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Monolithic Power Systems Inc. MP86950GLVT-Z
- Part No.:
- MP86950GLVT-Z
- Manufacturer:
- Monolithic Power Systems Inc.
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 27-PowerVFLGA
- Datasheet:
-
MP86950GLVT-Z.pdf
- Description:
- IC HALF BRIDGE DRIVER 50A 27TLGA
- Quantity:
- Payment:
- Shipping:
Inventory:5,427
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Product details
Overview
MP86950GLVT-Z from Monolithic Power Systems is a monolithic half-bridge Intelli-Phase™ solution integrating high-side and low-side power MOSFETs, gate drivers, Accu-Sense™ current sensing, temperature sensing, and fault reporting in a single TLGA-27 package. It delivers 50A continuous output current across 4.5V–16V input, supports 100kHz–2MHz switching, and enables diode emulation via tri-state PWM for server core voltage regulation.
For engineers reviewing the MP86950GLVT-Z datasheet, MP86950GLVT-Z pinout, MP86950GLVT-Z application, or MP86950GLVT-Z equivalent, key selection criteria include its integrated 50A half-bridge topology, bidirectional CS output (10μA/A), TMON/FLT dual-function junction temperature reporting (8mV/°C), dead time control (3–35ns), and compatibility with multi-phase buck controllers requiring precise phase-current balancing and active voltage positioning.
Technical Context
The MP86950GLVT-Z implements a fully integrated synchronous half-bridge architecture with internal HS/LS MOSFETs and level-shifted gate drivers optimized for high-frequency buck conversion. Its functional block includes zero-current detection (ZCD), cycle-by-cycle HS current limiting (75A), negative LS current limiting (−30A), and over-temperature shutdown at 160°C with 30°C hysteresis.
It operates with external 3.3V supplies on VDD and VDRV, accepts tri-state PWM inputs (1.10–1.90V mid-range) to enable diode emulation mode, and provides a bi-directional current-source CS output referenced to an external common-mode voltage - enabling real-time inductor current monitoring for controller-based current balancing and droop compensation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 50A - Enables single-phase core rail delivery in high-density server VRMs without external MOSFETs or driver ICs. |
| Input Voltage Range | 4.5V to 16V - Supports 5V, 12V, and hybrid intermediate bus architectures in datacenter power systems. |
| Switching Frequency Range | 100kHz to 2MHz - Allows optimization of inductor size vs. efficiency trade-offs in compact multi-phase designs. |
| Current Sense Gain | 10μA/A with ±2% accuracy - Provides linear, bidirectional inductor current feedback for precise phase-current matching and OCP. |
| Junction Temp Sensing | 8mV/°C with 800mV offset at 25°C - Enables real-time thermal monitoring and closed-loop thermal management without external sensors. |
| HS Current Limit Threshold | 75A (cycle-by-cycle, 4-cycle latch) - Protects against short-circuit and overload while supporting transient current demands in CPU/GPU rails. |
| Dead Time Control | 3ns (rising), 6ns/35ns (falling, positive/negative current) - Minimizes shoot-through risk and conduction losses across load conditions. |
Pinout & Package
The MP86950GLVT-Z is housed in a thermally enhanced TLGA-27 (4mm × 5mm) package with exposed PGND pads for low-impedance heat dissipation and optimized parasitic inductance. The package features 27 terminals, including multiple VIN, PGND, and AGND pins for high-current routing and noise isolation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | TMON/FLT | Dual-function pin: junction temperature sense output (8mV/°C) and open-drain fault flag pulled to VDD during OC/OTP/SW-PGND faults. |
| 2, 23 | AGND | Analog ground reference for VDD, VDRV, CS, and PWM logic - must be isolated from power ground to avoid noise coupling into sensing paths. |
| 3 | VDD | 3.3V supply for internal logic and protection circuitry; requires ≥1µF ceramic decoupling to AGND. |
| 4 | VDRV | 3.3V supply for gate drivers; decoupled with 1–4.7µF ceramic capacitor to AGND to sustain peak gate charge current. |
| 6, 7, 13, 14, 15, 26 | PGND | Power ground return for HS/LS MOSFETs and SW node; connects directly to thermal pad for thermal and EMI performance. |
| 8–12 | SW | Switch node output connecting internal HS/LS FETs; carries full 50A pulsed current and requires low-inductance layout to minimize ringing. |
| 16–18 | VIN | Main power input (4.5–16V); routed with wide copper and multiple vias to PGND to reduce IR drop and switching loop inductance. |
| 19 | PHASE | Internal connection to SW; used externally only for bootstrap capacitor return - must be placed adjacent to BST with minimal trace length. |
| 20 | BST | Bootstrap supply for HS gate driver; requires 0.1–1µF ceramic capacitor between BST and PHASE to sustain gate drive above VIN. |
