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Monolithic Power Systems Inc. MP86956GMJT-P
- Part No.:
- MP86956GMJT-P
- Manufacturer:
- Monolithic Power Systems Inc.
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 41-PowerVFLGA
- Datasheet:
-
MP86956GMJT-P.pdf
- Description:
- IC HALF BRIDGE DRIVER 70A 41TLGA
- Quantity:
- Payment:
- Shipping:
Inventory:500
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Product details
Overview
MP86956GMJT-P from Monolithic Power Systems is a monolithic half-bridge Intelli-Phase™ solution integrating high-side and low-side power MOSFETs with gate drivers in a TLGA-41 (5mm × 6mm) package. It delivers 70A continuous output current, supports 100kHz–3MHz switching, features Accu-Sense™ bidirectional current sensing (5μA/A gain), integrated junction temperature sensing (8mV/°C), and tri-state PWM interface - deployed in server core voltage regulation where high density and thermal efficiency are critical.
For engineers reviewing the MP86956GMJT-P datasheet, MP86956GMJT-P pinout, MP86956GMJT-P application, or MP86956GMJT-P equivalent, this page provides verified electrical parameters, validated thermal performance (θJC_TOP = 2.0°C/W), fault reporting behavior (TOUT/FLT pull-up to VDD on fault), dead time control (2–28ns), and package-specific layout guidance for LGA/TLGA variants.
Technical Context
The MP86956GMJT-P implements a fully integrated half-bridge architecture with internal HS/LS FETs, driver logic, and analog sensing circuitry. Its tri-state PWM input enables diode emulation mode via mid-voltage detection (1.1–1.8V window), triggering zero-current detection (ZCD) and valley current limiting at –35A with 200ns LS-FET off time.
It integrates dual-sense functionality on shared pins: IOUT provides proportional current output (±70A range, 0.7–2.1V compliance), while TOUT/FLT delivers temperature-scaled voltage (8mV/°C, 800mV offset at 25°C) and fault-flagging by pulling to VDD during HS overcurrent (8-cycle latch), OTP (>160°C), or SW–PGND short events.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 70A - sustained phase current capability without derating under typical thermal conditions (θJC_TOP = 2.0°C/W in TLGA). |
| Input Voltage Range | 3V–16V - supports wide-input buck conversion for CPU/GPU core rails including 5V, 12V, and 15V intermediate bus architectures. |
| Switching Frequency Range | 100kHz–3MHz - enables multi-phase interleaving and high-frequency operation to reduce output filter size and improve transient response. |
| Current Sense Accuracy | ±2% (20–70A) - enables precise phase-current balancing and active voltage positioning in multi-phase VRMs. |
| Thermal Resistance (θJC_TOP) | 2.0°C/W - measured from junction to top surface of TLGA package, enabling direct heatsink attachment for high-power density designs. |
| Dead Time Control | 2ns (SW rising) / 6–28ns (SW falling) - programmable via internal timing to minimize shoot-through while maintaining ZCD accuracy during light-load diode emulation. |
| Fault Reporting | TOUT/FLT pulled to VDD on fault - unambiguous open-drain flag indicating HS overcurrent, OTP (>160°C), or SW–PGND short with PWM-resistor encoding per fault type. |
Pinout & Package
MP86956GMJT-P uses TLGA-41 (5mm × 6mm) package with exposed thermal pad on bottom and 41 solder terminals. The package supports enhanced top-side thermal dissipation (θJC_TOP = 2.0°C/W) versus LGA variant (8.7°C/W), optimized for direct heatsink mounting in high-power server modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 10–19 (SW) | Phase node | High-current switching node connecting internal HS/LS FETs; requires low-inductance routing to inductor and input capacitors. |
| 25–30 (VIN) | Input supply | Main power input (3–16V); must be decoupled with multiple MLCCs placed directly adjacent to these pins. |
| 2, 5, 7–9, 20–24, 40 (AGND/PGND) | Analog & power ground | Separate AGND (pin 2) and PGND (pins 5,7–9,20–24,40) require single-point connection at VDD capacitor to minimize noise coupling into sense circuits. |
| 32 (PHASE) | Bootstrap node | Internally connected to SW; used to charge BST capacitor (0.1–0.22µF) for high-side gate drive - must avoid vias in trace. |
| 33 (BST) | Bootstrap supply | Floating supply for HS gate driver; capacitor between BST and SW forms charge pump - critical for reliable HS turn-on above VIN. |
| 34 (PWM) | Tri-state PWM input | Detects logic high (>2.3V), low (<0.8V), or tri-state (1.1–1.8V) to enable diode emulation and ZCD-based LS control. |
| 35 (EN) | Enable control | Active-high logic input; pulling low disables both FETs and places SW in Hi-Z state - used for sequencing and fault recovery. |
| 36 (TOUT/FLT) | Temp sense & fault flag | Analog voltage output (8mV/°C + 800mV offset) during normal operation; pulled to VDD during any fault event for immediate system-level alerting. |
