Monolithic Power Systems Inc. MP86962GMJT-P
- Part No.:
- MP86962GMJT-P
- Manufacturer:
- Monolithic Power Systems Inc.
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 41-PowerVFLGA
- Datasheet:
-
MP86962GMJT-P.pdf
- Description:
- 80A, RADIATION-TOLERANT INTELLI-
- Quantity:
- Payment:

- Shipping:

Inventory:415
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MP86962GMJT-P from Monolithic Power Systems is a radiation-tolerant, monolithic half-bridge DrMOS power stage integrating high- and low-side MOSFETs, gate drivers, current sense (5 μA/A), temperature sense (8 mV/°C), and fault reporting in a single TLGA-41 (5mm×6mm) package. It delivers up to 80 A continuous output current across 3–16 V input voltage, supports 100 kHz–3 MHz switching, and enables tri-state PWM control for diode emulation in server core voltage regulation.
For engineers reviewing the MP86962GMJT-P datasheet, MP86962GMJT-P pinout, MP86962GMJT-P application, or MP86962GMJT-P equivalent, key selection criteria include its 80 A current capability, integrated Accu-Sense™ current sensing, junction temperature monitoring via TOUT/FLT, dead time control (2–28 ns), and radiation tolerance for high-reliability computing environments.
Technical Context
The MP86962GMJT-P implements a monolithic half-bridge architecture with integrated silicon-based power FETs and driver logic, eliminating external gate drive components and minimizing parasitic inductance. Its tri-state PWM interface enables seamless transition into diode emulation mode upon detection of zero-crossing current (ZCD), supporting high-efficiency light-load operation in multi-phase buck converters.
It features cycle-by-cycle overcurrent protection with 110 A high-side limit and –35 A low-side valley limit, plus over-temperature shutdown at 160 °C. Fault reporting is consolidated on the TOUT/FLT pin, which outputs either analog temperature voltage (8 mV/°C, 800 mV offset) or digital pull-up to VDD during HS OC, OTP, or SW-to-PGND short events.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | 80 A continuous - supports high-density CPU/GPU core rail designs without external parallel stages. |
| Input Voltage Range | 3 V to 16 V - compatible with 5 V, 12 V, and 15 V intermediate bus architectures. |
| Switching Frequency | 100 kHz to 3 MHz - enables compact magnetics and dynamic phase shedding in VR13/VR14-compliant systems. |
| Current Sense Gain | 5 μA/A ±2% - provides precise bidirectional inductor current feedback for phase balancing and OCP. |
| Temperature Sense | 8 mV/°C with 800 mV offset at 25 °C - enables real-time junction thermal monitoring without external sensors. |
| Dead Time | 2 ns (SW rising) to 28 ns (SW falling) - minimizes shoot-through risk while preserving efficiency at high frequencies. |
| Fault Reporting | Single-pin TOUT/FLT - analog temperature output or digital VDD pull-up indicating HS OC, OTP, or SW–PGND short. |
Pinout & Package
MP86962GMJT-P uses a TLGA-41 (5 mm × 6 mm) thermally enhanced land-grid array package with exposed PGND pads for low-inductance, high-current routing and efficient heat dissipation to the PCB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 2, AGND | Analog ground reference | Isolates sensitive analog circuitry (VDD decoupling, IOUT, TOUT/FLT); must tie to PGND only at VDD capacitor node. |
| 3, VDD | Internal logic supply | 3–3.6 V supply for control logic; requires 1 μF ceramic cap to AGND and 2.2 Ω series resistor from VDRV. |
| 4, VDRV | Gate driver supply | 3.3 V dedicated supply for high-side driver; decoupled with 1–4.7 μF ceramic cap to PGND. |
| 34, PWM | Tri-state modulation input | Accepts high/low/middle-voltage states; middle state (1.1–1.8 V) triggers diode emulation mode via ZCD detection. |
| 35, EN | Enable control | Pull low to disable all FETs and place SW in Hi-Z; used for sequencing and fault recovery. |
| 36, TOUT/FLT | Temp sense & fault indicator | Analog temp output (8 mV/°C) when active; pulled to VDD during faults - identifies HS OC, OTP, or SW–PGND short. |
| 38, IOUT | Bidirectional current sense | 5 μA/A proportional output; supports external resistor scaling for controller ADC input (0.7–2.1 V range). |
| 10–19, 32, SW | Phase node | High-current switching node connecting internal HS/LS FETs; tied internally to PHASE pin; requires low-inductance layout. |
| 5,7–9,20–24,29,30,40, PGND | Power ground return | Multiple low-impedance PGND terminals - must be connected to large copper pour and vias under package for thermal and EMI control. |
| 25–28, VIN | Main input supply | 3–16 V input; requires multiple 0805/0402 MLCCs placed adjacent to VIN/PGND pins to minimize switching loop inductance. |
Key Features
| Feature | Design Value |
|---|---|
| Radiation-tolerant design | Qualified for space-grade and high-reliability server applications where single-event effects must be mitigated. |
