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Monolithic Power Systems Inc. MP86950GLVT-P

Part No.:
MP86950GLVT-P
Manufacturer:
Monolithic Power Systems Inc.
Category:
Full Half-Bridge (H Bridge) Drivers
Package:
27-PowerVFLGA
Datasheet:
AetrixMP86950GLVT-P.pdf
Description:
IC HALF BRIDGE DRIVER 50A 27TLGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:490

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Product details

Overview

MP86950GLVT-P from Monolithic Power Systems is a monolithic half-bridge Intelli-Phase™ solution integrating high-side and low-side power MOSFETs, gate drivers, Accu-Sense™ current sensing, temperature sensing, and fault reporting in a single TLGA-27 package. It delivers 50A continuous output current across 4.5V–16V input, supports 100kHz–2MHz switching, and enables diode emulation via tri-state PWM for server VR13/VR14 core regulators.

For engineers reviewing the MP86950GLVT-P datasheet, MP86950GLVT-P pinout, MP86950GLVT-P application, or MP86950GLVT-P equivalent, key selection criteria include its integrated 50A half-bridge topology, dual-function TMON/FLT pin (temperature sense + fault flag), ±30A/75A bidirectional current limit thresholds, dead time control (3–35ns), and compatibility with multi-phase buck controllers requiring accurate phase-current balancing and active voltage positioning.

Technical Context

The MP86950 operates as a self-contained half-bridge power stage with internal level-shifted gate drivers and zero-crossing detection (ZCD) logic to enable diode emulation mode. Its tri-state PWM interface accepts middle-voltage inputs (1.10–1.90V) to trigger LS-FET conduction during light-load conditions, reducing reverse recovery losses.

Current sensing uses a bidirectional 10μA/A CS output referenced to external VCM, supporting cycle-by-cycle overcurrent protection and real-time inductor current monitoring. Fault management integrates three independent latching mechanisms-HS overcurrent (4-cycle), LS negative current (-30A), and junction overtemperature (>160°C)-all reported via the shared TMON/FLT pin.

Key Specifications

ParameterValue and Actual Design Meaning
Continuous Output Current50A - Enables single-phase operation in high-density server VRMs without external MOSFETs or driver ICs.
Input Voltage Range4.5V to 16V - Supports 12V intermediate bus architectures common in AI accelerators and GPU power delivery.
Switching Frequency Range100kHz to 2MHz - Allows optimization for efficiency (low-freq) or size (high-freq) in multi-phase buck converters.
Current Sense Accuracy±2% (15–50A) - Ensures precise phase-current balancing and AVP droop control in multi-phase systems.
Thermal Shutdown Threshold160°C with 30°C hysteresis - Prevents thermal runaway while allowing safe transient overload handling up to 125°C operating junction.
Dead Time Control3ns (rising), 6–35ns (falling) - Minimizes shoot-through risk while maintaining ZVS capability at high frequencies.
TMON/FLT Sensitivity8mV/°C with 800mV offset at 25°C - Provides linear analog temperature telemetry for system-level thermal management.

Pinout & Package

The MP86950GLVT-P is housed in a thermally enhanced TLGA-27 (4mm × 5mm) package with exposed PGND pads on the bottom for optimal heat dissipation and low-inductance power routing. The package features 27 terminals arranged in a 3×9 grid with pin 1 marked by an index area.

Pin/TerminalCircuit RoleDesign Meaning
1TMON/FLTDual-function node: analog temperature sense output (8mV/°C) and open-drain fault flag pulled to VDD during overcurrent/overtemperature/SW–PGND short.
2, 23AGNDAnalog ground reference for VDD, VDRV, CS, and PWM circuits; must be isolated from PGND to avoid noise coupling into current sensing.
3VDD3.3V supply for internal logic; requires ≥1µF ceramic decoupling to AGND to maintain UVLO stability and PWM timing integrity.
4VDRV3.3V gate driver supply; decoupled with 1–4.7µF ceramic capacitor to sustain peak gate charge current during 50A switching transitions.
6, 7, 13, 14, 15, 26PGNDPower ground return for HS/LS FETs and SW node; multiple vias required under pads to minimize parasitic inductance and thermal resistance (θJB = 3.1°C/W).
8–12SWSwitch node connecting internal HS and LS FETs; directly interfaces with output inductor and bootstrap capacitor; routed with minimum loop area to suppress EMI.
16–18VINMain power input (4.5–16V); requires low-ESR MLCCs placed adjacent to VIN/PGND pads to support 90A peak pulsed current.
19PHASEInternal connection to SW; used only for external bootstrap capacitor placement between PHASE and BST to generate floating high-side gate drive.
20BSTBootstrap capacitor connection point; trace width >20mils and no vias permitted to ensure reliable high-side gate turn-on above VIN.
21PWMTri-state digital input; floats or driven to 1.1–1.9V to enter diode emulation mode; propagation delays tRISING/tFALLING = 15ns ensure tight timing control.
22ENEnable/disable control; pulled low disables device and places SW in high-impedance state; threshold is 0.8V (low) / 2.3V (high).
25CSBidirectional current source (10μA/A) proportional to inductor current; connects to controller's current-sense input for real-time phase balancing and OCP.

