Monolithic Power Systems Inc. MP86945-AGVT-P

Overview

MP86945-AGVT-P from Monolithic Power Systems is a monolithic half-bridge Intelli-Phase™ power stage integrating high-side and low-side MOSFETs, gate drivers, current sense (Accu-Sense™), temperature sense, and fault reporting. It delivers 60A continuous output current, operates from 4.5V to 16V input, supports 100kHz–2MHz switching, and targets server core voltage regulation where compact size and thermal efficiency are critical.

For engineers reviewing the MP86945-AGVT-P datasheet, MP86945-AGVT-P pinout, MP86945-AGVT-P application, or MP86945-AGVT-P equivalent, key selection considerations include tri-state PWM compatibility, ±30A/90A current-limit thresholds, 10mV/°C VTEMP slope with -100mV offset, dead-time control (2–35ns), and TQFN-25 (4mm×5mm) thermal performance (θJB = 1.8°C/W).

Technical Context

The MP86945-AGVT-P implements a synchronous buck half-bridge topology with integrated 60A-rated silicon, featuring cycle-by-cycle high-side over-current protection (90A limit, 3-cycle latch), programmable negative inductor current limiting (-30A), and diode emulation mode enabled via SYNC pin or tri-state PWM. Its Accu-Sense™ current sense provides 8.5μA/A gain with ±2% accuracy across 15–60A.

Thermal management is embedded via a dedicated VTEMP pin delivering 10mV/°C linear output referenced to -100mV at 0°C, enabling real-time junction temperature monitoring up to 125°C operating range. Fault reporting uses open-drain FAULT# with impedance-encoded fault identification (1kΩ to VDD for SW–PGND short, 20kΩ to AGND for OTP).

Key Specifications

Pinout & Package

MP86945-AGVT-P is housed in a thermally enhanced TQFN-25 package (4mm × 5mm, 0.5mm pitch) with exposed PGND paddle for low θJB (1.8°C/W). The package integrates dual-side thermal vias and optimized copper layout for high-current routing and junction-to-board heat transfer.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current monolithic half-bridge applications.

Compared with MP86945-AGVT-P, MP86955-AGVT-P offers headroom for future-proofing at higher currents without layout change, while ISL99227BIRZ-T demands added components for sensing and fault decoding-increasing design complexity and board area.

Availability

MP86945-AGVT-P is available at Aetrix Electronics and suitable for server core voltage regulation, GPU power modules, and enterprise storage controller designs requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.

Supply support for MP86945-AGVT-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and mixed-signal ICs for power management, motion control, and automotive applications.

The MP86945-AGVT-P belongs to MPS's Intelli-Phase™ family-designed specifically for high-efficiency, high-density multiphase VRMs in datacenter and AI hardware, integrating sensing, protection, and thermal intelligence into a single monolithic stage.

FAQ

What is the recommended bootstrap capacitor value for MP86945-AGVT-P?

A ceramic capacitor of 0.1µF to 1µF should be placed directly between BST and SW pins. A 0.22µF X7R 0402 capacitor is typically used to ensure reliable high-side gate drive across temperature and load, minimizing voltage droop during fast switching transitions.

How does the tri-state PWM function enable diode emulation mode?

When PWM is floated or biased within its tri-state window (1.10–1.90V), the MP86945-AGVT-P disables the high-side FET and turns on the low-side FET until zero-current detection occurs-emulating a Schottky diode to reduce light-load losses without requiring external control logic.

Can MP86945-AGVT-P operate without an external VTEMP pull-down resistor?

No external pull-down is required. VTEMP is a buffered analog output with defined offset and slope; it sources/sinks minimal current and interfaces directly to a controller ADC input. Adding a pull-down would distort the 10mV/°C linear relationship and invalidate temperature readings.

What is the minimum PWM pulse width supported, and why does it matter?

The minimum supported PWM pulse width is 20ns. This enables stable operation at 2MHz switching frequency (500ns period) with ≥4% duty cycle resolution, critical for fine-grained voltage positioning and transient response in modern CPU/GPU VRMs.

How is fault type determined when FAULT# asserts low?

After FAULT# pulls low, the controller measures PWM pin impedance relative to AGND or VDD: 10kΩ to AGND indicates over-current, 20kΩ to AGND indicates over-temperature, and 1kΩ to VDD indicates SW–PGND short-enabling unambiguous fault classification without additional pins.

Is AGND required to be isolated from PGND, and if so, where should they connect?

Yes-AGND must be isolated from PGND except at a single point: the ground terminal of the VDD decoupling capacitor. This prevents high di/dt noise from PGND from corrupting CS and VTEMP analog signals, ensuring ±2% current sense accuracy and stable thermal reporting.

Does MP86945-AGVT-P support parallel operation for higher current per phase?

No-MP86945-AGVT-P is not designed for paralleling. Its current sense and thermal reporting are per-device; paralleling would cause current imbalance and inaccurate temperature monitoring. Higher current is achieved via multi-phase interleaving, not device stacking.