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NXP Semiconductors PIP213-12M,518

Part No.:
PIP213-12M,518
Manufacturer:
NXP Semiconductors
Category:
Full Half-Bridge (H Bridge) Drivers
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixPIP213-12M,518.pdf
Description:
IC HALF BRIDGE DRVR 25A 56HVQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,950

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Product details

Overview

PIP213-12M from NXP Semiconductors is a thermally enhanced, integrated power train for high-frequency synchronous buck DC-DC converters, replacing discrete upper/lower MOSFETs, Schottky diode, and driver IC. It delivers up to 25 A output current at 1 MHz, supports 0.8 V–6 V output voltage, and achieves >85% peak system efficiency. It serves as the core power stage in microprocessor VRMs and multi-phase point-of-load systems.

For engineers reviewing the PIP213-12M datasheet, PIP213-12M pinout, PIP213-12M application, or PIP213-12M equivalent, key selection criteria include its 56-terminal HVQFN56 package, Automatic Dead-time Reduction (ADR), internal 6.5 V gate regulator, Intel DrMOS compatibility, and thermal performance with Rth(j-mb) = 3–6 K/W.

Technical Context

The PIP213-12M integrates an upper MOSFET (RDSon = 6.5 mΩ), lower MOSFET (RDSon = 3.8 mΩ @ VDDG = 12 V), bootstrap gate driver, UVLO, OTP, and 5 V LDO regulator. Its half-bridge topology operates with PWM input on VI and provides VO output with remote sensing via VO_SENSE.

Control logic includes automatic dead-time reduction based on lower MOSFET body diode conduction monitoring, 3-state input handling with 90 ns delay, and dual VDDG biasing modes-internal 6.5 V regulation (VDDG_EN open, VDDC > 9 V) or external supply (VDDG_EN pulled low). PRDY and DISABLE pins support power sequencing in multi-phase systems.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range3.3 V to 16 V - supports wide-input industrial and computing rails including 12 V intermediate bus
Output CurrentUp to 25 A continuous at 1 MHz - enables compact high-current POL designs without forced air
Operating FrequencyUp to 1 MHz - allows smaller external inductors and faster transient response
Peak Efficiency>85 % at 1 MHz - reduces thermal load and improves system-level power density
Thermal ResistanceRth(j-mb) = 3–6 K/W - enables direct PCB thermal pad mounting for high-power dissipation
Package Dimensions8 mm × 8 mm × 0.85 mm HVQFN56 - low-profile surface-mount footprint compatible with DrMOS layouts
DrMOS CompatibilityYes - meets Intel DrMOS spec when VDDG_EN = VSSC and external VDDG supplied

Pinout & Package

Package: HVQFN56 (SOT684-4), plastic thermal-enhanced very thin quad flat package; no leads; 56 terminals; body 8 mm × 8 mm × 0.85 mm; exposed thermal pad (PAD 1 = VSSC, PAD 2 = VDDO, PAD 3 = VO).

Pin/TerminalCircuit RoleDesign Meaning
VDDC (Pin 4)Control circuit supplyProvides power to logic and protection circuits; UVLO threshold 4.05–4.45 V ensures robust startup
VDDO (Pins 8,11–20, PAD 2)Output stage supplyHigh-current input rail for upper/lower MOSFETs; rated up to +24 V absolute max
VSSC (Pins 1,7,51, PAD 1)Control groundReference for logic, regulators, and protection circuits; isolated from power ground to reduce noise coupling
VSSO (Pins 22–41)Output stage groundHigh-current return path for MOSFETs; multiple pins minimize inductance and improve thermal spreading
VI (Pin 56)PWM inputLogic-level interface for external controller; supports 3-state detection with 90 ns timeout
VO (Pins 42–50, PAD 3)Power outputHalf-bridge switching node; connects to external inductor; used for bootstrap capacitor reference in DrMOS mode
CBP/CBN (Pins 5,10)Bootstrap capacitor interfaceCBP connects to boost switch; CBN referenced to VO in standard mode or left open in DrMOS mode
PRDY (Pin 53)Power-ready flagOpen-drain output indicating VDDC > UVLO; used for controller enable sequencing
REG5V (Pin 54)Regulated 5 V outputLow-current (18 mA min) supply for PWM controllers; active only when PRDY and DISABLE are HIGH
DISABLE (Pin 55)Enable/disable controlActive-low function; internally pulled LOW during UVLO; enables synchronized multi-phase shutdown

