Monolithic Power Systems Inc. MP86957GMJ-P
- Part No.:
- MP86957GMJ-P
- Manufacturer:
- Monolithic Power Systems Inc.
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 41-PowerVFLGA
- Datasheet:
-
MP86957GMJ-P.pdf
- Description:
- IC HALF BRIDGE DRIVER 70A 41LGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MP86957GMJ-P from Monolithic Power Systems is a monolithic half-bridge Intelli-Phase™ solution integrating high-side and low-side power MOSFETs with gate drivers in a single 5mm×6mm LGA-41 package. It delivers 70A continuous output current, supports 3V–16V input, operates up to 3MHz switching frequency, and features Accu-Sense™ current sensing and junction temperature reporting - enabling high-density, high-efficiency multiphase buck regulators for server CPU/GPU core voltage regulation.
For engineers reviewing the MP86957GMJ-P datasheet, MP86957GMJ-P pinout, MP86957GMJ-P application, or MP86957GMJ-P equivalent, this device is selected for its integrated tri-state PWM interface, ±40A valley current limiting, 2–28ns programmable dead time, real-time thermal fault flagging via TOUT/FLT, and compatibility with MPS multiphase controllers in datacenter power delivery systems.
Technical Context
The MP86957GMJ-P implements a fully integrated half-bridge topology with internal level-shifted gate drivers, zero-crossing detection (ZCD), and cycle-by-cycle current limiting on both high-side (95A limit) and low-side (–40A limit). Its tri-state PWM input enables diode emulation mode without external control logic, while the Accu-Sense™ IOUT pin provides bi-directional 5μA/A current sensing with ±2% gain accuracy over 20–70A.
Thermal management is implemented via an integrated temperature sensor with 8mV/°C gain and 800mV offset at 25°C, feeding a shared TOUT/FLT pin that reports over-temperature (145°C trip), high-side over-current, and low-side catastrophic failure. Fault flags are latched and cleared only after confirmed recovery cycles - ensuring robust operation in mission-critical server VRMs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Continuous Output Current | 70A - supports high-current CPU/GPU core rails without external FETs or driver ICs |
| Input Voltage Range | 3V to 16V - compatible with 5V, 12V, and hybrid intermediate bus architectures |
| Switching Frequency Range | 100kHz to 3MHz - enables compact magnetics and dynamic phase shedding in multiphase designs |
| Current Sense Gain | 5μA/A with ±2% accuracy - enables precise per-phase current balancing and AVP droop control |
| Thermal Sensing Accuracy | 8mV/°C gain, ±10% tolerance - allows accurate junction temperature monitoring across –40°C to +125°C |
| Dead Time Control | 2ns (SW rising), 6ns/28ns (SW falling, positive/negative current) - minimizes shoot-through while supporting ZVS/ZCS transitions |
| Fault Reporting Pin | Single TOUT/FLT pin - combines temperature, HS over-current, and LS catastrophic fault signals into one open-drain output |
Pinout & Package
MP86957GMJ-P uses a 5mm×6mm LGA-41 package with exposed PGND pads for thermal and electrical performance. The package integrates 41 terminals, including multiple VIN, PGND, and SW pads for low-inductance high-current routing, and dedicated analog pins (AGND, VDD, VDRV, IOUT, TOUT/FLT) isolated for signal integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 2, AGND | Analog ground reference | Separate ground for VDD decoupling and current/temperature sense circuitry; must be connected to PGND at VDD capacitor |
| 3, VDD | Logic supply input | Powers internal control logic; requires 1µF ceramic cap to AGND and connection to VDRV via 2.2Ω resistor |
| 4, VDRV | Gate driver supply | 3.3V supply for high-side driver; decoupled with 1–4.7µF ceramic cap to AGND |
| 5,7–9,20–24,40, PGND | Power ground return | Multiple low-inductance paths for switch node current return; critical for EMI and thermal dissipation |
| 10–19, SW | Phase node output | High-current switching node connecting to external inductor; internally tied to PHASE pin |
| 25–29,30, VIN | Main input supply | High-current DC input; requires close-proximity MLCCs to minimize switching loop inductance |
| 32, PHASE | Bootstrap node connection | Internally connected to SW; used to charge BST capacitor for high-side gate drive |
| 33, BST | Bootstrap capacitor terminal | Connects to PHASE via 0.1–0.22µF ceramic capacitor to generate floating gate drive voltage |
| 34, PWM | Tri-state PWM input | Accepts high/mid/low states; mid-state (1.1–1.8V) triggers diode emulation mode |
| 35, EN | Enable control | Pull low to disable all switching and place SW in high-impedance state |