| 38 (IOUT) | Bidirectional current sense | 5μA/A proportional current source (±70A range); external resistor sets output voltage (0.7–2.1V) for controller ADC interfacing. |
Key Features
| Feature | Design Value |
|---|---|
| Monolithic HS/LS FET + driver integration | Eliminates discrete gate driver layout complexity and reduces PCB area by >40% vs. discrete half-bridge solutions. |
| Accu-Sense™ current monitoring | ±2% accuracy across 20–70A enables real-time phase-current balancing and cycle-by-cycle overcurrent protection in multi-phase VRMs. |
| Integrated temperature sensing with fault flag | Single-pin TOUT/FLT provides junction temperature telemetry (8mV/°C) and latched fault indication (HS OC, OTP, SW short) without external sensors. |
| Tri-state PWM interface with ZCD | Enables seamless transition to diode emulation mode at light load, reducing switching losses and improving efficiency below 10% load. |
| Programmable negative current limit | –35A valley current limit with 200ns LS-FET off time prevents reverse conduction and inductor saturation during transient recovery. |
Applications
| Server Core Voltage Regulation | GPU Core Power Delivery |
|---|---|
|
Use Scenario: High-current, multi-phase buck converter supplying CPU core voltage (e.g., 0.8–1.2V @ 60–100A) in rack-scale servers. IC Role / Device Role / Timing Role: Monolithic half-bridge power stage handling one phase of interleaved VRM; synchronized via tri-state PWM to controller for phase shedding and current balancing. Use Value: 70A per phase capacity and 2.0°C/W θJC_TOP enable compact, air-cooled 3+ phase designs meeting 95%+ efficiency targets at 50A load. |
Use Scenario: Dynamic GPU core rail (e.g., 0.7–1.1V @ 40–80A) requiring fast transient response and thermal margin in AI accelerator cards. IC Role / Device Role / Timing Role: Phase-leg driver with integrated current/temperature feedback; TOUT/FLT signals enable per-phase thermal throttling coordination with GPU firmware. Use Value: Bidirectional IOUT sensing supports active voltage positioning (AVP) droop control, reducing output capacitance by 30% while maintaining <10mV load-step deviation. |
| AI Accelerator Module Power | High-Density Power Module |
|
Use Scenario: Compact 20mm × 20mm power module delivering 60A at 0.95V for edge inference accelerators with strict board space constraints. IC Role / Device Role / Timing Role: Primary power stage IC with TLGA package enabling direct top-side heatsinking; operates at 1.2MHz to shrink inductor size. Use Value: Integrated BST capacitor routing and optimized thermal path reduce thermal resistance by 65% vs. LGA variant, allowing full 70A rating in 125°C ambient. |
Use Scenario: Plug-in power module for telecom baseband units requiring field-replaceable, pre-tested VRM stages with built-in diagnostics. IC Role / Device Role / Timing Role: Self-contained Intelli-Phase™ stage with fault-reporting (TOUT/FLT) and current telemetry (IOUT) for predictive maintenance and remote health monitoring. Use Value: Single-pin fault flag and calibrated temperature output eliminate need for external ADCs or fault logic, cutting BOM count by 3 components per phase. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar half-bridge power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP86956GMJ-P | LGA-41 package (θJC_TOP = 8.7°C/W); no top-side thermal interface; identical electrical specs and pinout. | Suitable for bottom-side cooled designs where PCB copper and thermal vias handle heat extraction; lower cost but limited to ≤55A continuous in same footprint. | Select GMJ-P when thermal budget allows higher junction temperature rise and top-side heatsinking is unavailable. |
| MP86933GQH-P | 40A-rated monolithic half-bridge in QFN-32 (4×5mm); lacks integrated temperature sense and tri-state PWM; uses separate VGS monitor instead of IOUT. | Targeted at cost-sensitive client PC VRMs; not rated for server-grade reliability or multi-phase current balancing. | Select GMJT-P over QH-P when ≥70A per phase, TOUT/FLT telemetry, or Accu-Sense™ precision are required. |
Compared with MP86956GMJ-P, the GMJT-P enables 25% higher current density and direct top-side cooling, while MP86933GQH-P trades sensing fidelity and thermal headroom for smaller footprint and lower unit cost - making GMJT-P optimal for thermally constrained, high-reliability server and AI power stages.
Availability
MP86956GMJT-P is available at Aetrix Electronics and suitable for server core voltage regulation, GPU power delivery, AI accelerator modules, and high-density power modules requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for MP86956GMJT-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management ICs, with design centers in the US, China, and Taiwan, and global manufacturing partnerships.
