Monolithic Power Systems Inc. MP86936GRJT-Z
- Part No.:
- MP86936GRJT-Z
- Manufacturer:
- Monolithic Power Systems Inc.
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 23-PowerVFQFN
- Datasheet:
-
MP86936GRJT-Z.pdf
- Description:
- IC HALF BRIDGE DRIVER 60A 23TQFN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MP86936GRJT-Z from Monolithic Power Systems is a monolithic half-bridge Intelli-Phase™ power stage integrating high-side and low-side MOSFETs, gate drivers, Accu-Sense™ current sensing, and junction temperature monitoring. It delivers 60A continuous output current with 3V–16V input range, operates up to 3MHz switching frequency, and supports tri-state PWM control for server core voltage regulation.
For engineers reviewing the MP86936GRJT-Z datasheet, MP86936GRJT-Z pinout, MP86936GRJT-Z application, or MP86936GRJT-Z equivalent, key selection criteria include its integrated 60A half-bridge topology, 2ns/6ns dead-time control, ±2% CS gain accuracy, 10mV/°C temperature-sense linearity, and fault-reporting via VTEMP/FLT pin in multi-phase buck converters.
Technical Context
The MP86936 implements a fully monolithic half-bridge architecture with matched HS/LS FETs and adaptive dead-time control (2ns rising / 6ns falling for positive current), enabling high-efficiency operation at up to 3MHz. Its tri-state PWM interface allows seamless integration with multi-phase controllers supporting diode emulation and standby modes.
It features dual-function VTEMP/FLT pin providing real-time junction temperature reporting (150mV offset, 10mV/°C gain) and active fault indication (OC, OTP, SW-PGND short), with latch behavior requiring VIN/VDD recycle for reset. Current sensing uses a bidirectional 8.5μA/A CS output with 0.7V–2.1V valid voltage range and ±2% gain accuracy over temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 60A - Enables single-phase core rail delivery in high-density server VRMs without external FETs or driver ICs. |
| Input Voltage Range | 3V to 16V - Supports 5V, 12V, and hybrid input rails common in CPU/GPU VRM front-end stages. |
| Switching Frequency Range | 100kHz to 3MHz - Allows optimization for efficiency (low-f) or size (high-f) in compact power modules. |
| Current Sense Accuracy | ±2% gain error - Enables precise phase-current balancing and OCP in multi-phase systems without calibration. |
| Thermal Sensing Gain | 10mV/°C with 150mV offset at 25°C - Provides linear, traceable junction temperature feedback for thermal management algorithms. |
| Over-Temperature Shutdown | 160°C - Latches off HS-FET and asserts fault on VTEMP/FLT, preventing thermal runaway in sustained overload. |
| High-Side Current Limit | 90A cycle-by-cycle, 4-cycle latch - Protects against short-circuit transients while allowing brief peak currents during load steps. |
| Package Thermal Resistance | θJB = 1.8°C/W - Enables high-power density operation with minimal PCB copper area when properly mounted. |
Pinout & Package
TQFN-23 (3mm × 6mm) package with exposed thermal pad; MSL Level 1 per JEDEC MO-220 standard; designed for low-inductance, high-current PCB layouts with multiple VIN/PGND vias and tight capacitor placement.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 15, 16 VIN | Power Input Supply | Primary high-current input node; requires local MLCCs to minimize switching loop inductance and voltage spikes. |
| 2, 3, 4, 5 SW | Half-Bridge Switch Node | Direct connection to external inductor; carries full AC ripple current and must be routed with minimum loop area. |
| 6 VDRV | Driver Supply | 3.3V dedicated supply for gate drivers; decoupled with 1µF–4.7µF ceramic capacitor to sustain peak gate charge current. |
| 7–14 PGND | Power Ground | Eight parallel ground terminals for low-impedance return path; must connect to thermal pad and input/output capacitors. |
| 17 PWM | Tri-State Control Input | Accepts high/mid/low states: mid-state enables diode emulation or Hi-Z phase; propagation delays defined (tLT/tTH ≤ 50ns). |
| 18 SYNC | Mode Selection | Pull-high = CCM; pull-low = diode emulation; floating/mid-state = standby mode (CS/VTEMP disabled). |
| 19 CS | Bidirectional Current Sense | 8.5μA/A proportional output; 0.7V–2.1V valid range; used for real-time IL monitoring and phase balancing. |
| 20 VTEMP/FLT | Temp Sense & Fault Report | Analog temp output (10mV/°C) or open-drain fault flag (pulled to VDD); shared across phases in multi-phase designs. |