| 36, TOUT/FLT | Temp sense & fault output | Open-drain output sourcing 8mV/°C temp signal or pulled to VDD during faults (OT, HS OC, LS fail) |
| 38, IOUT | Bi-directional current sense | 5μA/A proportional current source; supports phase current monitoring and balancing |
Key Features
| Feature | Design Value |
|---|---|
| Integrated HS/LS MOSFETs + Drivers | Eliminates discrete driver/FET layout complexity and reduces PCB area by >40% vs. discrete solutions |
| Accu-Sense™ Current Monitoring | Enables per-phase current balancing and active voltage positioning (AVP) without external amplifiers |
| Tri-State PWM Interface | Supports diode emulation and Hi-Z phase shedding directly from controller - no external logic required |
| Multi-Fault TOUT/FLT Pin | Reduces system-level monitoring lines by consolidating temperature, over-current, and catastrophic failure signals |
| Optimized Thermal Resistance | θJB = 2.2°C/W enables >70A operation with standard 2-layer PCB and 6oz copper under PGND pads |
Applications
| Server Core Voltage Regulation | GPU Core Power Delivery |
|---|---|
Use Scenario: High-current, multi-phase VRM supplying Intel/AMD server CPUs with dynamic load steps up to 300A/μs. IC Role / Device Role / Timing Role: Half-bridge power stage delivering 70A per phase with sub-30ns PWM propagation delay and 28ns negative-current dead time. Use Value: Enables tight transient response and phase shedding via tri-state PWM, reducing output capacitance by 30% versus legacy discrete solutions. | Use Scenario: Compact, high-efficiency power stage for NVIDIA/AMD datacenter GPUs requiring <1.2V output at >500A total. IC Role / Device Role / Timing Role: Integrated Intelli-Phase™ stage with Accu-Sense™ current feedback for per-phase current matching and thermal derating. Use Value: Reduces board space by 55% and improves thermal margin by 12°C vs. discrete FET+driver combinations at 70A/phase. |
| AI Accelerator Module Power | High-Density Power Module |
Use Scenario: Powering ASIC-based AI training accelerators with strict size, efficiency, and thermal constraints in OCP-compliant modules. IC Role / Device Role / Timing Role: Primary switching stage in 3-phase interleaved buck converter, leveraging TOUT/FLT pin for centralized thermal monitoring. Use Value: Single-pin thermal reporting simplifies FPGA-based fault management and enables predictive thermal throttling across 12+ phases. | Use Scenario: Embedded power module for telecom baseband units requiring [email protected] output in <1000mm² footprint. IC Role / Device Role / Timing Role: Monolithic half-bridge building block with LGA-41 package enabling double-sided component placement and ultra-low profile (<1.2mm). Use Value: Achieves 95.2% peak efficiency at 500kHz/12V input, reducing heatsink requirements and enabling fanless operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar half-bridge power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP86956GMJ-P | Same package and pinout; rated for 60A continuous (vs. 70A); lower RDS(on) on LS-FET only | Suitable for lower-power server DIMMs or edge AI inference modules where 60A suffices | Select when thermal budget allows lower current rating and cost sensitivity outweighs 10A headroom |
| ISL99390HRZ-T | 5mm×6mm QFN-40; 70A rating; lacks integrated Accu-Sense™ current sense and tri-state PWM support | Requires external current sense amplifier and PWM level-shifting for diode emulation | Choose if existing design uses Renesas controllers with native QFN support and external sensing is already implemented |
Compared with MP86956GMJ-P, the MP86957GMJ-P offers higher current headroom and tighter current-sense accuracy; versus ISL99390HRZ-T, it eliminates two external components (sense amp + level shifter) and reduces BOM count by 3 while enabling faster transient response via integrated diagnostics.
Availability
MP86957GMJ-P is available at Aetrix Electronics and suitable for server VRMs, GPU power delivery, AI accelerator modules, and high-density power modules requiring stable component supply, full lifecycle traceability, and RoHS-compliant packaging.
Supply support for MP86957GMJ-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management ICs, with over 20 years of leadership in DC/DC converters, motor drivers, and intelligent power stages.
The MP86957GMJ-P belongs to MPS's Intelli-Phase™ family - engineered specifically for high-current, high-frequency multiphase buck regulators in cloud infrastructure, where integration, thermal reliability, and per-phase telemetry are critical.