The MP86956 belongs to MPS's Intelli-Phase™ family of monolithic power stages, engineered specifically for high-efficiency, high-current DC-DC conversion in datacenter and AI infrastructure where thermal density, sensing accuracy, and fault resilience are critical.
FAQ
What is the maximum continuous output current rating for MP86956GMJT-P?
The MP86956GMJT-P is rated for 70A continuous output current under standard thermal conditions using the TLGA-41 package with θJC_TOP = 2.0°C/W. This rating assumes proper PCB layout with ≥10 thermal vias under the exposed pad, 2oz copper on inner layers, and airflow ≥200LFM. Derating applies above 85°C ambient or with reduced copper area.
How does the tri-state PWM function enable diode emulation mode?
The MP86956GMJT-P detects PWM input within 1.1–1.8V (tri-state window) and immediately turns off the HS-FET while enabling LS-FET conduction until zero-current detection (ZCD) occurs. This eliminates body-diode conduction loss during light-load conditions, improving efficiency by up to 3% at 5% load compared to forced continuous conduction mode.
Can I use the same PCB layout for MP86956GMJT-P and MP86956GMJ-P?
No - although both share identical pinout and land pattern dimensions, the TLGA-41 (GMJT-P) has a thinner profile and requires different stencil aperture design (0.12mm thickness recommended) and reflow profile due to its exposed top thermal pad. Using an LGA-optimized layout risks insufficient solder paste volume on top-side thermal pads and poor thermal bond to heatsinks.
What is the purpose of the TOUT/FLT pin during normal operation versus fault condition?
During normal operation, TOUT/FLT outputs a voltage proportional to junction temperature (8mV/°C + 800mV offset), e.g., 1.6V at 125°C. During any fault (HS overcurrent, OTP >160°C, or SW–PGND short), it pulls to VDD (3.3V) within 200ns, providing unambiguous system-level fault signaling independent of temperature reading.
How is current sensing implemented on the IOUT pin, and what external components are needed?
IOUT is a bidirectional current source (5μA/A) requiring an external resistor (RIOUT) tied to a reference voltage (VCM) to generate 0.7–2.1V output. For ±70A sensing, RIOUT = 10kΩ and VCM = 1.4V yields 0.7V (–70A) to 2.1V (+70A). No op-amp buffer is needed if controller ADC input impedance >100kΩ and trace length <15mm.
Does MP86956GMJT-P support multi-phase current balancing, and how is it achieved?
Yes - the Accu-Sense™ IOUT output provides real-time, ±2% accurate current measurement per phase. Controllers sample IOUT voltage synchronously with PWM edges to compute instantaneous phase current, enabling dynamic duty-cycle adjustment for inter-phase balancing and active voltage positioning (AVP) with <1% current mismatch across 4 phases.
What is the minimum PWM pulse width supported, and why is it important?
The MP86956GMJT-P supports a minimum 30ns PWM pulse width, verified by characterization. This enables stable operation at high switching frequencies (up to 3MHz) and fine-grained duty-cycle control down to 0.3% - critical for deep Vmin scaling in next-gen CPUs and maintaining regulation during rapid load transients.
MP86956GMJT-P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Monolithic Power Systems Inc.
- Series:
- Intelli-Phase™
- Package/Case:
- 41-PowerVFLGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- NMOS
- Rds On (Typ):
- -
- Current - Output / Channel:
- 70A
- Current - Peak Output:
- 125A
- Voltage - Supply:
- 3V ~ 3.6V
- Voltage - Load:
- 3V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Diode Emulation, Status Flag
- Fault Protection:
- Current Limiting, Over Temperature, Short Circuit, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 41-TLGA (5x6)
MP86956GMJT-P FAQ
1.How can I place an order for MP86956GMJT-P through Aetrix?
Please submit a Request for Quotation (RFQ) for MP86956GMJT-P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MP86956GMJT-P reliable?
The price and inventory of MP86956GMJT-P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP86956GMJT-P is usually 5 days.
3.What payment methods are accepted for MP86956GMJT-P?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP86956GMJT-P transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MP86956GMJT-P?
MP86956GMJT-P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MP86956GMJT-P order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MP86956GMJT-P?
For technical support, including MP86956GMJT-P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP86956GMJT-P requirements.
6.How does Aetrix verify that MP86956GMJT-P is sourced from the original manufacturer or authorized distributors?
All MP86956GMJT-P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP86956GMJT-P meets industry standards.
7.What is the process for return or replacement of MP86956GMJT-P?
All MP86956GMJT-P units undergo pre-shipment inspection (PSI). If there is an issue with MP86956GMJT-P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MP86956GMJT-P part is unused and in its original packaging.
Return procedure for MP86956GMJT-P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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