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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Full Half-Bridge (H Bridge) Drivers

NXP Semiconductors PIP202-12M-2,518

Name: PIP202-12M-2,518
Brand: NXP Semiconductors
SKU: PIP202-12M-2,518
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: PIP202-12M-2,518

Manufacturer:: NXP Semiconductors

Category:: Full Half-Bridge (H Bridge) Drivers

Package:: 68-VFQFN Exposed Pad

Datasheet:: PIP202-12M-2,518.pdf

Description:: IC HALF BRIDGE DRVR 25A 68HVQFN

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Product details

Overview

PIP202-12M-2 from NXP Semiconductors (formerly Philips Semiconductors) is a synchronous buck DC-to-DC converter powertrain integrating a MOSFET control IC, high-side and low-side power MOSFETs, and an integrated Schottky diode in a single HVQFN68 package. It delivers up to 25 A continuous output current, supports input voltages from 3.3 V to 12 V, and operates at frequencies up to 1 MHz - enabling compact, high-efficiency point-of-load regulation for microprocessor and memory voltage rails.

For engineers reviewing the PIP202-12M-2 datasheet, PIP202-12M-2 pinout, PIP202-12M-2 application, or PIP202-12M-2 equivalent, this page provides verified technical context, validated pin functions, confirmed thermal and switching performance metrics, and real-world design constraints including bootstrap diode integration, 3-state input behavior, and PCB thermal via requirements.

Technical Context

The PIP202-12M-2 implements a synchronous buck topology with integrated gate drivers matched precisely to its internal MOSFETs, eliminating cross-conduction risk and enabling 500 kHz–1 MHz operation. Its bootstrap diode is embedded between VDDC and CB, removing need for external bootstrap components.

It features a 3-state detection circuit that disables both MOSFETs if VI remains near 2.5 V for >140 ns, and uses three thermal pads (PAD1/VDDO, PAD2/VSSC, PAD3/VO) to achieve 5 K/W junction-to-PCB thermal resistance - requiring dedicated copper area and thermal vias for sustained 25 A operation.

Key Specifications

Parameter	Value and Actual Design Meaning
Output Current	25 A continuous - supports high-current VRM loads without external current sharing.
Input Voltage Range	3.3 V to 12 V - compatible with standard intermediate bus voltages in server and telecom systems.
Switching Frequency	Up to 1 MHz - enables smaller output inductors and capacitors versus lower-frequency alternatives.
Peak Efficiency	>92% at 500 kHz - achieved via integrated low-R_DS(on) MOSFETs and minimized stray inductance.
Package	HVQFN68 (SOT687-1), 10 × 10 × 0.85 mm - thermally enhanced, leadless, surface-mount with three exposed thermal pads.
Thermal Resistance	5 K/W (junction-to-PCB) - requires ≥25 × 25 mm copper area and thermal vias for full 25 A rating.
Bootstrap Diode	Integrated between VDDC and CB - eliminates external diode and associated layout complexity.

Pinout & Package

HVQFN68 (SOT687-1) package: plastic thermal-enhanced very thin quad flat package, no leads, 68 terminals, body dimensions 10 × 10 × 0.85 mm. Features three large thermal pads on underside (PAD1 = VDDO, PAD2 = VSSC, PAD3 = VO) for low-inductance power routing and efficient heat conduction to PCB.

Pin/Terminal	Circuit Role	Design Meaning
VDDO (Pins 1–8, 60, 61, 68)	Output stage supply voltage	High-current input rail (up to 25 V max); connects to PAD1 for low-inductance power delivery.
VSSO (Pins 28–44)	Output stage supply ground	Power return path for high dI/dt switching; must be decoupled locally to minimize transients.
VO (Pins 10, 26, 27, 45–59, 62–67)	Power output	Switch node output; connects to PAD3 and external inductor; carries full load current.
CB (Pins 11, 12)	Bootstrap capacitor connection	Connects to external bootstrap capacitor; internal diode enables self-biasing of high-side driver.
VDDC (Pins 13, 14)	Control circuit supply voltage	Logic supply (7–14 V typical); filtered via RC network to isolate noise from VDDO/VSSO switching.
VI (Pins 16, 17)	PWM input	Differential-compatible PWM signal input; triggers synchronous switching with <85 ns turn-on delay.
VSSC (Pins 9, 15, 22–24)	Control circuit ground	Signal reference for logic; must be isolated from VSSO return path to prevent noise coupling.
n.c. (Pins 18–21, 25)	No internal connection	Must be connected to VSSC per datasheet; not floating - ensures proper thermal pad soldering.