Key Features

FeatureDesign Value
Automatic Dead-time Reduction (ADR)Reduces lower MOSFET body diode conduction by dynamically adjusting dead-time, lowering switching losses and enabling higher frequency operation
Integrated 6.5 V Gate RegulatorEliminates need for external gate drive supply when VDDC > 9 V; reduces BOM count and layout complexity
Intel DrMOS CompatibilityConfigurable via VDDG_EN pin and modified PCB routing to meet Intel specification for server/microprocessor VRMs
Thermal Shutdown (OTP)Triggers at 160 °C junction temperature with 40 °C hysteresis, protecting against sustained overload or poor heatsinking
Auxiliary 5 V Output (REG5V)Provides regulated bias for external PWM controllers, with built-in enable logic tied to PRDY and DISABLE status

Applications

Microprocessor VRMMulti-Phase POL Converter

Use Scenario: Powers CPU cores in x86 or ARM-based servers requiring tight voltage regulation and fast transient response.

IC Role / Device Role / Timing Role: Serves as one phase's power stage in a 4-phase buck converter delivering 100 A total output.

Use Value: Enables <1.3 V output at 20+ A/phase with >85% efficiency, reducing board area versus discrete solutions.

Use Scenario: Supplies GPU or FPGA I/O banks where space-constrained, high-current rails demand minimal footprint.

IC Role / Device Role / Timing Role: Functions as a synchronized buck power train with shared PWM timing and interleaved phase control.

Use Value: Delivers 25 A per phase at 1 MHz, allowing smaller 360 nH inductors and tighter output capacitance placement.

Memory Voltage RegulatorSmall Form-Factor VRM Module

Use Scenario: Provides DDR4/DDR5 VDDQ or VPP rails in memory subsystems with strict ripple and noise requirements.

IC Role / Device Role / Timing Role: Acts as high-efficiency, low-noise synchronous rectifier stage with VO_SENSE for remote sensing.

Use Value: Achieves <10 mVpp output ripple at full load due to low RDSon and minimized parasitic inductance.

Use Scenario: Integrated into compact VRM modules for telecom or networking equipment where height <1 mm is critical.

IC Role / Device Role / Timing Role: Replaces 4 discrete components (2 MOSFETs + diode + driver) in a single 8 mm × 8 mm footprint.

Use Value: Reduces solution volume by >50% versus discrete implementation while maintaining thermal performance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck power train applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IR35201MTRPBFSingle-chip DrMOS with integrated PWM controller; 40 A capability; requires no external PWM signalTargeted at fully integrated VRM solutions; lacks standalone VI input flexibility of PIP213-12MSelect IR35201 when controller integration and higher current per phase are required; PIP213-12M preferred for custom PWM architectures
ISL95812IRZDrMOS with 35 A rating; supports 3-level PWM; includes digital telemetry interface (SVID)Designed for Intel SVID-compliant platforms; adds PMBus telemetry not present in PIP213-12MChoose ISL95812 for SVID-based server VRMs; PIP213-12M suits analog PWM or non-SVID designs needing cost/performance balance

Compared with IR35201MTRPBF and ISL95812IRZ, the PIP213-12M offers a pure power train architecture with external PWM control, broader input range (3.3–16 V vs. fixed 5/12 V bias), and simpler thermal management via direct-pad mounting-making it optimal for custom high-density POL designs where controller independence is prioritized.

Availability

PIP213-12M is available at Aetrix Electronics and suitable for high-current DC-DC point-of-load converters, microprocessor voltage regulators, and small-form-factor VRM modules requiring stable component supply across industrial, computing, and telecom production programs.

