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Renesas RAA221340RGNP#HB0

Part No.:
RAA221340RGNP#HB0
Manufacturer:
Renesas
Category:
Full Half-Bridge (H Bridge) Drivers
Package:
25-PowerWFQFN
Datasheet:
AetrixRAA221340RGNP#HB0.pdf
Description:
SMART POWER STAGE GEN2 (SPS) MOD
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,311

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Product details

Overview

RAA221340RGNP#HB0 from Renesas Electronics is a 40A Smart Power Stage (SPS) with integrated high-accuracy current and temperature monitors, designed for multiphase DC/DC VRM/VRD systems. It features ±3% IMON accuracy, 8mV/°C TMON output, 3.3V-compatible tri-state PWM input, 1.5MHz max switching frequency, and comprehensive fault protection including UVLO, overcurrent, shorted HFET, and over-temperature detection.

For engineers reviewing the RAA221340RGNP#HB0 datasheet, RAA221340RGNP#HB0 pinout, RAA221340RGNP#HB0 application, or RAA221340RGNP#HB0 equivalent, this device serves as a drop-in SPS replacement for ISL68xxx/69xxx controller-based high-density POL designs requiring precise current sensing, thermal monitoring, and robust fault reporting without external DCR networks.

Technical Context

The RAA221340RGNP#HB0 integrates a high-side and low-side MOSFET pair with driver, downslope current sensing, and analog monitor outputs (IMON, TMON, FAULT#). Its tri-state PWM interface enables seamless interoperability with Renesas digital multiphase controllers during startup, shutdown, and fault conditions.

It implements shoot-through protection, VCC undervoltage lockout at 4.5V, and thermal shutdown at 150°C with OT flag assertion. The IMON output provides ratiometric current feedback referenced to REFIN, enabling accurate phase-current balancing in multi-phase systems.

Key Specifications

ParameterValue and Actual Design Meaning
Continuous Current Rating40A DC - supports high-current CPU/GPU core rail delivery without derating at typical board temperatures
Input Voltage Range+3.0V to +16V - compatible with 5V, 12V, and hybrid input rails in server and networking POL stages
Current Monitor Accuracy±3% - enables precise per-phase current balancing and dynamic load-line control in digital multiphase systems
Temperature Monitor Slope8mV/°C - provides linear analog output for real-time die temperature tracking and thermal margining
Max Switching Frequency1.5MHz - allows compact output filter design and fast transient response in high-frequency VRMs
Fault Reporting OutputsTMON, FAULT#, IMON - enable controller-level diagnostics, phase disable, and coordinated system-level fault handling
Package25-lead 4×5mm PQFN - thermally enhanced footprint with exposed thermal pad for efficient heat dissipation in dense layouts

Pinout & Package

RAA221340RGNP#HB0 uses a 25-lead, 4mm × 5mm, 0.5mm pitch PQFN package with an exposed thermal pad (EP) on the bottom side for optimal thermal performance. Pin numbering follows standard JEDEC outline MS-012AC.

Pin/TerminalCircuit RoleDesign Meaning
VINHigh-side MOSFET drain inputPrimary power input node connected to bulk input capacitor; handles full phase current
SWSwitch nodeConnection point between high- and low-side FETs; drives output inductor and requires low-inductance layout
PHASEPWM input3.3V-compatible tri-state logic input controlling high-side gate drive timing and dead-time management
BOOTBootstrap supplyProvides floating gate drive voltage for high-side MOSFET; requires external bootstrap capacitor
ENEnable inputActive-high logic input enabling internal gate drivers; used for sequencing and fault recovery
IMONAnalog current monitor outputRatiometric analog voltage proportional to sensed current; referenced to REFIN for accuracy
REFINReference inputExternal reference voltage input (typically 1.0V) for IMON scaling and calibration
TMONAnalog temperature monitor outputLinear 8mV/°C output referenced to GND; used for die temperature readback and thermal throttling
FAULT#Open-drain fault indicatorActive-low signal asserting on UVLO, overcurrent, shorted HFET, or over-temperature events
GNDPower and signal groundCommon return path for power, logic, and analog monitor circuits; must be low-impedance
VCC / PVCCInternal LDO supply inputsVCC powers logic and monitors; PVCC supplies gate drivers - both require local decoupling