Key Features

FeatureDesign Value
Integrated Half-Bridge TopologyMonolithic integration of matched HS/LS MOSFETs and drivers eliminates discrete layout complexity and reduces PCB area by >40% vs. discrete solutions.
Accu-Sense™ Current Monitoring±2% gain accuracy over 15–50A range enables precise AVP droop and dynamic phase shedding in multi-phase VRMs without external amplifiers.
Tri-State PWM InterfaceSupports diode emulation mode via middle-voltage input (1.1–1.9V), eliminating body-diode conduction loss and improving light-load efficiency by up to 5%.
Dual-Function TMON/FLT PinSingle-pin junction temperature telemetry (8mV/°C) and fault reporting simplifies system monitoring and reduces BOM count versus separate thermal and fault sensors.
Programmable Dead TimeAsymmetric dead time (3ns rising / 6–35ns falling) adapts to load polarity, minimizing cross-conduction while preserving ZVS capability across full load range.

Applications

Server Core Voltage RegulationGPU Power Delivery

Use Scenario: High-current, multi-phase buck converter supplying CPU/GPU cores in data center servers with VR13/VR14 compliance requirements.

IC Role / Device Role / Timing Role: Single-phase intelligent power stage providing 50A output per phase, synchronized via tri-state PWM to master controller for phase interleaving and current balancing.

Use Value: Reduces total solution size by integrating MOSFETs, drivers, and sensing-enabling <10mm² per phase footprint while maintaining >92% efficiency at 700kHz/1.8V output.

Use Scenario: Compact, high-efficiency power stage for AI accelerator cards requiring rapid transient response and thermal margin under burst workloads.

IC Role / Device Role / Timing Role: Half-bridge switch node driver with ZCD-based diode emulation, enabling seamless transition between forced CCM and DCM modes during dynamic load steps.

Use Value: Achieves <1.5μs transient recovery time and maintains stable 0.5% output regulation across 0–50A step loads due to fast current-sense loop (<20ns delay) and low-impedance PGND path.

High-Density Power ModulesEnterprise Storage Controller Power

Use Scenario: Embedded power module for NVMe SSD controllers where board space is constrained and thermal performance dictates reliability.

IC Role / Device Role / Timing Role: Integrated power stage with TMON/FLT reporting to host microcontroller for predictive thermal throttling and fault logging.

Use Value: Delivers 50A in 4mm × 5mm TLGA package with θJB = 3.1°C/W, enabling passive cooling in sealed enclosures up to 70°C ambient.

Use Scenario: Dual-phase VR for SAS/SATA host bus adapters requiring high immunity to voltage ripple and EMI from adjacent high-speed serial lanes.

IC Role / Device Role / Timing Role: Low-noise half-bridge stage with optimized SW node layout and dedicated AGND isolation to prevent current-sense corruption from digital noise.

Use Value: CS output maintains ±2% linearity even with 100mVpp SW node ringing, ensuring accurate current reporting for adaptive loop compensation and fault detection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current half-bridge power stage applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MP86951GLVT-PSame pinout and functionality but rated for 60A continuous current; higher RDS(on) on LS-FET increases conduction loss at light loads.Preferred for next-gen AI chips requiring >55A per phase; less suitable for thermally constrained 1U server designs due to higher power density.Select MP86951 when peak current exceeds 50A and board layout allows additional thermal margin.
ISL99390HRZ-T50A-rated Intersil half-bridge with different PWM interface (standard CMOS, not tri-state); lacks integrated temperature sense and uses separate FLT pin.Requires external temperature sensor and fault logic; better suited for legacy controller platforms without tri-state PWM support.Choose ISL99390 only if existing design uses non-tri-state controllers and thermal telemetry is handled externally.

Compared with MP86951GLVT-P and ISL99390HRZ-T, the MP86950GLVT-P uniquely combines tri-state PWM compatibility, single-pin TMON/FLT telemetry, and 50A capability in a 4mm × 5mm footprint-making it optimal for space-constrained, thermally aware VR14-compliant server and GPU power stages where diode emulation and real-time current sensing are critical.

