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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Full Half-Bridge (H Bridge) Drivers

NXP Semiconductors PIP201-12M-3,518

Name: PIP201-12M-3,518
Brand: NXP Semiconductors
SKU: PIP201-12M-3,518
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: PIP201-12M-3,518

Manufacturer:: NXP Semiconductors

Category:: Full Half-Bridge (H Bridge) Drivers

Package:: 68-VFQFN Exposed Pad

Datasheet:: PIP201-12M-3,518.pdf

Description:: IC HALF BRIDGE DRVR 20A 68HVQFN

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Product details

Overview

PIP201-12M-3,518 from NXP Semiconductors (formerly Philips Semiconductors) is a synchronous buck DC-DC converter powertrain integrating a MOSFET driver IC and two power MOSFETs in a single HVQFN68 package. It delivers up to 20 A average output current at 12 V input, supports switching frequencies up to 1 MHz, and is optimized for microprocessor and memory voltage regulation with low-profile surface-mount packaging (10 × 10 × 0.85 mm).

For engineers reviewing the PIP201-12M-3,518 datasheet, PIP201-12M-3,518 pinout, PIP201-12M-3,518 application, or PIP201-12M-3,518 equivalent, this device serves as a high-efficiency, integrated power stage for low-voltage, high-current point-of-load converters where minimized stray inductance, thermal performance, and compact layout are critical.

Technical Context

The PIP201-12M-3,518 implements a dual-MOSFET synchronous buck topology with dedicated gate drive circuitry, supporting PWM input control and bootstrap operation for the high-side FET. Its internal architecture eliminates external gate loop inductance by co-packaging drivers and power switches, enabling precise timing matching and eliminating cross-conduction via a 144 ns (typ) three-state enable delay.

It features separate supply domains: VDDC (12 V control circuit supply), VDDO (12 V output stage supply), and independent ground paths (VSSC for control, VSSO for output stage). Thermal management relies on three exposed copper pads (PAD1/VDDO, PAD2/VSSC, PAD3/VO) providing 5 K/W junction-to-PCB thermal resistance when properly implemented with thermal vias and copper area.

Key Specifications

Parameter	Value and Actual Design Meaning
Output Current	20 A average - supports high-current CPU/memory VRMs without external parallel devices
Switching Frequency	Up to 1 MHz - enables smaller output inductors and capacitors in space-constrained designs
Input Voltage Range	VDDO: −0.5 V to 25 V - compatible with 12 V nominal input rails and transient margin
Control Supply	VDDC: −0.5 V to 13 V - stable operation across 12 V ±10% control rail tolerances
Thermal Resistance	R_th(j-pcb): 4–5 K/W - requires PCB copper area and thermal vias for reliable 20 A operation
Propagation Delay	td(on): 77–85 ns; td(off): 30–45 ns - ensures fast, matched switching transitions minimizing dead-time loss
Three-State Enable	td(3-state): 115–173 ns - prevents shoot-through and output capacitor discharge during invalid PWM states

Pinout & Package

Package: HVQFN68 (SOT687), plastic heatsink very thin quad flat package; no leads; 68 terminals; body dimensions 10 × 10 × 0.85 mm; three exposed thermal pads (PAD1/VDDO, PAD2/VSSC, PAD3/VO) on underside.

Pin/Terminal	Circuit Role	Design Meaning
VDDO (Pins 1–8, 60, 61, 68)	Output stage supply voltage	All connected to PAD1 - supplies high-side and low-side power MOSFETs; must be decoupled locally
VSSC (Pins 9, 15, 22–24)	Control circuit ground	All connected to PAD2 - dedicated return for driver logic; isolated from power ground to reduce noise coupling
VO (Pins 10, 26, 27, 45–59, 62–67)	Power output	All connected to PAD3 - main high-current output node; multiple pins minimize IR drop and inductance
CB (Pins 11, 12)	Bootstrap capacitor connection	Drives high-side gate via charge pump; requires external 100 nF ceramic capacitor to VO
VDDC (Pins 13, 14)	Control circuit supply voltage	Supplies internal driver logic and PWM interface; separate from VDDO for noise isolation
VI (Pins 16, 17)	PWM input	Differential-capable logic-level input; accepts standard 3.3 V/5 V PWM signals from controllers
VSSO (Pins 28–44)	Output stage supply ground	Low-side MOSFET source return; high-current path requiring wide copper pour and thermal vias

