Monolithic Power Systems Inc. MP86956GMJ-P
- Part No.:
- MP86956GMJ-P
- Manufacturer:
- Monolithic Power Systems Inc.
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 41-PowerVFLGA
- Datasheet:
-
MP86956GMJ-P.pdf
- Description:
- IC HALF BRIDGE DRIVER 70A 41LGA
- Quantity:
- Payment:

- Shipping:

Inventory:490
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Product details
Overview
MP86956GMJ-P from Monolithic Power Systems is a monolithic half-bridge Intelli-Phase™ power stage integrating high-side and low-side MOSFETs with gate drivers in a single LGA-41 (5mm × 6mm) package. It delivers 70A continuous output current, operates from 3V to 16V input, supports 100kHz–3MHz switching, and features Accu-Sense™ bidirectional current sensing and junction temperature monitoring - optimized for server core voltage regulation.
For engineers reviewing the MP869556GMJ-P datasheet, MP86956GMJ-P pinout, MP86956GMJ-P application, or MP86956GMJ-P equivalent, key selection criteria include tri-state PWM compatibility, ±35A/110A current limit thresholds, 2–28ns programmable dead time, thermal shutdown at 160°C, and integrated fault reporting via TOUT/FLT pin.
Technical Context
The MP86956GMJ-P implements a fully integrated half-bridge topology with internal HS/LS FETs and driver logic, eliminating external gate drive components and minimizing parasitic inductance. Its tri-state PWM interface enables diode emulation mode for light-load efficiency, while cycle-by-cycle current limiting and zero-current detection (ZCD) support precise multi-phase current balancing.
Thermal management is enabled by dual-sense functionality on the TOUT/FLT pin (8mV/°C gain, 800mV offset at 25°C), which transitions to VDD-level fault signaling during over-temperature (>160°C), HS over-current (8-cycle latch), or SW–PGND short events. The IOUT pin provides 5μA/A proportional current sense with ±2% gain accuracy across 20–70A.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 70A - supports high-density, multi-phase buck converters for CPU/GPU VRMs without external heatsinking under typical airflow. |
| Input Voltage Range | 3V to 16V - compatible with 5V, 12V, and hybrid intermediate bus architectures in servers and AI accelerators. |
| Switching Frequency Range | 100kHz to 3MHz - enables optimization for efficiency (low-f) or size (high-f) in compact VRM designs. |
| Current Sense Accuracy | ±2% (20A–70A) - enables precise phase-current matching and active voltage positioning (AVP) in multi-phase systems. |
| Thermal Shutdown Threshold | 160°C - latches off HS-FET and asserts fault flag; allows safe thermal recovery before restart via EN toggle or VIN recycle. |
| Dead Time Control | 2ns (rising), 6ns/28ns (falling, positive/negative current) - minimizes shoot-through risk while preserving ZCD timing integrity. |
| Fault Reporting Pin | TOUT/FLT - dual-mode: analog temp sense (8mV/°C) or digital fault flag (pulled to VDD) with PWM-resistor encoding of fault type. |
Pinout & Package
LGA-41 (5mm × 6mm) package with exposed thermal pad on bottom; pin 1 marked by index area; JEDEC MO-303 compliant; lead coplanarity ≤ 0.10mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 2 | AGND | Analog ground reference for VDD decoupling and IOUT/TOUT/FLT bias; must be connected to PGND at VDD capacitor node. |
| 3 | VDD | Internal logic supply (3.0–3.6V); requires 1µF ceramic decoupling to AGND and series 2.2Ω resistor from VDRV. |
| 4 | VDRV | Driver supply (3.0–3.6V); powers gate drivers; decoupled with 1–4.7µF ceramic cap to AGND. |
| 10–19 | SW | Phase node connecting HS/LS FETs; carries full switching current; requires low-inductance layout to PGND/VIN. |
| 25–30 | VIN | Main input supply (3–16V); connects to input capacitors placed directly adjacent to these pins for minimal loop inductance. |
| 32 | PHASE | Internal connection to SW; used for bootstrap capacitor floating supply reference; not externally accessible. |
| 33 | BST | Bootstrap supply node; requires 0.1–0.22µF ceramic capacitor between BST and SW to sustain HS gate drive. |
| 34 | PWM | Tri-state input controlling HS/LS switching; mid-voltage (1.1–1.8V) triggers diode emulation mode. |
| 35 | EN | Enable/disable control; low disables all FETs and places SW in Hi-Z; used for fault reset and sequencing. |
| 36 | TOUT/FLT | Dual-function pin: analog junction temp output (8mV/°C) or open-drain fault flag (pulled to VDD on fault). |
