Monolithic Power Systems Inc. MP86920GLV-P
- Part No.:
- MP86920GLV-P
- Manufacturer:
- Monolithic Power Systems Inc.
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 27-PowerVFLGA
- Datasheet:
-
MP86920GLV-P.pdf
- Description:
- IC HALF BRIDGE DRIVER 20A 27LGA
- Quantity:
- Payment:

- Shipping:

Inventory:500
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Product details
Overview
MP86920GLV-P from Monolithic Power Systems is a monolithic half-bridge Intelli-Phase™ solution integrating high-side and low-side power MOSFETs, gate drivers, current sense, and temperature sense in a single LGA-27 (4mm×5mm) package. It delivers 20A continuous output current, operates from 4.5V to 16V input, supports 100kHz–2MHz switching, and features tri-state PWM acceptance for diode emulation-optimized for server VRMs and multi-phase buck regulators.
For engineers reviewing the MP86920GLV-P datasheet, MP86920GLV-P pinout, MP86920GLV-P application, or MP86920GLV-P equivalent, key selection criteria include integrated HS/LS FET RDS(on) matching, 3ns rising / 8ns falling dead time, bidirectional CS gain (10μA/A), TMON/FLT dual-mode junction sensing (8mV/°C) and fault reporting, and LGA thermal performance (θJB = 4.3°C/W).
Technical Context
The MP86920GLV-P implements a fully integrated half-bridge power stage with level-shifted gate drive architecture, enabling synchronous rectification without external bootstrap diodes. Its internal driver controls matched silicon-based HS/LS FETs with precise dead-time control (3ns rising, 8ns falling for positive current) and negative-current limiting (−15A, 40ns off-time).
It embeds analog front-end functions: a ratiometric current-sense output (10μA/A, ±2% gain accuracy, 0.8–2.0V common-mode range) and a dual-function TMON/FLT pin providing 8mV/°C temperature sensing (800mV offset at 25°C) or open-drain fault signaling at 3.3V during over-current, over-temperature (>160°C), or SW-to-PGND short events.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 20A - supports high-density CPU/GPU core rail regulation without external current sharing. |
| Input Voltage Range | 4.5V to 16V - compatible with 5V, 12V intermediate bus architectures in servers and telecom systems. |
| Switching Frequency Range | 100kHz to 2MHz - enables optimization of inductor size vs. efficiency in multi-phase VRMs. |
| Current Sense Gain | 10μA/A with ±2% accuracy - provides controller-ready cycle-by-cycle current feedback for phase balancing and AVP. |
| Thermal Sensing Accuracy | 8mV/°C gain, 800mV offset at 25°C - enables real-time junction temperature monitoring within ±5°C over −40°C to +125°C. |
| Dead Time (Rising/Falling) | 3ns / 8ns - minimizes shoot-through risk while preserving high-frequency efficiency in fast-switching designs. |
| HS Current Limit | 50A - provides robust cycle-by-cycle over-current protection with 4-cycle latch-off for fault containment. |
| Package Thermal Resistance | θJB = 4.3°C/W - ensures effective heat transfer to PCB ground plane in compact LGA-27 footprint. |
Pinout & Package
LGA-27 (4mm × 5mm) package with exposed thermal pad on bottom; requires controlled-depth solder paste stencil (0.10mm max coplanarity) and JEDEC MO-303-compliant land pattern. Pin 1 identified by index marking; no lead finish specified beyond RoHS-compliant, halogen-free construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | TMON/FLT | Dual-mode pin: outputs 8mV/°C voltage proportional to junction temp or pulls to 3.3V during OC/OT/short faults. |
| 2, 23 | AGND | Analog reference ground; must connect to PGND plane only at VDD decoupling capacitor location to avoid noise coupling. |
| 3 | VDD | 3.3V internal logic supply; requires ≥1µF ceramic decoupling to AGND for UVLO stability (2.4–2.95V threshold). |
| 4 | VDRV | 3.3V gate driver supply; decoupled with 1–4.7µF ceramic cap to support peak gate charge delivery. |
| 6, 7, 13, 14, 15, 26 | PGND | Power ground return for HS/LS FETs and SW node; requires multiple vias to inner ground layers for <10mΩ impedance. |
| 8–12 | SW | Switch node output connecting to external inductor; internally tied to PHASE; rated for −5V to +25V transient swing. |
| 16–18 | VIN | Main power input (4.5–16V); requires local MLCC input capacitor placement adjacent to these pins to suppress dI/dt noise. |
| 19 | PHASE | Internal connection to SW; forms floating supply node for bootstrap capacitor with BST pin. |
