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Monolithic Power Systems Inc. MP86884DQKT-P

Part No.:
MP86884DQKT-P
Manufacturer:
Monolithic Power Systems Inc.
Category:
Full Half-Bridge (H Bridge) Drivers
Package:
34-PowerWFQFN
Datasheet:
AetrixMP86884DQKT-P.pdf
Description:
IC HALF BRIDGE DRIVER 55A 34TQFN
Quantity:
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Payment
Shipping:
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Inventory:3,569

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Product details

Overview

MP86884DQKT-P from Monolithic Power Systems is a monolithic half-bridge Intelli-Phase™ solution integrating high-side and low-side power MOSFETs with gate drivers in a single 6×6 mm TQFN package. It delivers 55 A continuous output current, supports 100 kHz–1 MHz switching, operates from 4.5 V–14 V input, and features integrated current sense (±4% accuracy at 30 A), temperature sense (10 mV/°C), and tri-state PWM interface - enabling precise multi-phase core voltage regulation in high-density server VRMs.

For engineers reviewing the MP86884DQKT-P datasheet, MP86884DQKT-P pinout, MP86884DQKT-P application, or MP86884DQKT-P equivalent, key selection criteria include its 55 A continuous current capability, 3 ns/8 ns dead-time control, bootstrap-enabled high-side drive, integrated thermal monitoring via VTEMP, and compatibility with VR12.5 controllers like MP2935 for phase-current balancing and droop control.

Technical Context

The MP86884DQKT-P implements a fully integrated half-bridge topology with matched HS/LS silicon, driver logic, and analog sensing circuitry on a single die. Its tri-state PWM interface enables seamless coordination with multi-phase controllers, while internal dead-time generation (3 ns rising / 8 ns falling) prevents shoot-through without external timing components.

Current sensing is implemented as a proportional 10 µA/A current source referenced to PGND, supporting cycle-by-cycle overcurrent protection and phase-current summation across multiple phases. Temperature sensing uses a calibrated 10 mV/°C slope with –100 mV offset on VTEMP, allowing direct junction temperature readout relative to VSS.

Key Specifications

Parameter Value and Actual Design Meaning
Continuous Output Current 55 A - Sustained per-phase load current without derating under typical thermal conditions (θJA = 29°C/W).
Input Voltage Range 4.5 V–14 V - Supports standard 5 V, 12 V intermediate bus architectures in server and GPU VRMs.
Switching Frequency Range 100 kHz–1 MHz - Enables optimization of efficiency vs. size trade-offs in multi-phase buck converters.
Current Sense Accuracy ±4% at 30 A - Enables accurate phase-current balancing and OCP triggering within tight tolerance bands.
Temperature Sense Gain 10 mV/°C with –100 mV offset - Allows direct junction temperature calculation: TJ = (VTEMP + 100 mV) / 10 mV/°C.
Dead-Time Control 3 ns (rising), 8 ns (falling) - Hardware-enforced minimum off-time prevents HS/LS overlap and shoot-through.
Package 6 mm × 6 mm TQFN - Exposed-pad thermal design supports >4 W continuous power dissipation at TA = 25°C.

Pinout & Package

MP86884DQKT-P uses a 34-pin 6×6 mm TQFN package with dual exposed thermal pads (SW and PGND) and optimized layout for high-current switching. The package conforms to JEDEC MO-220 and includes 0.5 mm pitch leads with coplanarity ≤0.10 mm.

Pin/Terminal Circuit Role Design Meaning
1–6, 8–21 (Exposed Pad) SW / PGND High-current switch node and power ground terminals - connected to large copper areas and vias for thermal and EMI performance.
22–23 IN Main input supply connection - requires local ceramic bypass capacitors to suppress switching transients.
7 VDDDRV Driver supply rail (4.5–5.5 V) - decoupled with 1–4.7 µF ceramic capacitor for gate drive stability.
31 VDD Internal logic supply - connected to VDDDRV via 2.2 Ω resistor and decoupled to VSS for noise isolation.
30 VSS Signal ground reference - tied to PGND at VDD decoupling point to minimize ground bounce.
32 PWM Tri-state logic input - floating or mid-voltage (1.45–3.2 V) places SW in Hi-Z state for phase shedding.
24 EN Enable control - low disables output and places SW in Hi-Z; used for startup/shutdown sequencing.
34 BST Bootstrap capacitor connection - forms floating supply for HS gate drive; requires 0.22–1 µF ceramic cap.
28 CS Current sense output - 10 µA/A proportional current source for external RCS-to-voltage conversion.
25 VTEMP Junction temperature monitor - 10 mV/°C linear output with –100 mV offset, referenced to VSS.