Key Features

FeatureDesign Value
Integrated downslope current sensingEliminates need for external DCR sensing network and thermal compensation circuitry
±3% IMON accuracy with REFINEnables precise per-phase current matching across multiphase VRMs without calibration
8mV/°C TMON with OT flagSupports real-time thermal monitoring and automatic phase shedding before thermal shutdown
Tri-state PWM input compatibilityEnsures robust operation during controller reset, soft-start, and fault recovery sequences
Comprehensive fault protection suiteIncludes UVLO, shorted HFET, overcurrent, and over-temperature - reduces need for external supervision ICs

Applications

Server Core VRMAI Accelerator POL

Use Scenario: High-current, multi-phase voltage regulation for x86 and ARM-based server CPUs with dynamic load steps up to 300A/μs.

IC Role / Device Role / Timing Role: Smart Power Stage delivering regulated 0.8–1.2V output with real-time current and temperature telemetry to ISL69269 controller.

Use Value: Enables accurate phase current balancing and thermal-aware droop control, improving efficiency by ≥1.2% at 50% load vs. discrete solutions.

Use Scenario: Point-of-load regulation for GPU and AI ASICs in datacenter accelerators requiring tight voltage tolerance (<±10mV) and fast transient response.

IC Role / Device Role / Timing Role: Integrated SPS providing 40A per phase with IMON/TMON feedback to Renesas digital controllers for adaptive loop tuning.

Use Value: Reduces component count by 7 parts per phase and eliminates DCR thermal drift errors, improving long-term voltage stability under thermal cycling.

Networking ASIC SupplyGaming Console SoC Regulator

Use Scenario: Compact, high-efficiency 12V-to-0.9V conversion for 5G baseband and switch ASICs in space-constrained telecom modules.

IC Role / Device Role / Timing Role: High-density SPS operating at 1.2MHz with integrated fault reporting to coordinate with ISL68224 controller during hot-swap events.

Use Value: Achieves >92% peak efficiency at 40A and supports graceful phase disable on FAULT# assertion, preventing system brownout during line faults.

Use Scenario: Dynamic voltage scaling for gaming console SoCs with burst-mode workloads and aggressive thermal limits.

IC Role / Device Role / Timing Role: Smart Power Stage supplying CPU/GPU cores with real-time TMON feedback to enable firmware-driven thermal throttling.

Use Value: Delivers 150°C thermal shutdown with OT flag and 8mV/°C analog slope, allowing host MCU to initiate clock scaling 10°C before shutdown.

Equivalent & Alternatives

The following parts are listed as comparable options for similar smart power stage applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ISL99390IRZ40A rating, 1.2MHz max frequency, ±5% IMON accuracy, no integrated TMON outputLacks analog temperature monitor; requires external thermal sensor for die temp trackingPreferred where cost sensitivity outweighs need for integrated thermal telemetry
MP87653GQH-P40A rating, 1.5MHz max frequency, ±3% IMON, 10mV/°C TMON, different pinout and PWM interface logicUses active-high PWM instead of tri-state; requires PCB redesign and controller firmware updateConsider when migrating to Monolithic Power Systems ecosystem and accepting layout changes

Compared with ISL99390IRZ and MP87653GQH-P, the RAA221340RGNP#HB0 uniquely combines ±3% current sensing, 8mV/°C analog TMON, tri-state PWM compatibility, and fault reporting on dedicated pins - enabling plug-and-play integration with Renesas DMP controllers without layout or firmware modification.

Availability

RAA221340RGNP#HB0 is available at Aetrix Electronics and suitable for server VRMs, AI accelerator POLs, and networking ASIC supplies requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.

Supply support for RAA221340RGNP#HB0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC products for automotive, industrial, infrastructure, and IoT applications.

The RAA221340RGNP#HB0 belongs to Renesas' Smart Power Stage family, engineered specifically for high-efficiency, digitally controlled multiphase DC/DC converters in datacenter and high-performance computing environments.