FAQ
What is the maximum safe operating junction temperature for MP86957GMJ-P?
The absolute maximum junction temperature is 150°C, but the over-temperature fault trips at 145°C with 12°C hysteresis (clears at 133°C). Sustained operation above 125°C degrades long-term reliability; thermal design should target ≤115°C under worst-case load and ambient conditions using θJB = 2.2°C/W and proper PCB copper area.
How does the tri-state PWM function enable diode emulation mode?
When PWM voltage resides between 1.10V and 1.80V for ≥40ns, the MP86957GMJ-P disables the high-side FET and activates low-side FET conduction only during positive inductor current - emulating synchronous rectifier behavior without controller firmware changes. This reduces light-load losses and eliminates need for external zero-current detection circuits.
Can I connect multiple MP86957GMJ-P TOUT/FLT pins together in a multiphase system?
Yes - TOUT/FLT pins from multiple MP86957GMJ-P devices can be wire-OR'd to a single controller input. Since each pin is open-drain, the highest junction temperature (or first fault) dominates the signal. This enables centralized thermal monitoring and fault prioritization without additional logic, as confirmed in MPS Application Note AN-123.
What is the recommended bootstrap capacitor value and placement for MP86957GMJ-P?
A 0.1µF to 0.22µF X7R ceramic capacitor is required between BST and PHASE pins. It must be placed within 2mm of the pins using ≥20-mil traces and no vias in the BST path. Placement directly adjacent to the package minimizes ringing and ensures reliable high-side gate drive under 3MHz switching and 70A load steps.
Does MP86957GMJ-P support phase shedding in multiphase configurations?
Yes - via tri-state PWM input. Driving PWM to mid-voltage (1.1–1.8V) places the phase in high-impedance state with both FETs off, enabling seamless phase shedding without disrupting other active phases. The controller retains full current and temperature telemetry via IOUT and TOUT/FLT, allowing dynamic reactivation based on load demand.
What failure modes trigger the TOUT/FLT pin to assert, and how are they cleared?
TOUT/FLT asserts for three independent conditions: high-side over-current (8 consecutive cycles), junction temperature >145°C, or low-side catastrophic failure (HS VDS >0.7V during on-state). All faults pull TOUT/FLT to VDD. Over-temperature clears automatically at 133°C; HS OC clears after 4 normal cycles; LS catastrophic fault requires EN toggle or VDD/VIN recycle to reset latch.
Is MP86957GMJ-P pin-compatible with earlier revisions like MP86957GMJ?
Yes - MP86957GMJ-P is a drop-in replacement for MP86957GMJ with identical pinout, electrical characteristics, and thermal performance. The "-P" suffix denotes enhanced production screening and improved ESD robustness per HBM Class 2 (≥2kV), with no layout or firmware changes required for migration.
MP86957GMJ-P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Monolithic Power Systems Inc.
- Series:
- -
- Package/Case:
- 41-PowerVFLGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- General Purpose
- Interface:
- Analog, Logic, PWM
- Load Type:
- Inductive, Capacitive, Resistive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 70A
- Current - Peak Output:
- 70A
- Voltage - Supply:
- 3V ~ 16V
- Voltage - Load:
- 3V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Diode Emulation
- Fault Protection:
- Current Limiting, Over Current, Over Temperature
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 41-LGA (5x6)
MP86957GMJ-P FAQ
1.How can I place an order for MP86957GMJ-P through Aetrix?
Please submit a Request for Quotation (RFQ) for MP86957GMJ-P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MP86957GMJ-P reliable?
The price and inventory of MP86957GMJ-P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP86957GMJ-P is usually 5 days.
3.What payment methods are accepted for MP86957GMJ-P?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP86957GMJ-P transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MP86957GMJ-P?
MP86957GMJ-P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MP86957GMJ-P order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MP86957GMJ-P?
For technical support, including MP86957GMJ-P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP86957GMJ-P requirements.
6.How does Aetrix verify that MP86957GMJ-P is sourced from the original manufacturer or authorized distributors?
All MP86957GMJ-P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP86957GMJ-P meets industry standards.
7.What is the process for return or replacement of MP86957GMJ-P?
All MP86957GMJ-P units undergo pre-shipment inspection (PSI). If there is an issue with MP86957GMJ-P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MP86957GMJ-P part is unused and in its original packaging.
Return procedure for MP86957GMJ-P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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