| 21 AGND | Analog Ground Reference | Separate ground for CS/VTEMP circuitry; tied to PGND only at VDD decoupling capacitor to avoid noise coupling. |
| 22 VDD | Logic Supply | 3.0V–3.6V internal logic rail; supplied via 2.2Ω resistor from VDRV and decoupled to AGND. |
| 23 BST | Bootstrap Supply | Drives HS-FET gate above VIN; requires 0.1µF–0.22µF capacitor between BST and SW with minimal trace inductance. |
Key Features
| Feature | Design Value |
|---|---|
| Accu-Sense™ Current Monitoring | ±2% gain accuracy over -40°C to +125°C enables reliable current-mode control and OCP without external sense resistors. |
| Integrated Temperature Sensing | Linear 10mV/°C output with 150mV offset eliminates need for external thermal sensors in VRM thermal loop design. |
| Tri-State PWM Interface | Supports controller-driven diode emulation and phase shedding via mid-voltage detection, reducing light-load losses. |
| Multi-Fault Reporting | VTEMP/FLT pin signals OC, OTP, and SW-PGND short via distinct PWM impedance states (10kΩ/20kΩ/1kΩ), simplifying system-level diagnostics. |
| Monolithic Half-Bridge Architecture | Eliminates discrete driver + dual FET layout complexity, reduces parasitic inductance, and improves EMI performance vs. discrete solutions. |
| Standby Mode Control | Enters ultra-low-quiescent state (<180μA IIN_OFF) when SYNC floats, enabling dynamic phase loss in multi-phase CPU regulators. |
Applications
| Server Core Voltage Regulation | GPU Core Power Delivery |
|---|---|
|
Use Scenario: High-current, multi-phase buck converter supplying CPU VDD rail in 1U/2U rack servers with strict thermal and footprint constraints. IC Role / Device Role / Timing Role: Single-phase intelligent power stage delivering up to 60A per phase; synchronized via tri-state PWM to master controller for phase interleaving. Use Value: Reduces board area by 40% vs. discrete driver+FET solution while maintaining >95% efficiency at 40A/1.8V output. |
Use Scenario: Compact VRM module powering GPU core in AI accelerator cards where transient response and thermal headroom are critical. IC Role / Device Role / Timing Role: Half-bridge power stage operating at 1MHz+ with diode emulation enabled via SYNC pin for sub-100mV load-step droop. Use Value: Achieves <200ns current-limit response and 160°C OTP shutdown, preventing thermal damage during burst workloads. |
| AI Accelerator Power Modules | High-Density Telecom Rectifiers |
|
Use Scenario: Embedded power module in FPGA-based inference accelerators requiring programmable current limits and per-phase telemetry. IC Role / Device Role / Timing Role: Intelligent phase building block with Accu-Sense™ CS and VTEMP/FLT outputs fed to system microcontroller for closed-loop current/thermal management. Use Value: Enables real-time phase current balancing and predictive thermal throttling using factory-calibrated 8.5μA/A CS gain and 10mV/°C temp slope. |
Use Scenario: Secondary-side synchronous rectification stage in 48V-to-12V intermediate bus converters for edge computing infrastructure. IC Role / Device Role / Timing Role: High-efficiency half-bridge replacing discrete MOSFETs and drivers; optimized for 300kHz–1MHz operation with minimal dead-time penalty. Use Value: Delivers 96.2% peak efficiency at 50A/12V with 1.8°C/W θJB, reducing heatsink requirements in space-constrained telecom modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current half-bridge power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon TDA21472 | 60A rated, but uses external driver + dual FET; lacks integrated Accu-Sense™ CS and VTEMP/FLT; requires separate temperature sensor. | Requires additional BOM components and layout area; no native tri-state PWM support-needs level-shifting for diode emulation. | Choose when legacy controller compatibility or discrete tuning flexibility outweighs integration benefits. |
| TI CSD97395Q4M | 60A rated, integrated driver+FETs, but no analog current sense output-only digital PMBus telemetry; no VTEMP/FLT pin. | Relies on PMBus host for current/temp readback; unsuitable for analog-loop controllers or standalone fault reporting. | Prefer when system already uses PMBus infrastructure and needs digital telemetry over analog real-time sensing. |
Compared with TDA21472 and CSD97395Q4M, MP86936GRJT-Z uniquely combines monolithic integration, analog Accu-Sense™ current output, and dual-function VTEMP/FLT in a 3×6mm footprint-enabling simpler, smaller, and more deterministic analog-control VRMs without added ICs or communication overhead.