| 20 | BST | Bootstrap supply input; requires 0.1–1µF ceramic cap between BST and PHASE to sustain HS-FET gate drive above VIN. |
| 21 | PWM | Tri-state logic input; floats or driven to 1.1–1.9V to enable diode emulation mode via ZCD-controlled LS-FET turn-off. |
| 22 | EN | Active-high enable; pulled low disables device and places SW in high-impedance state for system-level sequencing. |
| 25 | CS | Bidirectional current source (10μA/A); connects to external resistor to generate voltage proportional to inductor current. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated HS/LS Power Stage | Monolithic silicon integration eliminates discrete FET/driver layout complexity and reduces parasitic inductance by >30% vs. discrete solutions. |
| Tri-State PWM Interface | Enables seamless transition to diode emulation mode without external logic, reducing light-load losses in VRM applications. |
| Built-in Bootstrap Switch | Eliminates need for external bootstrap diode, simplifying BOM and improving reliability under high-duty-cycle operation. |
| Real-Time Current Monitoring | CS pin provides controller-accessible, bidirectional current data with <30ns propagation delay for accurate phase current balancing. |
| Comprehensive Fault Protection | Four independent protections-HS over-current (50A), LS negative-current limit (−15A), OTP (160°C), and SW short-each with dedicated latch behavior. |
Applications
| Server Voltage Regulators | Graphics Card Core Regulators |
|---|---|
Use Scenario: High-current, multi-phase buck converters powering AMD EPYC or Intel Xeon CPUs in 1U/2U rack servers. IC Role / Device Role / Timing Role: Half-bridge power stage delivering up to 20A per phase with synchronized current sensing and thermal monitoring. Use Value: Enables 95%+ efficiency at 12V input/1.0–1.8V output with minimal board area due to LGA-27 integration and no external bootstrap diode. | Use Scenario: GPU core rail regulation in PCIe-based graphics cards requiring rapid load transient response and thermal headroom. IC Role / Device Role / Timing Role: Synchronous buck power stage supporting 800kHz–1.2MHz switching with diode emulation for sub-10A light-load efficiency. Use Value: Delivers stable 1.2V/15A output with <5°C junction rise at full load, verified via TMON/FLT real-time readback. |
| Telecom Baseband Units | AI Accelerator Power Modules |
Use Scenario: Compact, high-efficiency point-of-load regulation for FPGA and DSP cores in 5G baseband processing units. IC Role / Device Role / Timing Role: Integrated half-bridge stage with CS and TMON/FLT used for closed-loop current and thermal management in fanless enclosures. Use Value: Reduces component count by 7 parts per phase vs. discrete solutions while maintaining <1% current-sense error across −40°C to +85°C ambient. | Use Scenario: Modular power delivery for NVIDIA A100 or AMD MI250X AI accelerators requiring parallel-phase scalability and telemetry. IC Role / Device Role / Timing Role: Building block in scalable 3–6 phase VRMs where CS outputs feed centralized digital controllers for dynamic phase shedding. Use Value: Enables per-phase current matching within ±2% tolerance using factory-trimmed CS gain, critical for thermal uniformity across multi-die packages. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar half-bridge power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP86950GLV-P | Higher 40A rating, same LGA-27 package, identical pinout, but requires external bootstrap diode and lacks integrated TMON/FLT. | Targeted at higher-current single-phase rails where thermal margin exceeds 20A; not suitable for space-constrained multi-phase layouts needing dual-sense telemetry. | Select when output current >25A is required and board area allows external bootstrap diode placement. |
| DrMOS IR35221 | Supports 30A, includes PMBus interface and digital fault logging; larger 5mm×6mm PQFN package; no analog CS output. | Used in digitally managed VRMs with microcontroller-based telemetry; lacks analog-compatible current sense for legacy analog controllers. | Select when system-level PMBus communication and programmable fault thresholds are mandatory. |
Compared with MP86950GLV-P and IR35221, the MP86920GLV-P uniquely combines 20A capability, analog CS + TMON/FLT dual telemetry, and bootstrap-integrated LGA-27 packaging-making it optimal for analog-controlled, space-constrained, thermally aware multi-phase server VRMs.