Key Features

Feature	Design Value
Integrated Power Stage	Combines driver IC + high-side + low-side MOSFETs in one package - eliminates gate loop inductance and enables >1 MHz operation
Thermal-Optimized Package	HVQFN68 with three exposed thermal pads - achieves 5 K/W junction-to-PCB resistance with proper PCB layout
Synchronous Buck Control Logic	Built-in three-state function with 144 ns (typ) disable delay - prevents shoot-through and output capacitor discharge during invalid inputs
Multi-Phase Compatibility	No internal phase synchronization; accepts any single/multi-phase PWM controller - enables scalable 4+ phase VRM designs
High-Efficiency Operation	Typical total power dissipation of 2.7 W at 12.5 A / 500 kHz / 1.6 V output - reduces heatsink requirements in dense server/motherboard layouts

Applications

Microprocessor Voltage Regulator	Memory Voltage Regulator
Use Scenario: Delivering tightly regulated 1.1–1.9 V at up to 50 A to modern CPUs using four-phase interleaved buck topology. IC Role / Device Role / Timing Role: Serves as one phase's complete power stage - converts 12 V input to low-voltage CPU core rail with synchronized gate drive and bootstrap management. Use Value: Enables compact, high-frequency (500 kHz) multi-phase design with 2.7 W per-phase dissipation and <110 °C junction temperature under typical motherboard thermal conditions.	Use Scenario: Providing stable 1.2–1.5 V supply to DDR3/DDR4 memory modules in servers and workstations. IC Role / Device Role / Timing Role: Functions as a standalone or paralleled buck power stage - handles high di/dt transients during memory burst access with minimal output impedance. Use Value: Delivers 20 A continuous output with <25 ns rise/fall times, reducing voltage droop during load steps and improving signal integrity on memory bus lines.
Low-Voltage Server VRM	Industrial FPGA Power Supply
Use Scenario: High-density 12 V-to-0.85 V conversion for ASIC/FPGA core rails in telecom and data center equipment. IC Role / Device Role / Timing Role: Acts as a modular, thermally robust power stage - interfaces directly with digital PWM controllers (e.g., Intersil ISL63xx, TI UCD72xx) via VI input. Use Value: Supports 1 MHz operation to shrink passive components while maintaining efficiency >90% at 12.5 A, easing board space constraints in 1U chassis.	Use Scenario: Programmable logic supply requiring rapid transient response and long-term reliability in industrial automation systems. IC Role / Device Role / Timing Role: Provides fault-tolerant, integrated buck stage - includes three-state protection to prevent uncontrolled discharge during controller reset or communication loss. Use Value: Ensures safe shutdown and recovery with 144 ns three-state activation, protecting FPGA I/O banks and preventing configuration corruption during brown-out events.

Microprocessor Voltage Regulator

Memory Voltage Regulator

Use Scenario: Delivering tightly regulated 1.1–1.9 V at up to 50 A to modern CPUs using four-phase interleaved buck topology.

IC Role / Device Role / Timing Role: Serves as one phase's complete power stage - converts 12 V input to low-voltage CPU core rail with synchronized gate drive and bootstrap management.

Use Value: Enables compact, high-frequency (500 kHz) multi-phase design with 2.7 W per-phase dissipation and <110 °C junction temperature under typical motherboard thermal conditions.

Use Scenario: Providing stable 1.2–1.5 V supply to DDR3/DDR4 memory modules in servers and workstations.

IC Role / Device Role / Timing Role: Functions as a standalone or paralleled buck power stage - handles high di/dt transients during memory burst access with minimal output impedance.