| 38 | IOUT | Bidirectional current sense output (5μA/A); voltage range 0.7–2.1V maps to ±70A; supports controller-based OCP and AVP. |
Key Features
| Feature | Design Value |
|---|---|
| Monolithic Half-Bridge Integration | HS/LS MOSFETs + drivers in one die reduce PCB area by >40% vs discrete solutions and eliminate gate-loop parasitics. |
| Accu-Sense™ Current Monitoring | ±2% gain accuracy over 20–70A enables real-time phase-current balancing and dynamic droop control in multi-phase VRMs. |
| Tri-State PWM Interface | Supports diode emulation without external ZCD circuitry - LS-FET turns on during positive inductor current and off at zero-crossing. |
| Programmable Dead Time | Asymmetric falling-edge dead time (6ns/28ns) prevents shoot-through during polarity reversal while maintaining ZCD timing. |
| Integrated Fault Encoding | PWM pin resistance (1kΩ/VDD, 10kΩ/AGND, 20kΩ/AGND) identifies SW-short, HS-OCP, or OTP faults without additional GPIOs. |
Applications
| Server Core Voltage Regulation | GPU Power Delivery |
|---|---|
|
Use Scenario: High-current, multi-phase buck converter supplying 0.8–1.2V to modern x86 CPUs in cloud data centers. IC Role / Device Role / Timing Role: Single-phase power stage in 8+ phase VRM; handles up to 70A per phase with synchronized PWM and current feedback. Use Value: Enables <1.5mm² per-phase footprint and >95% peak efficiency at 50A/1.05V, reducing board layer count and thermal mass. |
Use Scenario: Compact, high-efficiency power stage for PCIe-based AI accelerators requiring rapid load transient response. IC Role / Device Role / Timing Role: Phase-leg module accepting tri-state PWM from digital controller; provides IOUT and TOUT/FLT for closed-loop current/temp supervision. Use Value: Supports <500ns load-step response with cycle-by-cycle current limiting and real-time junction temperature tracking. |
| AI Accelerator VRMs | High-Density Power Modules |
|
Use Scenario: Embedded power stage in modular compute cards where space, thermal headroom, and reliability are constrained. IC Role / Device Role / Timing Role: Integrated half-bridge with fault-encoded PWM and analog temp sense - eliminates discrete sense resistors and thermal sensors. Use Value: Reduces BOM count by 12 components per phase and enables predictive thermal throttling via TOUT/FLT slope analysis. |
Use Scenario: Building block for scalable, plug-and-play power modules targeting telecom and industrial edge computing. IC Role / Device Role / Timing Role: Drop-in-ready Intelli-Phase™ stage with standardized LGA-41 footprint and unified fault reporting interface. Use Value: Allows module designers to achieve 70A/phase density with single-point thermal monitoring and unified current sense scaling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar half-bridge power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP86956GMJT | Thin LGA (TLGA-41) variant with θJC_TOP = 2.0°C/W vs 8.7°C/W in standard LGA; identical electrical specs and pinout. | Preferred for ultra-low-profile modules (<1.0mm height) and stacked PCB assemblies where top-side thermal conduction is critical. | Select GMJT when board stack height is constrained and top-side heatsinking is available; otherwise GMJ offers better cost and thermal margin via bottom-side conduction. |
| MP86957GMJ-P | Same LGA-41 package but rated for 80A continuous; higher RDS(on) HS-FET (1.2mΩ vs 1.0mΩ) and increased IOUT offset drift (±3μA vs ±2μA). | Targets next-gen server CPUs requiring >75A/phase; requires updated current-sense calibration and tighter thermal design. | Choose MP86957GMJ-P only if 80A rating is mandatory; MP86956GMJ-P delivers superior efficiency and lower thermal stress at 70A-class loads. |
Compared with MP86956GMJT, the MP86956GMJ-P offers higher thermal resistance to top but lower cost and wider availability; versus MP86957GMJ-P, it provides tighter current sense accuracy and lower conduction loss at 70A, making it optimal for mainstream server VRMs.
Availability
MP86956GMJ-P is available at Aetrix Electronics and suitable for server core voltage regulation, GPU power delivery, and high-density power modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for MP86956GMJ-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management ICs, with over 20 years of expertise in DC/DC conversion, motor control, and power modules.