| Accu-Sense™ current monitoring | ±2% gain accuracy (20–80 A), enabling precise per-phase current balancing and fast OCP response in multi-phase VRs. |
| Integrated temperature sensing | Junction temperature reported continuously via TOUT/FLT pin - eliminates need for external thermal sensors in VR modules. |
| Tri-state PWM interface | Supports seamless transition between PWM and diode emulation modes without external logic, reducing light-load losses. |
| Comprehensive fault protection | HS current limit (110 A), LS valley limit (–35 A), OTP (160 °C), and SW–PGND short detection - all reported on single TOUT/FLT pin. |
Applications
| Server Core Voltage Regulation | GPU Power Delivery |
|---|---|
|
Use Scenario: High-current, dynamically scaled CPU core rails in dual-socket x86 servers requiring >60 A per phase and VR14 compliance. IC Role / Device Role / Timing Role: Monolithic DrMOS power stage delivering regulated 0.8–1.8 V output with sub-100 ns PWM-to-SW propagation delay and adaptive dead time. Use Value: Enables 95%+ efficiency at 80 A/1.2 V with minimal footprint, replacing discrete driver + MOSFET solutions and reducing BOM count by 40%. |
Use Scenario: Multi-phase GPU core regulators in AI accelerators and data center graphics cards operating at 1.0–1.3 V with rapid load transients. IC Role / Device Role / Timing Role: Intelli-Phase™ power stage providing synchronized current sensing and thermal telemetry across 6–12 phases. Use Value: Delivers accurate per-phase current data (±2%) to controller for dynamic phase shedding, improving transient response by 30% vs. legacy DrMOS. |
| AI Accelerator Power Modules | High-Density Telecom VRMs |
|
Use Scenario: Compact, thermally constrained power modules for ASIC-based AI training chips requiring 80 A+ per phase in 1U chassis. IC Role / Device Role / Timing Role: Radiation-tolerant DrMOS stage with integrated TOUT/FLT reporting, enabling predictive thermal throttling and fault isolation. Use Value: Reduces thermal sensor count and simplifies firmware thermal management - junction temp sensed directly with 8 mV/°C linearity. |
Use Scenario: Space-constrained 48 V-to-12 V intermediate bus converters feeding downstream point-of-load regulators in 5G baseband units. IC Role / Device Role / Timing Role: High-frequency (2–3 MHz) DrMOS stage supporting small inductors and ultra-fast transient response (<5 μs). Use Value: Achieves 93% efficiency at 3 MHz switching while maintaining <2 ns dead time - cuts solution size by 35% versus 500 kHz alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar monolithic DrMOS power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon IR35221 | 60 A rated, 30 V max VIN, no integrated temperature sense; uses separate TSEN pin and external thermal diode. | Lacks single-pin TOUT/FLT functionality; requires external thermal monitoring circuitry for junction temp reporting. | Choose when lower current rating suffices and cost sensitivity outweighs thermal telemetry integration. |
| Vishay SiC8xx Series | 70 A rated, 12 V max VIN, supports 1.2 V logic; no tri-state PWM - requires external level shifter for diode emulation. | Does not support native tri-state PWM; diode emulation requires additional controller-level logic and timing coordination. | Prefer when 12 V-only input and SiC FET benefits (e.g., higher frequency, lower Qg) are prioritized over ease of implementation. |
Compared with IR35221 and SiC8xx, MP86962GMJT-P uniquely integrates radiation tolerance, 80 A capacity, tri-state PWM, and single-pin temperature/fault reporting - making it optimal for next-gen server VRMs where reliability, density, and telemetry consolidation are critical.
Availability
MP86962GMJT-P is available at Aetrix Electronics and suitable for server core voltage regulation, GPU power delivery, AI accelerator power modules, and high-density telecom VRMs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for MP86962GMJT-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management ICs, with expertise in DC/DC conversion, motor drivers, and integrated power stages since 1997.
The MP86962 belongs to MPS's Intelli-Phase™ DrMOS product line, designed specifically for high-current, high-efficiency, radiation-hardened computing power delivery in data centers and aerospace-grade systems.
FAQ
What is the maximum continuous output current supported by MP86962GMJT-P?
The MP86962GMJT-P delivers up to 80 A continuous output current under typical thermal conditions (TJ ≤ 125 °C, proper PCB layout with ≥6 thermal vias per PGND pad). Peak instantaneous current capability is 125 A, limited by absolute maximum ratings and layout-dependent thermal resistance (θJB = 2.7 °C/W).
How does the tri-state PWM function enable diode emulation mode?