| 21 | PWM | Tri-state digital input (0.8V low / 1.1–1.9V mid / 2.35V high); mid-state enables diode emulation mode via ZCD detection. |
| 22 | EN | Active-high enable; pulled low disables device and places SW in high-impedance state - used for phase shedding and sequencing. |
| 25 | CS | Bidirectional current-source output (10μA/A); sinks/sourcing current proportional to inductor current for controller-based current sensing. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Half-Bridge with MOSFETs & Drivers | Eliminates discrete driver + dual-MOSFET layout complexity, reduces BOM count by ≥5 components, and cuts PCB area by >40% vs. discrete solutions. |
| Accu-Sense™ Bidirectional Current Sensing | Delivers ±2% gain accuracy and linear 0.7–2.1V CS voltage range - enables precise per-phase current reporting for dynamic load-line control and AVP. |
| Tri-State PWM Interface | Supports seamless transition to diode emulation mode without external logic, reducing light-load conduction losses and improving efficiency below 10% load. |
| Dual-Function TMON/FLT Pin | Combines real-time junction temperature telemetry (8mV/°C) and fault signaling (open-drain pull-up to VDD) on one pin - simplifies system monitoring and reduces GPIO usage. |
| Programmable HS Current Limit & OTP Protection | 75A cycle-by-cycle HS limit with 4-cycle latch and 160°C OTP with 30°C hysteresis provide robust, self-resetting protection without external circuitry. |
Applications
| Server Core Voltage Regulation | GPU Power Delivery |
|---|---|
Use Scenario: High-current, multi-phase buck converter supplying CPU VDD_SOC or VDD_IO rails in cloud-scale servers. IC Role / Device Role / Timing Role: Monolithic half-bridge power stage delivering up to 50A per phase with integrated current and temperature telemetry. Use Value: Enables <1.5mm² per-phase footprint, eliminates gate driver timing skew, and supports phase shedding via EN pin for dynamic efficiency scaling. | Use Scenario: Compact, high-efficiency VRM powering discrete graphics processing units in AI accelerators and gaming workstations. IC Role / Device Role / Timing Role: Synchronous buck power stage operating at 800kHz–1.2MHz with diode emulation for improved light-load efficiency. Use Value: Reduces thermal hotspots through TLGA-27's low θJB (3.1°C/W), supports fast transient response via accurate CS feedback, and simplifies layout with integrated bootstrap circuitry. |
| AI Accelerator Module Power | High-Density Power Modules |
Use Scenario: On-board power stage in FPGA or ASIC accelerator modules where space, thermal density, and current accuracy are critical. IC Role / Device Role / Timing Role: Single-chip half-bridge providing 50A output with bidirectional current sense and junction temperature reporting for closed-loop thermal derating. Use Value: Delivers ±2% current measurement accuracy for per-module current balancing and enables predictive thermal throttling using TMON/FLT analog output. | Use Scenario: Embedded power module design targeting telecom baseband units and edge computing platforms requiring scalable, pre-validated power stages. IC Role / Device Role / Timing Role: Plug-in half-bridge building block with standardized TLGA-27 footprint and pin-compatible layout across MPS Intelli-Phase portfolio. Use Value: Accelerates module development with validated thermal and EMI layout guidelines, reduces qualification time via integrated protection features, and supports volume production with tape-and-reel packaging (5000/reel). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar monolithic half-bridge power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP86932GLVT-Z | 32A rated, same TLGA-27 package, identical pinout and feature set except lower current rating and reduced HS current limit (45A). | Suitable for lower-power server DIMMs or peripheral rails where 50A headroom is unnecessary. | Select when thermal budget or cost sensitivity outweighs need for 50A capability; shares layout and firmware compatibility. |
| ISL99390HRZ-T | 50A rating, QFN-32 package, supports 3.3V VDD/VDRV but lacks integrated Accu-Sense™ CS and uses separate TEMP/FLT pins. | Requires external current-sense amplifier and thermal monitoring circuitry; higher component count and layout complexity. | Choose only if existing design uses Renesas ecosystem or requires pin-level compatibility with ISL993xx family; no CS or TMON/FLT integration benefit. |
Compared with MP86932GLVT-Z and ISL99390HRZ-T, the MP86950GLVT-Z uniquely combines 50A capability, single-pin TMON/FLT telemetry, and Accu-Sense™ bidirectional current sensing in a 4mm×5mm footprint - delivering the highest functional integration and smallest per-amp footprint for next-gen server VRMs.