Key Features

Feature	Design Value
Integrated powertrain	Combines control IC, high-side MOSFET, low-side MOSFET, and Schottky diode - eliminates discrete gate drive loop inductance and reduces BOM count by 4+ components.
Synchronous buck operation	Enables >92% peak efficiency at 500 kHz by replacing freewheeling diode losses with low-R_DS(on) MOSFET conduction.
3-state input detection	Disables both MOSFETs if VI stays within 1.0–1.9 V / 3.0–3.9 V window for >140 ns - prevents shoot-through during controller reset or fault conditions.
Thermally optimized package	Three exposed thermal pads (VDDO/VSSC/VO) enable 5 K/W junction-to-PCB thermal resistance - supports 25 A continuous with proper PCB copper and via design.
Bootstrap diode integration	Embedded diode between VDDC and CB eliminates external component, simplifies layout, and improves reliability over discrete bootstrap solutions.

Applications

Microprocessor Core Voltage Regulation	DDR Memory VDDQ Supply
Use Scenario: Regulating 1.2 V core voltage for multi-core x86 or ARM processors under dynamic load (0–25 A). IC Role / Device Role / Timing Role: Synchronous buck powertrain delivering fast transient response and high efficiency at 500 kHz–1 MHz switching. Use Value: Enables stable core voltage during rapid load steps while maintaining >90% efficiency - reducing thermal load on CPU heatsink and system airflow requirements.	Use Scenario: Providing 1.35 V VDDQ supply to DDR4/DDR5 memory modules with tight voltage tolerance (±3%). IC Role / Device Role / Timing Role: High-current, low-noise point-of-load regulator synchronized to memory controller timing. Use Value: Delivers clean, low-ripple output with minimal EMI due to integrated MOSFETs and controlled gate drive - improving memory signal integrity and timing margin.
Multi-Phase VRM for ASIC/FPGA	Compact Telecom POL Converter
Use Scenario: Four-phase 80 A VRM using four PIP202-12M-2 units driving a 360 nH inductor per phase. IC Role / Device Role / Timing Role: Identical, paralleled power stages with independent PWM inputs - enabling interleaved switching and current sharing. Use Value: Achieves 4.5 W typical dissipation per unit at 20 A/500 kHz, enabling dense packaging with forced-air cooling and thermal vias.	Use Scenario: Space-constrained 12 V-to-3.3 V conversion in 1RU telecom line cards with strict thermal limits. IC Role / Device Role / Timing Role: Single-phase high-efficiency POL module operating at 1 MHz to minimize inductor size (≤1 µH). Use Value: Reduces total solution footprint by 40% vs. discrete MOSFET + driver designs - critical for high-port-density optical transport equipment.

Microprocessor Core Voltage Regulation

DDR Memory VDDQ Supply

Use Scenario: Regulating 1.2 V core voltage for multi-core x86 or ARM processors under dynamic load (0–25 A).

IC Role / Device Role / Timing Role: Synchronous buck powertrain delivering fast transient response and high efficiency at 500 kHz–1 MHz switching.

Use Value: Enables stable core voltage during rapid load steps while maintaining >90% efficiency - reducing thermal load on CPU heatsink and system airflow requirements.

Use Scenario: Providing 1.35 V VDDQ supply to DDR4/DDR5 memory modules with tight voltage tolerance (±3%).

IC Role / Device Role / Timing Role: High-current, low-noise point-of-load regulator synchronized to memory controller timing.

Use Value: Delivers clean, low-ripple output with minimal EMI due to integrated MOSFETs and controlled gate drive - improving memory signal integrity and timing margin.

Multi-Phase VRM for ASIC/FPGA

Compact Telecom POL Converter

Use Scenario: Four-phase 80 A VRM using four PIP202-12M-2 units driving a 360 nH inductor per phase.

IC Role / Device Role / Timing Role: Identical, paralleled power stages with independent PWM inputs - enabling interleaved switching and current sharing.

Use Value: Achieves 4.5 W typical dissipation per unit at 20 A/500 kHz, enabling dense packaging with forced-air cooling and thermal vias.

Use Scenario: Space-constrained 12 V-to-3.3 V conversion in 1RU telecom line cards with strict thermal limits.

IC Role / Device Role / Timing Role: Single-phase high-efficiency POL module operating at 1 MHz to minimize inductor size (≤1 µH).

Use Value: Reduces total solution footprint by 40% vs. discrete MOSFET + driver designs - critical for high-port-density optical transport equipment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck powertrain applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IR3823MTRPBF	6 A rated, QFN32, integrated driver + MOSFETs only - no Schottky diode; requires external bootstrap capacitor.	Targeted at lower-current applications (<10 A); lacks integrated bootstrap diode and thermal pad architecture of PIP202-12M-2.	Choose IR3823MTRPBF for cost-sensitive, sub-10 A designs where board space allows discrete bootstrap components.
TPS53679RSLR	60 A dual-phase controller with external MOSFET drive - no integrated power devices; supports CSD87350Q5D external power stage.	Requires separate power stage selection; offers digital PMBus interface and advanced telemetry absent in PIP202-12M-2.	Choose TPS53679RSLR when system-level programmability, telemetry, or scalability beyond 25 A per phase is required.

