |
Pinout & Package
TQFN-34 (6mm × 6mm) package with exposed thermal pad; 34-pin layout optimized for high-current routing and thermal dissipation. Pin numbering follows standard MPS TQFN-34 top-view convention.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–6, 8–21 | PGND | Power ground return path for both HS and LS FETs - must be connected to large copper pour and multiple vias for low-inductance thermal sinking. |
| 7 | VDRV | Driver supply (4.5–5.5V) - powers gate driver circuitry; requires local 1–4.7µF ceramic decoupling. |
| 22–23 | IN | Main input supply (4.5–14V) - connects to bulk capacitor; routing must minimize loop inductance with PGND. |
| 24 | EN | Enable control - pull low to force SW into high-impedance state; primary startup/shutdown signal. |
| 25 | VTEMP | Analog junction temperature output - used for system-level thermal management and phase matching across multi-phase rails. |
| 26 | FAULT# | Open-drain fault indicator - pulls low on HS overcurrent, overtemperature (>170°C), or VDD UVLO. |
| 28 | CS | Bidirectional current sense output - 10μA/A proportional to inductor current; enables cycle-by-cycle OCP and AVP. |
| 31 | VDD | Internal logic supply - derived from VDRV via 2.2Ω resistor; powers control logic and sensing circuits. |
| 32 | PWM | Tri-state input - floating or mid-voltage places SW in Hi-Z; compatible with VR12.5/VR13 controllers. |
| 34 | BST | Bootstrap capacitor connection - forms floating supply for HS gate drive; requires 0.22–1µF ceramic cap to SW. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated HS/LS FETs + Driver | Eliminates discrete driver+FET layout complexity and parasitic mismatch, reducing BOM count by ≥4 components per phase. |
| Tri-State PWM Interface | Direct compatibility with modern multi-phase VR controllers (e.g., MP2935), enabling seamless phase shedding and current balancing. |
| Built-In Bootstrap Switch | Removes need for external bootstrap diode or charge pump, simplifying layout and improving reliability under light-load diode-emulation mode. |
| Accurate Bi-Directional Current Sense | ±4% error at 30A enables precise per-phase current reporting for AVP and dynamic phase add/drop without DCR calibration. |
| Real-Time Junction Temperature Reporting | VTEMP output allows controller-side thermal derating and phase current redistribution before thermal throttling occurs. |
Applications
| Server Core Voltage Regulation | GPU Core Regulators |
|---|---|
Use Scenario: High-current, multi-phase buck converter supplying CPU core voltage (e.g., 0.8–1.3V @ up to 600A total) in dual-socket servers. IC Role / Device Role / Timing Role: Per-phase power stage delivering 55A with synchronized PWM control, current sensing, and thermal feedback to VR controller. Use Value: Enables compact 6×6mm per-phase footprint, reduces PCB area by >30% vs. discrete solutions, and improves transient response via accurate current telemetry. | Use Scenario: Core rail for high-end graphics processing units requiring fast load-step response and tight voltage regulation under burst workloads. IC Role / Device Role / Timing Role: Half-bridge power stage operating at 600kHz–1MHz with diode emulation support for ultra-low idle loss. Use Value: Delivers 55A per phase with <8ns dead time, minimizing conduction loss during heavy GPU compute loads while maintaining stability at 1MHz. |
| AI Accelerator Power Modules | High-Density Telecom Rectifiers |
Use Scenario: Power delivery to AI inference/training ASICs with dynamic current demands exceeding 400A and strict thermal constraints. IC Role / Device Role / Timing Role: Scalable per-phase building block in modular power modules, providing current and temperature telemetry to centralized PMBus controller. Use Value: VTEMP and CS outputs enable real-time per-module thermal derating and current balancing across 8+ phases, preventing hot-spot formation. | Use Scenario: Intermediate bus converter (IBC) or point-of-load regulator in 48V telecom infrastructure requiring high efficiency at partial load. IC Role / Device Role / Timing Role: High-efficiency half-bridge stage supporting diode emulation mode via SYNC pin to eliminate reverse recovery loss. Use Value: Achieves >95% efficiency at 20% load by disabling LS FET after zero-crossing, reducing switching losses without adding control complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar half-bridge power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP86957GQKT | Same TQFN-34 package, 70A continuous rating, higher RDS(on) HS FET (1.8mΩ vs. 1.4mΩ), no VTEMP pin | Lacks integrated temperature sensing; requires external thermal monitoring for multi-phase thermal balancing | Select when higher current headroom is prioritized over per-die thermal telemetry. |
| ISL99390HRZ-T | 50A rating, 3.5mm × 4.5mm WQFN, separate VSENSE and TSENSE pins, no integrated bootstrap switch | Smaller footprint but requires external bootstrap diode and separate current/thermal signal conditioning | Select when board space is constrained and discrete bootstrap implementation is acceptable. |
Compared with MP86883GQKT-P, MP86957GQKT trades thermal telemetry for higher current capacity, while ISL99390HRZ-T reduces size at the cost of added external components and loss of integrated bootstrap functionality - making MP86883GQKT-P optimal for thermally managed, high-density multi-phase server VRMs.