Availability

MP86950GLVT-P is available at Aetrix Electronics and suitable for server core voltage regulation, GPU power delivery, and high-density power modules requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for MP86950GLVT-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management ICs, with over two decades of innovation in DC/DC conversion, motor control, and power modules.

The MP86950 belongs to MPS's Intelli-Phase™ family of monolithic power stages, engineered specifically for high-efficiency, high-current VRM applications in cloud infrastructure, AI hardware, and graphics computing where integration, thermal performance, and signal fidelity are paramount.

FAQ

What is the recommended input capacitance for MP86950GLVT-P?

Place low-ESR MLCCs totaling ≥47μF (e.g., four 10μF 0402 or two 22μF 0603) directly between VIN and PGND pins, with minimal trace length and maximum via count under the pads. This ensures stable 90A pulsed current delivery and suppresses voltage ripple below 50mVpp at 1MHz switching.

How does the tri-state PWM mode function in MP86950GLVT-P?

The tri-state PWM mode activates when the PWM pin voltage remains within 1.10–1.90V for ≥40ns, causing the LS-FET to conduct during positive inductor current and turn off after zero-current detection. This eliminates body-diode conduction loss, improving light-load efficiency by up to 5% compared to standard PWM operation.

Can MP86950GLVT-P operate without an external bootstrap capacitor?

No. The BST pin requires a 0.1–1μF ceramic capacitor connected between BST and PHASE to generate the floating gate drive voltage for the high-side MOSFET. Omitting this capacitor prevents HS-FET turn-on and causes immediate fault latch via TMON/FLT pin pull-up to VDD.

What is the purpose of the CS pin's bidirectional current output?

The CS pin outputs a 10μA/A bidirectional current proportional to inductor current, enabling the host controller to perform real-time phase-current balancing, cycle-by-cycle overcurrent protection, and active voltage positioning. Its ±2% gain accuracy over 15–50A ensures precise droop control without external calibration.

How is over-temperature protection implemented in MP86950GLVT-P?

When junction temperature exceeds 160°C, the HS-FET latches off, the LS-FET turns on until zero-current detection, and the TMON/FLT pin is pulled high to VDD. Recovery requires cycling VIN, VDD, or EN-no automatic reset occurs to prevent thermal runaway during sustained overload conditions.

What PCB layout practices are critical for MP86950GLVT-P thermal performance?

Maximize PGND copper area and via count (≥12 vias) under pins 6,7,13,14,15,26; use inner-layer VIN plane aligned with top-side pads; place BST capacitor <2mm from pin 20 with >20-mil trace width; isolate CS trace from SW/PWM nodes using guard rings and AGND moats to preserve current-sense accuracy.

MP86950GLVT-P Specifications

Product attributes
Attribute value
Manufacturer:
Monolithic Power Systems Inc.
Series:
Intelli-Phase™
Package/Case:
27-PowerVFLGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Output Configuration:
Half Bridge
Applications:
Buck Converters
Interface:
Analog, PWM
Load Type:
Inductive
Technology:
Power MOSFET
Rds On (Typ):
-
Current - Output / Channel:
50A
Current - Peak Output:
90A
Voltage - Supply:
3V ~ 3.6V
Voltage - Load:
4.5V ~ 16V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Features:
Bootstrap Circuit, Diode Emulation
Fault Protection:
Current Limiting, ESD, Over Temperature, UVLO
Mounting Type:
Surface Mount
Supplier Device Package:
27-TLGA (4x5)

MP86950GLVT-P FAQ

1.How can I place an order for MP86950GLVT-P through Aetrix?

Please submit a Request for Quotation (RFQ) for MP86950GLVT-P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MP86950GLVT-P reliable?

The price and inventory of MP86950GLVT-P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP86950GLVT-P is usually 5 days.

3.What payment methods are accepted for MP86950GLVT-P?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP86950GLVT-P transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MP86950GLVT-P?

MP86950GLVT-P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MP86950GLVT-P order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MP86950GLVT-P?

For technical support, including MP86950GLVT-P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP86950GLVT-P requirements.

6.How does Aetrix verify that MP86950GLVT-P is sourced from the original manufacturer or authorized distributors?

All MP86950GLVT-P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP86950GLVT-P meets industry standards.

7.What is the process for return or replacement of MP86950GLVT-P?

All MP86950GLVT-P units undergo pre-shipment inspection (PSI). If there is an issue with MP86950GLVT-P, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MP86950GLVT-P part is unused and in its original packaging.

Return procedure for MP86950GLVT-P:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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