Key Features

Feature Design Value
Integrated HS/LS MOSFETs + Driver Eliminates discrete gate driver layout complexity and reduces parasitic inductance for cleaner switching edges.
Tri-State PWM Interface Enables dynamic phase shedding and diode emulation mode (via SYNC pin) for light-load efficiency optimization.
On-Die Current Sensing Provides cycle-by-cycle LSFET current feedback (±4% accuracy) for real-time OCP and multi-phase current balancing.
Junction Temperature Monitoring Direct VTEMP output enables system-level thermal management and per-phase thermal derating without external sensors.
Programmable Dead Time Default 3 ns/8 ns dead time prevents shoot-through; DT pin allows external adjustment if required by controller timing.

Applications

Server Core Voltage Regulation GPU Core Regulators

Use Scenario: High-current, multi-phase buck converter supplying CPU cores in enterprise servers with dynamic load steps up to 300 A/µs.

IC Role / Device Role / Timing Role: Per-phase power stage delivering 55 A with synchronized PWM, current-sense feedback, and thermal monitoring to VR controller.

Use Value: Enables compact 6 mm × 6 mm per-phase footprint while maintaining ±4% current accuracy for active voltage positioning and droop control.

Use Scenario: VRM for discrete graphics cards requiring rapid transient response and thermal-aware phase shedding under burst workloads.

IC Role / Device Role / Timing Role: Half-bridge power stage with tri-state PWM and diode emulation mode (SYNC-controlled) for adaptive light-load efficiency.

Use Value: Reduces light-load losses by >35% versus fixed-frequency operation through intelligent phase gating and valley-switching control.

Power Modules AI Accelerator VRMs

Use Scenario: Embedded power module for telecom or networking equipment where board space and thermal density are constrained.

IC Role / Device Role / Timing Role: Integrated Intelli-Phase building block with CS and VTEMP outputs aggregated across phases for centralized monitoring.

Use Value: Eliminates need for external current/temperature sensors and associated signal conditioning, reducing BOM count by ≥6 components per phase.

Use Scenario: Multi-phase VRM for AI training accelerators with strict junction temperature limits (<115°C) and fast current slew requirements.

IC Role / Device Role / Timing Role: Phase controller interface via CS summation and VTEMP telemetry for real-time thermal throttling and current redistribution.

Use Value: Enables per-phase thermal derating and dynamic current rebalancing to prevent hot-spot formation during sustained 500 W+ loads.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current half-bridge power stage applications.

Alternative Part Technical Difference Application Difference Selection Advice
MP86957DQKT-P 60 A continuous rating, 1.2 MHz max frequency, identical 6×6 mm TQFN package, but lacks integrated temperature sense. Preferred where higher peak current headroom is needed and thermal monitoring is handled externally. Select when system-level thermal management already exists and 5 A extra current margin justifies loss of on-die VTEMP.
ISL99227BIRZ-T7A 50 A rating, 4.5–16 V input, includes PMBus telemetry but uses larger 7×7 mm QFN and requires external bootstrap diode. Suitable for systems needing digital health reporting (voltage/current/temp) via PMBus instead of analog CS/VTEMP. Choose when firmware-based telemetry and configurability outweigh analog simplicity and smaller footprint.

Compared with MP86884DQKT-P, MP86957DQKT-P trades integrated thermal sensing for higher current and frequency headroom, while ISL99227BIRZ-T7A adds digital telemetry at the cost of larger size and external component dependencies - making MP86884 optimal for analog-controlled, space-constrained server VRMs.

Availability

MP86884DQKT-P is available at Aetrix Electronics and suitable for server core voltage regulation, GPU power delivery, and AI accelerator VRMs requiring stable component supply, long-term lifecycle support, and RoHS6-compliant packaging.

Supply support for MP86884DQKT-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, with design centers across Asia and North America and global manufacturing partnerships.

The MP86884 belongs to MPS's Intelli-Phase™ family - engineered specifically for high-efficiency, high-density multi-phase VRMs in datacenter and AI hardware, emphasizing integration, thermal intelligence, and controller interoperability.