The MP86956 belongs to MPS's Intelli-Phase™ family - engineered specifically for high-current, high-frequency multiphase buck regulators in datacenter and AI infrastructure, emphasizing integration, thermal intelligence, and system-level fault resilience.
FAQ
What is the maximum allowable input voltage for MP86956GMJ-P?
The absolute maximum VIN is 18V DC, but the recommended operating range is 3.0V to 16V. Exceeding 16V risks violating the VIN-to-VPHASE rating (−0.3V to 25V DC), especially during switching transients. Operation above 16V voids guaranteed performance and may trigger UVLO or damage internal structures.
How does the tri-state PWM function enable diode emulation mode?
When PWM is driven to 1.1–1.8V (tri-state window) or left floating, the internal current source pulls it to ~1.4V, turning off the HS-FET and enabling LS-FET conduction during positive inductor current. The LS-FET turns off automatically at zero-current crossing, eliminating body-diode conduction losses without external ZCD circuitry.
Can MP86956GMJ-P be used in single-phase applications without a multi-phase controller?
Yes - it functions as a standalone half-bridge stage with tri-state PWM input, current sense (IOUT), and thermal/fault reporting (TOUT/FLT). External controllers such as TI's UCD90x or Infineon's IR352xx can directly interface using standard PWM, EN, and analog sense signals without modification.
What is the purpose of the 2.2Ω resistor between VDRV and VDD?
The 2.2Ω resistor isolates VDRV (driver supply) from VDD (logic supply) to prevent gate-drive noise from coupling into the analog and digital control circuits. This improves PWM timing stability, reduces IOUT offset drift, and maintains clean EN and fault reporting behavior under high dI/dt conditions.
How is over-temperature protection implemented and reset?
Over-temperature protection triggers at TJ = 160°C, latching off the HS-FET and pulling TOUT/FLT to VDD. The fault persists until EN is toggled low-high or VIN/VDD is power-cycled. No automatic recovery occurs - this ensures thermal safety before resuming operation.
What layout practices minimize switching losses and EMI in MP86956GMJ-P designs?
Key practices include placing input MLCCs directly on VIN/PGND pads, using ≥8 vias per PGND pad, routing BST and VDRV caps within 2mm of their pins, avoiding vias in the BST path, and separating IOUT traces from SW/PWM nodes by ≥3mm. A solid inner-layer VIN plane (positive/negative/positive stackup) reduces input loop inductance by >60%.
Is MP86956GMJ-P pin-compatible with earlier revisions like MP86956GMJ?
Yes - MP86956GMJ-P is a qualified production version of MP86956GMJ with identical pinout, electrical specs, and thermal characteristics. The "-P" suffix denotes enhanced manufacturing screening and extended temperature validation per Rev. 1.3, with no functional or mechanical changes.
MP86956GMJ-P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Monolithic Power Systems Inc.
- Series:
- Intelli-Phase™
- Package/Case:
- 41-PowerVFLGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- NMOS
- Rds On (Typ):
- -
- Current - Output / Channel:
- 70A
- Current - Peak Output:
- 125A
- Voltage - Supply:
- 3V ~ 3.6V
- Voltage - Load:
- 3V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Diode Emulation, Status Flag
- Fault Protection:
- Current Limiting, Over Temperature, Short Circuit, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 41-LGA (5x6)
MP86956GMJ-P FAQ
1.How can I place an order for MP86956GMJ-P through Aetrix?
Please submit a Request for Quotation (RFQ) for MP86956GMJ-P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MP86956GMJ-P reliable?
The price and inventory of MP86956GMJ-P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP86956GMJ-P is usually 5 days.
3.What payment methods are accepted for MP86956GMJ-P?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP86956GMJ-P transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MP86956GMJ-P?
MP86956GMJ-P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MP86956GMJ-P order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MP86956GMJ-P?
For technical support, including MP86956GMJ-P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP86956GMJ-P requirements.
6.How does Aetrix verify that MP86956GMJ-P is sourced from the original manufacturer or authorized distributors?
All MP86956GMJ-P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP86956GMJ-P meets industry standards.
7.What is the process for return or replacement of MP86956GMJ-P?
All MP86956GMJ-P units undergo pre-shipment inspection (PSI). If there is an issue with MP86956GMJ-P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MP86956GMJ-P part is unused and in its original packaging.
Return procedure for MP86956GMJ-P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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