Use Value: Delivers 20 A continuous output with <25 ns rise/fall times, reducing voltage droop during load steps and improving signal integrity on memory bus lines.

Low-Voltage Server VRM

Industrial FPGA Power Supply

Use Scenario: High-density 12 V-to-0.85 V conversion for ASIC/FPGA core rails in telecom and data center equipment.

IC Role / Device Role / Timing Role: Acts as a modular, thermally robust power stage - interfaces directly with digital PWM controllers (e.g., Intersil ISL63xx, TI UCD72xx) via VI input.

Use Value: Supports 1 MHz operation to shrink passive components while maintaining efficiency >90% at 12.5 A, easing board space constraints in 1U chassis.

Use Scenario: Programmable logic supply requiring rapid transient response and long-term reliability in industrial automation systems.

IC Role / Device Role / Timing Role: Provides fault-tolerant, integrated buck stage - includes three-state protection to prevent uncontrolled discharge during controller reset or communication loss.

Use Value: Ensures safe shutdown and recovery with 144 ns three-state activation, protecting FPGA I/O banks and preventing configuration corruption during brown-out events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck powerstage applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IR3548MTRPBF	Single-chip digital multiphase controller + power stage; integrates PMBus interface and telemetry; higher integration but fixed 5-phase topology	Designed for full VR12/VR13 compliant systems with dynamic voltage scaling; not suitable for discrete PWM controller-based designs	Select IR3548MTRPBF only when digital control, telemetry, and strict VRM compliance are required - PIP201-12M-3,518 remains optimal for analog/PWM-controlled, cost-sensitive, or custom multi-phase implementations
MP86957DQKT-LF-Z	Monolithic 30 A buck converter with integrated inductor; fixed 0.6–3.3 V output; no external PWM interface or bootstrap support	Targeted at space-constrained embedded applications with fixed output; lacks VI input and programmable frequency capability	Choose MP86957DQKT-LF-Z for ultra-compact, self-contained 12 V-to-1.2 V conversion; retain PIP201-12M-3,518 when system-level control, thermal scalability, or multi-phase flexibility is needed

Compared with IR3548MTRPBF and MP86957DQKT-LF-Z, the PIP201-12M-3,518 offers unmatched flexibility for analog PWM-controlled, multi-phase, high-current VRMs - delivering discrete gate drive precision, thermal modularity via PCB layout, and compatibility with legacy and custom controllers without sacrificing efficiency or footprint.

Availability

PIP201-12M-3,518 is available at Aetrix Electronics and suitable for microprocessor voltage regulators, memory voltage regulators, and low-voltage, high-current DC-DC converters requiring stable component supply across extended production lifecycles.

Supply support for PIP201-12M-3,518 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors, formerly Philips Semiconductors, is a global leader in high-performance mixed-signal ICs, with expertise in power management, automotive, and secure connectivity solutions.

The PIP201-12M-3,518 belongs to NXP's legacy powertrain portfolio, designed specifically for high-efficiency, high-current synchronous buck conversion in computing and communications infrastructure where thermal density and layout simplicity are critical.

FAQ

What is the maximum operating frequency supported by the PIP201-12M-3,518?

The PIP201-12M-3,518 supports an operating frequency up to 1 MHz, as specified in its preliminary datasheet. At 500 kHz and 12.5 A average output current, typical power dissipation is 2.7 W; increasing frequency to 1 MHz raises dissipation to 4.5 W under identical conditions. Thermal design - including PCB copper area, thermal vias, and ambient temperature - ultimately determines the sustainable maximum frequency for a given application. The PIP201-12M-3,518's low propagation delays (77–85 ns turn-on) and matched driver timing enable reliable 1 MHz operation when thermal limits are respected.

Does the PIP201-12M-3,518 require external bootstrap components?