Availability
MP86950GLVT-Z is available at Aetrix Electronics and suitable for server core voltage regulation, GPU power delivery, AI accelerator module power, and high-density power modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for MP86950GLVT-Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management ICs, with design centers in the US, China, and Taiwan, and global manufacturing partnerships.
The MP86950 belongs to MPS's Intelli-Phase™ monolithic power stage product line, engineered specifically for high-current, high-frequency DC-DC conversion in datacenter and AI infrastructure where integration, thermal performance, and current sensing accuracy are critical.
FAQ
What is the recommended input capacitance for MP86950GLVT-Z?
Place ceramic input capacitors (MLCCs) as close as possible to the VIN and PGND pins, using multiple 0402 or 0805 packages. Total capacitance should be ≥22µF with low-ESR/ESL characteristics; layout priority is minimizing loop inductance over absolute capacitance value.
How does the TMON/FLT pin differentiate between temperature reporting and fault signaling?
When active and fault-free, TMON/FLT outputs a linear 8mV/°C voltage with 800mV offset (e.g., 0.8V at 25°C, 1.4V at 100°C). During any fault (OC, OTP, SW-PGND short), it is actively pulled to VDD voltage level - overriding the analog temperature signal and providing unambiguous fault indication.
Can MP86950GLVT-Z operate without an external bootstrap capacitor?
No. The BST pin requires a 0.1µF–1µF ceramic capacitor connected between BST and PHASE to generate the floating voltage needed to drive the high-side MOSFET gate above VIN. Omitting this capacitor prevents HS-FET turn-on and causes immediate functional failure.
What is the minimum PWM pulse width supported, and why does it matter?
The MP86950GLVT-Z supports a minimum PWM pulse width of 20ns. This enables stable operation at high switching frequencies (up to 2MHz) and fine-grained duty-cycle control for tight output voltage regulation - especially critical in low-VOUT, high-current applications like CPU core rails.
Does the CS pin require external amplification or filtering?
No. The CS pin is a calibrated current source (10μA/A, ±2%) designed to interface directly with standard controller current-sense inputs. A single resistor from CS to a stable common-mode voltage (e.g., 1.65V) sets the output voltage range (0.7–2.1V); no op-amp or RC filtering is required for basic operation.
How is the dead time adjusted, and is it user-configurable?
Dead time is fixed by internal circuitry: 3ns for rising edge, 6ns for falling edge under positive inductor current, and 35ns under negative current. It is not user-configurable but is optimized to prevent shoot-through while minimizing conduction loss - verified across process, voltage, and temperature corners.
What thermal metrics define the TLGA-27 package's cooling performance?
The TLGA-27 package has θJB = 3.1°C/W (junction-to-board) and θJC_TOP = 9.1°C/W (junction-to-case top). These values assume proper PCB layout: ≥6 thermal vias under the exposed PGND pad, 2oz copper on inner layers, and adequate copper pour - enabling 50A operation within 125°C junction limit at 20°C ambient with 200LFM airflow.
MP86950GLVT-Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Monolithic Power Systems Inc.
- Series:
- Intelli-Phase™
- Package/Case:
- 27-PowerVFLGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Buck Converters
- Interface:
- Analog, PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 50A
- Current - Peak Output:
- 90A
- Voltage - Supply:
- 3V ~ 3.6V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Diode Emulation
- Fault Protection:
- Current Limiting, ESD, Over Temperature, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 27-TLGA (4x5)
MP86950GLVT-Z FAQ
1.How can I place an order for MP86950GLVT-Z through Aetrix?
Please submit a Request for Quotation (RFQ) for MP86950GLVT-Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MP86950GLVT-Z reliable?
The price and inventory of MP86950GLVT-Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP86950GLVT-Z is usually 5 days.
3.What payment methods are accepted for MP86950GLVT-Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP86950GLVT-Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MP86950GLVT-Z?
MP86950GLVT-Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MP86950GLVT-Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MP86950GLVT-Z?
For technical support, including MP86950GLVT-Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP86950GLVT-Z requirements.
6.How does Aetrix verify that MP86950GLVT-Z is sourced from the original manufacturer or authorized distributors?
All MP86950GLVT-Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP86950GLVT-Z meets industry standards.
7.What is the process for return or replacement of MP86950GLVT-Z?
All MP86950GLVT-Z units undergo pre-shipment inspection (PSI). If there is an issue with MP86950GLVT-Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MP86950GLVT-Z part is unused and in its original packaging.
Return procedure for MP86950GLVT-Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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