Compared with IR3823MTRPBF and TPS53679RSLR, the PIP202-12M-2 uniquely integrates all powertrain elements-including Schottky diode and bootstrap diode-into a single thermally optimized HVQFN68 package, enabling higher current density and simpler layout for fixed 25 A point-of-load applications without digital control needs.

Availability

PIP202-12M-2 is available at Aetrix Electronics and suitable for high-current DC-to-DC point-of-load converters, small form-factor Voltage Regulator Modules, and microprocessor/memory voltage regulators requiring stable component supply across industrial, telecom, and computing programs.

Supply support for PIP202-12M-2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors, formerly Philips Semiconductors, is a global leader in high-performance analog and power management semiconductors, with deep expertise in power conversion and automotive-grade reliability.

The PIP202-12M-2 belongs to NXP's legacy powertrain portfolio designed specifically for high-efficiency, high-current synchronous buck conversion in space-constrained computing and telecom infrastructure - emphasizing thermal performance, integration density, and robustness under dynamic load.

FAQ

What is the maximum continuous output current rating for the PIP202-12M-2?

The PIP202-12M-2 is rated for 25 A continuous output current under specified thermal conditions: VDDC = 12 V, T_pcb ≤ 110 °C, and proper PCB thermal design with copper area and thermal vias. At 20 A and 500 kHz, typical power dissipation is 4.5 W per unit - confirming the 25 A rating is achievable with adequate cooling.

Does the PIP202-12M-2 require an external bootstrap diode?

No, the PIP202-12M-2 integrates a bootstrap diode between VDDC and CB pins, eliminating the need for an external component. This simplifies layout, improves reliability, and ensures consistent bootstrap capacitor charging - a key differentiator from many competing powertrain modules.

How does the 3-state input function work on the PIP202-12M-2?

The PIP202-12M-2 monitors the VI input for high-impedance states: if VI remains between 1.0 V and 1.9 V (LOW) or 3.0 V and 3.9 V (HIGH) for longer than 140 ns, both MOSFETs are turned off and VI is pulled to 2.5 V. This prevents shoot-through during controller initialization or fault conditions.

What thermal design practices are required to sustain 25 A operation with the PIP202-12M-2?

To sustain 25 A, the PIP202-12M-2 requires PCB copper area ≥25 × 25 mm around each thermal pad (PAD1/VDDO, PAD2/VSSC, PAD3/VO), plus thermal vias to inner/bottom layers. With thermal vias and forced air cooling (0.8 m/s), junction-to-ambient resistance drops to 15 K/W - keeping T_j below 122.5 °C at 55 °C ambient.

Can the PIP202-12M-2 be used in multi-phase configurations?

Yes - the PIP202-12M-2 is explicitly designed for multi-phase operation. Figure 11 in the datasheet shows a four-phase 80 A buck converter using four PIP202-12M-2 units, each driven by independent PWM signals. Interleaving reduces input/output ripple and spreads thermal load across multiple packages.

PIP202-12M-2,518 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 68-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Output Configuration:: Half Bridge

Applications:: Synchronous Buck Converters

Interface:: PWM

Load Type:: Inductive

Technology:: Power MOSFET

Rds On (Typ):: -

Current - Output / Channel:: 25A

Current - Peak Output:: 200A

Voltage - Supply:: 3.3V ~ 12V

Voltage - Load:: 25V (Max)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Features:: Bootstrap Circuit

Fault Protection:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 68-HVQFN (10x10)

PIP202-12M-2,518 FAQ

1.How can I place an order for PIP202-12M-2,518 through Aetrix?

Please submit a Request for Quotation (RFQ) for PIP202-12M-2,518 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PIP202-12M-2,518 reliable?

The price and inventory of PIP202-12M-2,518 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PIP202-12M-2,518 is usually 5 days.

3.What payment methods are accepted for PIP202-12M-2,518?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PIP202-12M-2,518 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PIP202-12M-2,518?

PIP202-12M-2,518 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PIP202-12M-2,518 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PIP202-12M-2,518?

For technical support, including PIP202-12M-2,518 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PIP202-12M-2,518 requirements.

6.How does Aetrix verify that PIP202-12M-2,518 is sourced from the original manufacturer or authorized distributors?

All PIP202-12M-2,518 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PIP202-12M-2,518 meets industry standards.

7.What is the process for return or replacement of PIP202-12M-2,518?

All PIP202-12M-2,518 units undergo pre-shipment inspection (PSI). If there is an issue with PIP202-12M-2,518, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PIP202-12M-2,518 part is unused and in its original packaging.

Return procedure for PIP202-12M-2,518:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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