When the PWM input voltage resides within the 1.1–1.8 V tri-state window for ≥40 ns, the MP86962GMJT-P disables the high-side FET and activates diode emulation on the low-side FET. The LS-FET remains on during positive inductor current and turns off after zero-current detection (ZCD), reducing reverse conduction losses at light loads.
Can the TOUT/FLT pin be used simultaneously for temperature monitoring and fault reporting?
No - TOUT/FLT operates in two mutually exclusive modes. During normal operation (no fault), it outputs an analog voltage proportional to junction temperature (8 mV/°C, 800 mV offset). When any fault occurs (HS OC, OTP, or SW–PGND short), it pulls high to VDD and holds that state until EN is toggled or VIN/VDD is recycled.
What is the recommended BST capacitor value and placement for MP86962GMJT-P?
A 0.1 μF to 0.22 μF ceramic capacitor is required between BST and PHASE pins. It must be placed within 2 mm of the pins, using a direct, wide trace (≥20 mils) with no vias in the BST path. This ensures robust high-side gate drive during bootstrapping at up to 3 MHz switching frequency.
Does MP86962GMJT-P support multi-phase current sharing and synchronization?
Yes - the device supports multi-phase operation via shared TOUT/FLT lines (per Figure 3 in datasheet) and synchronized PWM inputs. Its Accu-Sense™ current sense output (5 μA/A) provides matched per-phase current data to the controller, enabling precise phase-current balancing and active voltage positioning (AVP) in VR13/VR14 systems.
What is the thermal resistance from junction to board (θJB) for the TLGA-41 package?
The measured thermal resistance from junction to board (θJB) is 2.7 °C/W under standard JEDEC test conditions (JESD51-7, 1 in² 2-oz copper, 6 thermal vias). This value assumes optimal PCB layout with full PGND pad connection and adequate copper area beneath the package.
Is MP86962GMJT-P lead-free, halogen-free, and RoHS compliant?
Yes - MP86962GMJT-P is fully lead-free, halogen-free, and complies with the EU RoHS Directive 2011/65/EU. MPS confirms green status per its Quality Assurance documentation, and the device meets IPC/JEDEC J-STD-020 moisture sensitivity level (MSL) 3 requirements.
MP86962GMJT-P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Monolithic Power Systems Inc.
- Series:
- Intelli-Phase™
- Package/Case:
- 41-PowerVFLGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Half Bridge
- Applications:
- DC-DC Converters
- Interface:
- -
- Load Type:
- Inductive, Capacitive
- Technology:
- DrMOS
- Rds On (Typ):
- -
- Current - Output / Channel:
- 80A
- Current - Peak Output:
- -
- Voltage - Supply:
- 3V ~ 16V
- Voltage - Load:
- 3 V ~ 16 V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit, Diode Emulation, Status Flag
- Fault Protection:
- Current Limiting, Over Temperature, Short Circuit, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 41-TLGA (5x6)
MP86962GMJT-P FAQ
1.How can I place an order for MP86962GMJT-P through Aetrix?
Please submit a Request for Quotation (RFQ) for MP86962GMJT-P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MP86962GMJT-P reliable?
The price and inventory of MP86962GMJT-P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP86962GMJT-P is usually 5 days.
3.What payment methods are accepted for MP86962GMJT-P?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP86962GMJT-P transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MP86962GMJT-P?
MP86962GMJT-P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MP86962GMJT-P order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MP86962GMJT-P?
For technical support, including MP86962GMJT-P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP86962GMJT-P requirements.
6.How does Aetrix verify that MP86962GMJT-P is sourced from the original manufacturer or authorized distributors?
All MP86962GMJT-P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP86962GMJT-P meets industry standards.
7.What is the process for return or replacement of MP86962GMJT-P?
All MP86962GMJT-P units undergo pre-shipment inspection (PSI). If there is an issue with MP86962GMJT-P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MP86962GMJT-P part is unused and in its original packaging.
Return procedure for MP86962GMJT-P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MP86962GMJT-P Tags
-
NCP1393BDR2G
onsemi

-
A3909GLNTR-T
Allegro MicroSystems
-
NCP51530BDR2G
onsemi

-
A3909GLYTR-T
Allegro MicroSystems

-
SIC631CD-T1-GE3
Vishay Siliconix

-
BTN70301EPAXUMA1
Infineon Technologies

-
TDA21520AUMA1
Infineon Technologies

-
AOZ5116QI
Alpha & Omega Semiconductor Inc.

-
IRSM005-301MHTR
Infineon Technologies

-
IRSM005-301MH
Infineon Technologies

-
MP6610GJ-Z
Monolithic Power Systems Inc.

-
DRV8908QPWPRQ1
Texas Instruments
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