Availability
MP86920GLV-P is available at Aetrix Electronics and suitable for server voltage regulators, graphics card core regulators, and telecom baseband units requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant manufacturing.
Supply support for MP86920GLV-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management ICs, with design centers in the US, China, and Taiwan, and global distribution through authorized partners.
The MP86920 belongs to MPS's Intelli-Phase™ family-engineered specifically for high-efficiency, high-density, multi-phase DC/DC conversion in datacenter and AI infrastructure where thermal telemetry, current sensing fidelity, and layout simplicity are critical.
FAQ
What is the maximum allowable VIN transient voltage for MP86920GLV-P?
The absolute maximum VIN transient rating is +25V for 25ns pulses, with DC limit at 18V. Exceeding +25V even briefly risks permanent damage to the integrated HS-FETs. System designers must ensure input filtering limits transients to ≤22V under worst-case surge conditions per IEC 61000-4-5.
Can MP86920GLV-P operate without an external bootstrap diode?
Yes-the MP86920GLV-P integrates an internal bootstrap switch, eliminating the need for an external diode. The BST pin connects directly to a 0.1–1µF ceramic capacitor referenced to the PHASE node, simplifying layout and improving reliability in high-reliability server applications.
How does the TMON/FLT pin differentiate between temperature reading and fault reporting?
When active and fault-free, TMON/FLT outputs a linear 8mV/°C voltage with 800mV offset (e.g., 0.8V at 25°C). During any fault-over-current, over-temperature (>160°C), or SW-to-PGND short-the pin is actively pulled to 3.3V regardless of temperature, providing unambiguous fault signaling to the host controller.
What is the minimum recommended input capacitance for MP86920GLV-P at 12V input?
MPS recommends ≥22µF total ceramic input capacitance (e.g., four 5.6µF 0805 X7R MLCCs) placed directly across VIN and PGND pins. This value ensures <50mV input ripple at 20A load with 800kHz switching and meets the 150nH inductor requirement specified in the typical application circuit.
Does MP86920GLV-P support forced continuous conduction mode (FCCM)?
No-the MP86920GLV-P only supports PWM and tri-state (diode emulation) modes. It lacks a dedicated FCCM control input or internal logic to override zero-current detection. For FCCM operation, an external controller must hold PWM high continuously, disabling ZCD-based LS-FET turn-off.
What is the thermal resistance from junction to case top (θJC_TOP) for MP86920GLV-P?
The θJC_TOP is 18.7°C/W, measured from junction to the top surface of the LGA-27 package. This value informs heatsink or thermal pad interface design when top-side cooling is implemented-though primary thermal path is through the exposed PGND pad to the PCB.
Is the CS pin output truly bidirectional, and how is negative current sensed?
Yes-the CS pin sinks or sources current proportional to inductor current direction: +10μA/A for positive current, −10μA/A for negative current. When inductor current goes negative, the CS output reverses polarity, enabling controllers to detect reverse conduction and trigger appropriate phase management or protection actions.
MP86920GLV-P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Monolithic Power Systems Inc.
- Series:
- Intelli-Phase™
- Package/Case:
- 27-PowerVFLGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Buck Converters
- Interface:
- Analog, PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 20A
- Current - Peak Output:
- 45A
- Voltage - Supply:
- 3V ~ 3.6V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Diode Emulation
- Fault Protection:
- Current Limiting, ESD, Over Temperature, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 27-LGA (4x5)
MP86920GLV-P FAQ
1.How can I place an order for MP86920GLV-P through Aetrix?
Please submit a Request for Quotation (RFQ) for MP86920GLV-P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MP86920GLV-P reliable?
The price and inventory of MP86920GLV-P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP86920GLV-P is usually 5 days.
3.What payment methods are accepted for MP86920GLV-P?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP86920GLV-P transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MP86920GLV-P?
MP86920GLV-P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MP86920GLV-P order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MP86920GLV-P?
For technical support, including MP86920GLV-P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP86920GLV-P requirements.
6.How does Aetrix verify that MP86920GLV-P is sourced from the original manufacturer or authorized distributors?
All MP86920GLV-P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP86920GLV-P meets industry standards.
7.What is the process for return or replacement of MP86920GLV-P?
All MP86920GLV-P units undergo pre-shipment inspection (PSI). If there is an issue with MP86920GLV-P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MP86920GLV-P part is unused and in its original packaging.
Return procedure for MP86920GLV-P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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