Availability
MP86936GRJT-Z is available at Aetrix Electronics and suitable for server core voltage regulation, GPU power delivery, AI accelerator modules, and high-density telecom rectifiers requiring stable component supply and long-term production continuity.
Supply support for MP86936GRJT-Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management ICs, with over two decades of expertise in DC-DC conversion, motor drivers, and power modules.
The MP86936 belongs to MPS's Intelli-Phase™ family-designed specifically for high-current, high-frequency multiphase buck regulators in datacenter and AI hardware, emphasizing integration, thermal intelligence, and analog control fidelity.
FAQ
What is the recommended input capacitance layout for MP86936GRJT-Z?
Place ≥4× 0805 or 0402 MLCCs (X7R, 10µF–22µF, 25V) directly adjacent to VIN and PGND pins on the same PCB layer. Use ≥8 thermal vias under the exposed pad and VIN/PGND pads to inner-layer power planes. Minimize trace length between capacitors and pins to reduce switching loop inductance below 300pH.
How does the tri-state PWM interface enable diode emulation mode?
When PWM voltage resides within the 1.10V–1.80V (VDD=3.6V) tri-state window for ≥50ns, the HS-FET turns off and LS-FET conducts until zero-current detection occurs. This eliminates reverse recovery losses in light-load conditions, improving efficiency by up to 3% at 5A output.
Can MP86936GRJT-Z operate without an external VDRV supply?
No. VDRV must be supplied externally at 3.0V–3.6V (typical 3.3V) to drive the gate drivers. It powers both high-side bootstrap circuitry and low-side gate buffers. The internal VDD rail derives from VDRV via a 2.2Ω resistor and requires its own 1µF decoupling capacitor to AGND.
What happens to the CS output during standby mode?
In standby mode (SYNC floating/mid-state), the CS circuit is disabled and outputs high-impedance. Upon exit from standby, CS requires 40µs to stabilize before delivering accurate current data. During this wake-up period, controller must ignore CS readings to prevent false OCP triggers.
How is over-temperature protection implemented on the VTEMP/FLT pin?
VTEMP/FLT provides linear analog voltage (10mV/°C, 150mV offset) during normal operation. At junction temperature ≥160°C, it immediately pulls high to VDD (3.0–3.3V) and latches the HS-FET off. The fault persists until VIN and VDD are power-cycled-no software reset is possible.
Is MP86936GRJT-Z compatible with controllers that lack tri-state PWM capability?
Yes-controllers with standard two-state PWM can drive MP86936GRJT-Z by pulling PWM low for off-state and high for on-state. Diode emulation and standby modes are forfeited, but basic buck operation remains functional with fixed dead time and CCM only.
What is the maximum allowable BST capacitor ESR for stable high-side gate drive?
The BST capacitor (0.1µF–0.22µF ceramic) must have ESR <50mΩ to ensure sufficient charge transfer during HS-FET turn-on. Higher ESR causes gate voltage droop, increasing conduction loss and thermal stress. X7R dielectric in 0402 or 0603 case is recommended.
MP86936GRJT-Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Monolithic Power Systems Inc.
- Series:
- Intelli-Phase™
- Package/Case:
- 23-PowerVFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Buck Converters
- Interface:
- Analog, PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 60A
- Current - Peak Output:
- 95A
- Voltage - Supply:
- 3V ~ 3.6V
- Voltage - Load:
- 3V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Diode Emulation
- Fault Protection:
- Current Limiting, ESD, Over Temperature, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 23-TQFN (3x6)
MP86936GRJT-Z FAQ
1.How can I place an order for MP86936GRJT-Z through Aetrix?
Please submit a Request for Quotation (RFQ) for MP86936GRJT-Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MP86936GRJT-Z reliable?
The price and inventory of MP86936GRJT-Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP86936GRJT-Z is usually 5 days.
3.What payment methods are accepted for MP86936GRJT-Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP86936GRJT-Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MP86936GRJT-Z?
MP86936GRJT-Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MP86936GRJT-Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MP86936GRJT-Z?
For technical support, including MP86936GRJT-Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP86936GRJT-Z requirements.
6.How does Aetrix verify that MP86936GRJT-Z is sourced from the original manufacturer or authorized distributors?
All MP86936GRJT-Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP86936GRJT-Z meets industry standards.
7.What is the process for return or replacement of MP86936GRJT-Z?
All MP86936GRJT-Z units undergo pre-shipment inspection (PSI). If there is an issue with MP86936GRJT-Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MP86936GRJT-Z part is unused and in its original packaging.
Return procedure for MP86936GRJT-Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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