Supply support for PIP213-12M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and communication applications.

The PIP213-12M belongs to NXP's DrMOS-compatible power train product line, engineered specifically for high-efficiency, high-frequency synchronous buck conversion in CPU/GPU VRMs and dense point-of-load systems.

FAQ

What is the maximum operating frequency supported by the PIP213-12M?

The PIP213-12M supports an operating frequency up to 1 MHz. This enables use with smaller external inductors and capacitors while maintaining >85% peak system efficiency. Performance data confirms stable 25 A output current at 1 MHz with VDDC = 12 V and Tpcb ≤ 90 °C, as verified in the official NXP datasheet Rev. 01.

How does the Automatic Dead-time Reduction (ADR) feature improve efficiency in the PIP213-12M?

The ADR feature in the PIP213-12M continuously monitors the lower MOSFET's body diode conduction and dynamically adjusts dead-time to minimize reverse recovery losses. This reduces both upper and lower MOSFET power dissipation, directly contributing to the >85% peak efficiency at 1 MHz and enabling higher switching frequencies without thermal penalty.

Can the PIP213-12M be used in Intel DrMOS-compliant designs?

Yes, the PIP213-12M can be configured for Intel DrMOS compliance by disabling the internal VDDG regulator (pulling VDDG_EN to VSSC), using an external VDDG supply, connecting CBN to ground instead of VO, and leaving PRDY unconnected. The HVQFN56 footprint aligns with the Intel multi-vendor DrMOS PCB layout standard.

What is the role of the REG5V pin on the PIP213-12M?

The REG5V pin on the PIP213-12M provides a regulated 5 V output (4.5–5.5 V) capable of supplying up to 18 mA. It is active only when both PRDY and DISABLE are HIGH, making it ideal for powering external PWM controllers with built-in power-good sequencing-ensuring the controller activates only after the PIP213-12M is fully operational.

What thermal performance can be expected from the PIP213-12M in a typical PCB layout?

In a standard PCB layout with proper thermal pad connection, the PIP213-12M achieves a junction-to-mounting-base thermal resistance (Rth(j-mb)) of 3–6 K/W. At 20 A average output current and 1 MHz switching, typical power dissipation is 5.5 W, resulting in ~33 °C temperature rise above the mounting base-enabling reliable operation without forced airflow in most high-density VRM applications.

PIP213-12M,518 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Output Configuration:
Half Bridge
Applications:
Synchronous Buck Converters
Interface:
PWM
Load Type:
Inductive
Technology:
DrMOS
Rds On (Typ):
3.8mOhm LS, 6.5mOhm HS
Current - Output / Channel:
25A
Current - Peak Output:
40A
Voltage - Supply:
3.3V ~ 16V
Voltage - Load:
24V (Max)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Features:
Bootstrap Circuit, 5V Regulated Output
Fault Protection:
Over Temperature, UVLO
Mounting Type:
Surface Mount
Supplier Device Package:
56-HVQFN (8x8)

PIP213-12M,518 FAQ

1.How can I place an order for PIP213-12M,518 through Aetrix?

Please submit a Request for Quotation (RFQ) for PIP213-12M,518 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PIP213-12M,518 reliable?

The price and inventory of PIP213-12M,518 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PIP213-12M,518 is usually 5 days.

3.What payment methods are accepted for PIP213-12M,518?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PIP213-12M,518 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PIP213-12M,518?

PIP213-12M,518 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PIP213-12M,518 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PIP213-12M,518?

For technical support, including PIP213-12M,518 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PIP213-12M,518 requirements.

6.How does Aetrix verify that PIP213-12M,518 is sourced from the original manufacturer or authorized distributors?

All PIP213-12M,518 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PIP213-12M,518 meets industry standards.

7.What is the process for return or replacement of PIP213-12M,518?

All PIP213-12M,518 units undergo pre-shipment inspection (PSI). If there is an issue with PIP213-12M,518, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PIP213-12M,518 part is unused and in its original packaging.

Return procedure for PIP213-12M,518:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

PIP213-12M,518 Tags

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