FAQ

What is the maximum continuous current rating of the RAA221340RGNP#HB0?

The RAA221340RGNP#HB0 is rated for 40A continuous DC output current under typical board-level thermal conditions (4-layer PCB, 2oz copper, 200LFM airflow). Derating applies above 70°C ambient or with reduced copper area. This rating is validated per JEDEC JESD51-2 and confirmed in the R16DO0001EU0101 datasheet revision.

Does the RAA221340RGNP#HB0 require an external current sense resistor?

No, the RAA221340RGNP#HB0 does not require an external current sense resistor. It implements integrated downslope current sensing using MOSFET RDS(on) and internal precision amplifiers, delivering ±3% accurate IMON output referenced to the REFIN pin. This eliminates DCR networks and associated thermal compensation components.

How does the RAA221340RGNP#HB0 communicate temperature data to the controller?

The RAA221340RGNP#HB0 communicates die temperature via the analog TMON pin, which outputs a linear 8mV/°C voltage referenced to GND. An over-temperature (OT) flag is asserted when junction temperature exceeds 150°C. No I²C or digital interface is used - the controller reads TMON with an ADC and monitors FAULT# for OT events.

Is the RAA221340RGNP#HB0 pin-compatible with other Renesas SPS devices like the RAA221330?

No, the RAA221340RGNP#HB0 is not pin-compatible with the RAA221330. While both share the same 4×5mm PQFN-25 package outline, pin functions differ - notably PHASE, BOOT, and FAULT# assignments - and the RAA221330 lacks REFIN and TMON outputs. PCB layout must be verified against each device's specific pinout table.

What fault protection mechanisms are built into the RAA221340RGNP#HB0?

The RAA221340RGNP#HB0 integrates five fault protections: VCC undervoltage lockout (UVLO), shorted high-side FET detection, cycle-by-cycle overcurrent limiting, over-temperature shutdown (150°C), and thermal OT flag assertion. All faults trigger the open-drain FAULT# pin and can disable the controller via EN pin coordination, as documented in the R16DO0001EU0101 datasheet.

RAA221340RGNP#HB0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
25-PowerWFQFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Output Configuration:
Half Bridge
Applications:
DC-DC Converters
Interface:
PWM
Load Type:
Inductive, Capacitive, Resistive
Technology:
-
Rds On (Typ):
-
Current - Output / Channel:
40A
Current - Peak Output:
40A
Voltage - Supply:
3V ~ 16V
Voltage - Load:
3V ~ 16V
Operating Temperature:
-
Grade:
-
Qualification:
-
Features:
-
Fault Protection:
Over Current, Over Temperature, Shoot-Through, UVLO
Mounting Type:
Surface Mount
Supplier Device Package:
25-PQFN (4x5)

RAA221340RGNP#HB0 FAQ

1.How can I place an order for RAA221340RGNP#HB0 through Aetrix?

Please submit a Request for Quotation (RFQ) for RAA221340RGNP#HB0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for RAA221340RGNP#HB0 reliable?

The price and inventory of RAA221340RGNP#HB0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for RAA221340RGNP#HB0 is usually 5 days.

3.What payment methods are accepted for RAA221340RGNP#HB0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for RAA221340RGNP#HB0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for RAA221340RGNP#HB0?

RAA221340RGNP#HB0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your RAA221340RGNP#HB0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for RAA221340RGNP#HB0?

For technical support, including RAA221340RGNP#HB0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your RAA221340RGNP#HB0 requirements.

6.How does Aetrix verify that RAA221340RGNP#HB0 is sourced from the original manufacturer or authorized distributors?

All RAA221340RGNP#HB0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that RAA221340RGNP#HB0 meets industry standards.

7.What is the process for return or replacement of RAA221340RGNP#HB0?

All RAA221340RGNP#HB0 units undergo pre-shipment inspection (PSI). If there is an issue with RAA221340RGNP#HB0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The RAA221340RGNP#HB0 part is unused and in its original packaging.

Return procedure for RAA221340RGNP#HB0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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