Availability
MP86883GQKT-P is available at Aetrix Electronics and suitable for server core voltage regulation, GPU power delivery, AI accelerator modules, and telecom intermediate bus converters requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for MP86883GQKT-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and mixed-signal ICs for power management, motion control, and automotive applications.
The MP86883 belongs to MPS's Intelli-Phase™ family - designed specifically for high-current, multi-phase DC-DC conversion in datacenter and AI hardware where integration, thermal intelligence, and per-phase telemetry are critical.
FAQ
What is the recommended bootstrap capacitor value for MP86883GQKT-P?
The datasheet specifies a 0.22µF to 1µF ceramic capacitor between BST and SW pins. A 0.47µF X7R 16V capacitor is commonly used to ensure sufficient charge hold-up during high-duty-cycle operation while maintaining low ESR. Values below 100nF are prohibited due to insufficient charge storage for reliable HS gate drive.
How does the MP86883GQKT-P implement diode emulation mode?
Diode emulation is activated by pulling the SYNC pin low. In this mode, the low-side FET turns off after inductor current crosses zero, eliminating reverse-recovery losses. The part monitors SW voltage and disables LS conduction when SW > 1.5V, enabling discontinuous conduction mode (DCM) operation without external control logic.
Can the CS pin be used for overcurrent protection without an external controller?
No - the CS pin provides a 10μA/A analog current signal but does not generate autonomous protection. Overcurrent response (e.g., cycle-by-cycle shutdown) requires an external controller to monitor CS voltage and assert PWM or EN signals. The internal 80A HS and –30A LS limits are hardwired fault triggers, not CS-based decisions.
What is the thermal resistance (θJA) of MP86883GQKT-P on a standard 4-layer PCB?
Measured per JESD51-7 on a 4-layer PCB, θJA is 29°C/W. This value assumes proper thermal design: exposed pad soldered to internal ground plane with ≥9 thermal vias, 2oz copper, and minimal trace length between IN/PGND/SW. With forced airflow (400 FPM), junction temperature rise drops significantly - enabling full 55A operation at 125°C ambient.
Is the MP86883GQKT-P RoHS-compliant and lead-free?
Yes - all MPS parts, including MP86883GQKT-P, are lead-free and comply with the RoHS directive. The device uses matte tin (Sn) plating on terminals and meets JEDEC J-STD-020 moisture sensitivity level (MSL) 3 requirements. Full compliance documentation is available on the MPS Quality Assurance webpage.
How is the VTEMP pin calibrated for junction temperature measurement?
VTEMP output follows VTEMP = –100mV + (10mV/°C × TJUNCTION) for TJUNCTION > 10°C. At 80°C junction temperature, VTEMP reads 700mV. Measurement must be taken between VTEMP and AGND pins using a high-impedance voltmeter or ADC; readings below 0V indicate TJUNCTION ≤ 10°C and clamp at 0V.
Does MP86883GQKT-P support parallel operation for higher current?
Yes - the device is explicitly designed for multi-phase operation. Its matched current sense gain (±4%), identical thermal coefficients, and synchronized FAULT# reporting allow direct paralleling of multiple MP86883GQKT-P units under a single VR controller. Phase interleaving is managed externally via PWM timing skew.
MP86883GQKT-P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Monolithic Power Systems Inc.
- Series:
- Intelli-Phase™
- Package/Case:
- 34-PowerWFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Output Configuration:
- Half Bridge
- Applications:
- General Purpose
- Interface:
- Logic
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 55A
- Current - Peak Output:
- -
- Voltage - Supply:
- 4.5V ~ 5.5V
- Voltage - Load:
- 4.5V ~ 14V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Status Flag
- Fault Protection:
- Current Limiting, Over Temperature
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 34-TQFN (6x6)
MP86883GQKT-P FAQ
1.How can I place an order for MP86883GQKT-P through Aetrix?
Please submit a Request for Quotation (RFQ) for MP86883GQKT-P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MP86883GQKT-P reliable?
The price and inventory of MP86883GQKT-P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP86883GQKT-P is usually 5 days.
3.What payment methods are accepted for MP86883GQKT-P?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP86883GQKT-P transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MP86883GQKT-P?
MP86883GQKT-P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MP86883GQKT-P order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MP86883GQKT-P?
For technical support, including MP86883GQKT-P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP86883GQKT-P requirements.
6.How does Aetrix verify that MP86883GQKT-P is sourced from the original manufacturer or authorized distributors?
All MP86883GQKT-P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP86883GQKT-P meets industry standards.
7.What is the process for return or replacement of MP86883GQKT-P?
All MP86883GQKT-P units undergo pre-shipment inspection (PSI). If there is an issue with MP86883GQKT-P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MP86883GQKT-P part is unused and in its original packaging.
Return procedure for MP86883GQKT-P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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