Yes, the PIP201-12M-3,518 requires an external bootstrap capacitor connected between CB pins (11, 12) and VO. A 100 nF ceramic capacitor is recommended per the datasheet, placed as close as possible to the device to minimize loop inductance. No external bootstrap diode is needed - the device integrates the necessary charge-pump circuitry to drive the high-side MOSFET gate above VDDO. Failure to install the bootstrap capacitor will prevent high-side FET operation, resulting in no output voltage regulation.

How is thermal management implemented on the PIP201-12M-3,518?

The PIP201-12M-3,518 uses three exposed copper thermal pads on its underside: PAD1 (VDDO), PAD2 (VSSC), and PAD3 (VO). These provide a low-resistance thermal path to the PCB, achieving a typical R_th(j-pcb) of 4–5 K/W when implemented with adequate copper area and thermal vias. To realize this performance, the PCB footprint must match the SOT687 outline (Figure 17), incorporate ≥0.1 mm clearance between pads, and use thermal vias under each pad connected to inner or bottom-layer copper planes. Without proper thermal design, junction temperature can exceed 150 °C even at moderate loads.

Can the PIP201-12M-3,518 be used in multi-phase configurations?

Yes, the PIP201-12M-3,518 is explicitly designed for multi-phase synchronous buck converters and is compatible with any single- or multi-phase PWM controller. Its VI input accepts standard logic-level PWM signals, and its independent VDDC/VDDO supplies and isolated grounds (VSSC/VSSO) minimize inter-phase coupling. A typical four-phase implementation using four PIP201-12M-3,518 devices delivers 50 A at 500 kHz, with each device dissipating 2.7 W. Phase interleaving is managed externally by the controller - the PIP201-12M-3,518 itself contains no phase synchronization circuitry.

What protection features does the PIP201-12M-3,518 include?

The PIP201-12M-3,518 incorporates a three-state function that disables both MOSFETs if the VI input remains between the HIGH and LOW thresholds (1.95–2.55 V) for longer than 115–173 ns. This prevents shoot-through and uncontrolled discharge of the output capacitor bank through the low-side FET during invalid or floating PWM states. It does not include overcurrent, overtemperature, or undervoltage lockout protection - those functions must be implemented externally by the PWM controller or system-level monitoring circuitry. The device operates within absolute maximum ratings (e.g., VDDO ≤25 V, T_j ≤150 °C), but has no internal fault latching or reporting.

PIP201-12M-3,518 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 68-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Output Configuration:: Half Bridge

Applications:: Synchronous Buck Converters

Interface:: PWM

Load Type:: Inductive

Technology:: Power MOSFET

Rds On (Typ):: -

Current - Output / Channel:: 20A

Current - Peak Output:: 200A

Voltage - Supply:: 12V

Voltage - Load:: 25V (Max)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Features:: Bootstrap Circuit

Fault Protection:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 68-HVQFN (10x10)

PIP201-12M-3,518 FAQ

1.How can I place an order for PIP201-12M-3,518 through Aetrix?

Please submit a Request for Quotation (RFQ) for PIP201-12M-3,518 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PIP201-12M-3,518 reliable?

The price and inventory of PIP201-12M-3,518 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PIP201-12M-3,518 is usually 5 days.

3.What payment methods are accepted for PIP201-12M-3,518?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PIP201-12M-3,518 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PIP201-12M-3,518?

PIP201-12M-3,518 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PIP201-12M-3,518 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PIP201-12M-3,518?

For technical support, including PIP201-12M-3,518 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PIP201-12M-3,518 requirements.

6.How does Aetrix verify that PIP201-12M-3,518 is sourced from the original manufacturer or authorized distributors?

All PIP201-12M-3,518 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PIP201-12M-3,518 meets industry standards.

7.What is the process for return or replacement of PIP201-12M-3,518?

All PIP201-12M-3,518 units undergo pre-shipment inspection (PSI). If there is an issue with PIP201-12M-3,518, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PIP201-12M-3,518 part is unused and in its original packaging.

Return procedure for PIP201-12M-3,518:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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