FAQ

What is the maximum allowable continuous current for MP86884DQKT-P?

The MP86884DQKT-P is rated for 55 A continuous output current under standard thermal conditions (TA = 25°C, θJA = 29°C/W, 4-layer PCB). Derating is required above 85°C ambient or with reduced airflow; full 55 A operation assumes proper PCB copper area, thermal vias, and input/output capacitor placement per MPS layout guidelines.

How does the tri-state PWM interface function in multi-phase operation?

When the PWM pin is floated or driven to 1.45–3.2 V (mid-state), the MP86884DQKT-P places its SW node in high-impedance mode, effectively disabling that phase. This enables dynamic phase shedding controlled by the VR controller, improving light-load efficiency without requiring external MOSFET gate drivers or disable logic.

Can MP86884DQKT-P operate without an external bootstrap diode?

Yes - the MP86884DQKT-P integrates an internal bootstrap switch, eliminating the need for an external bootstrap diode. A 0.22–1 µF ceramic capacitor must be placed between BST and SW pins, and the device automatically manages charge transfer during each switching cycle to sustain high-side gate drive.

What is the purpose of the VTEMP pin and how is it calibrated?

VTEMP provides a voltage output proportional to junction temperature: VTEMP = (TJ × 10 mV/°C) – 100 mV. At 80°C, VTEMP reads 700 mV. Measurement must be taken between VTEMP and VSS pins. This output enables real-time thermal monitoring and per-phase derating without external thermistors or ADCs.

Does MP86884DQKT-P support diode emulation mode, and how is it enabled?

Yes - pulling the SYNC pin low activates diode emulation mode, turning off the low-side FET after inductor current crosses zero. This reduces reverse recovery losses in light-load conditions. The feature is controller-independent and requires only a pull-down resistor on SYNC, with no additional timing or configuration needed.

What is the recommended bootstrap capacitor value and placement?

MPS specifies a 0.22–1 µF X7R ceramic capacitor between BST and SW pins, placed as close as possible to the device with minimal trace length. Capacitance below 100 nF is prohibited. A 3.3 Ω series resistor is recommended to damp ringing, and the capacitor must be rated for ≥16 V DC working voltage.

How is current sense accuracy affected by PCB layout and external components?

CS pin accuracy (±4% at 30 A) assumes proper layout: short traces to ground, use of 1% tolerance RCS, and optional RC filter (e.g., 10 kΩ + 100 pF) for noise immunity. Long CS traces or shared ground paths introduce offset errors; MPS recommends routing CS directly to controller's current-sense amplifier with guard traces.

MP86884DQKT-P Specifications

Product attributes
Attribute value
Manufacturer:
Monolithic Power Systems Inc.
Series:
Intelli-Phase™
Package/Case:
34-PowerWFQFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Output Configuration:
Half Bridge
Applications:
General Purpose
Interface:
PWM
Load Type:
Inductive
Technology:
Power MOSFET
Rds On (Typ):
-
Current - Output / Channel:
55A
Current - Peak Output:
-
Voltage - Supply:
4.5V ~ 5.5V
Voltage - Load:
4.5V ~ 14V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Features:
-
Fault Protection:
Current Limiting
Mounting Type:
Surface Mount
Supplier Device Package:
34-TQFN (6x6)

MP86884DQKT-P FAQ

1.How can I place an order for MP86884DQKT-P through Aetrix?

Please submit a Request for Quotation (RFQ) for MP86884DQKT-P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MP86884DQKT-P reliable?

The price and inventory of MP86884DQKT-P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP86884DQKT-P is usually 5 days.

3.What payment methods are accepted for MP86884DQKT-P?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP86884DQKT-P transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MP86884DQKT-P?

MP86884DQKT-P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MP86884DQKT-P order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MP86884DQKT-P?

For technical support, including MP86884DQKT-P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP86884DQKT-P requirements.

6.How does Aetrix verify that MP86884DQKT-P is sourced from the original manufacturer or authorized distributors?

All MP86884DQKT-P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP86884DQKT-P meets industry standards.

7.What is the process for return or replacement of MP86884DQKT-P?

All MP86884DQKT-P units undergo pre-shipment inspection (PSI). If there is an issue with MP86884DQKT-P, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MP86884DQKT-P part is unused and in its original packaging.

Return procedure for MP86884DQKT-P:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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