Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > IGBTs > Single IGBTs

Infineon Technologies SIGC10T60EX7SA1

Name: SIGC10T60EX7SA1
Brand: Infineon Technologies
SKU: SIGC10T60EX7SA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: SIGC10T60EX7SA1

Manufacturer:: Infineon Technologies

Category:: Single IGBTs

Package:: Die

Datasheet:: SIGC10T60EX7SA1.pdf

Description:: IGBT TRENCH FS 600V 20A DIE

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:5,015

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

SIGC10T60EX7SA1 from Infineon Technologies is a 600 V, 20 A rated TRENCHSTOP™ IGBT3 bare die optimized for industrial power control in discrete and module implementations. It features 1.5 V typical V_CE(sat), 6 µs short-circuit withstand time at 150 °C, and positive temperature coefficient for stable parallel operation in motor drives and resonant converters.

For engineers reviewing the SIGC10T60EX7SA1 datasheet, SIGC10T60EX7SA1 pinout, SIGC10T60EX7SA1 application, or SIGC10T60EX7SA1 equivalent, key selection criteria include V_CE(sat) stability across temperature, RBSOA compliance at 40 A/600 V, gate threshold voltage distribution (5.0–6.5 V), and wafer-level electrostatic discharge classification per MIL-STD-883.

Technical Context

This IGBT3 die employs trench-gate and field-stop architecture to achieve low conduction loss and fast turn-off with minimal tail current. Its 3.19 mm × 3.21 mm silicon die integrates AlSiCu frontside metallization and Ni/Ag backside metal for reliable thermal and electrical interface bonding in power modules.

Rated for continuous operation up to 175 °C junction temperature, it delivers 1100 pF typical input capacitance (C_ies) and 32 pF reverse transfer capacitance (C_res) at 25 V, enabling predictable switching behavior in hard-switched and resonant topologies when mounted with controlled thermal resistance.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CE Rating	600 V - supports DC bus voltages up to 400 V AC line-fed systems with margin
I_C Continuous	20 A - defines maximum steady-state current handling at T_vj ≤ 150 °C
V_CE(sat)	1.5 V typ. @ 20 A, 15 V_GE - directly determines conduction loss and thermal load in output stage
t_sc	6 µs @ V_CC = 360 V, T_vj = 150 °C - sets minimum fault-clearing window for protection circuitry
C_ies	1100 pF typ. @ 25 V - impacts gate drive power requirement and Miller effect sensitivity
V_GE(th)	5.8 V typ. (5.0–6.5 V range) - defines minimum gate voltage for reliable turn-on and noise immunity
T_vj Range	−40 to +175 °C - enables operation in sealed industrial enclosures without active cooling

Pinout & Package

Package: Bare die (no leadframe or molded package); 3.19 mm × 3.21 mm silicon chip with photoimide passivation, AlSiCu frontside metallization, and Ni/Ag backside metallization. Designed for die-attach via conductive epoxy or soft solder onto DBC substrates or leadframes.

Pin/Terminal	Circuit Role	Design Meaning
E (Emitter pad)	Current return path for collector-emitter conduction	Large-area Al pad (size per chip drawing) - minimizes emitter inductance and bond wire stress
G (Gate pad)	Control terminal for MOS-controlled bipolar conduction	0.36 mm × 0.51 mm Al pad - sized for ≤500 µm Al wire bonding with low parasitic inductance

Key Features

Feature	Design Value
Low V_CE(sat)	1.5 V typ. at 20 A reduces conduction loss by >15% vs. prior IGBT2 generation in same die size
Short tail current	Minimizes turn-off energy (E_off) and enables higher switching frequencies without excessive heating
Positive V_CE(sat) tempco	Enables inherent current sharing in paralleled dies without external ballasting resistors
RBSOA compliance	Validated at 40 A / 600 V, T_vj ≤ 150 °C - supports robust operation under transient overloads

Applications

Industrial Motor Drives

Home Appliance Inverters

Use Scenario: Variable-speed control of 3-phase induction motors in HVAC and pump systems operating from 380–480 V AC mains.

IC Role / Device Role / Timing Role: Main switching device in 6-pack inverter bridge; handles 20 A RMS output current with <1.5 V conduction drop.

Use Value: Enables >97% inverter efficiency at full load while maintaining <100 °C junction rise with standard heatsinking.

Use Scenario: Compressor and fan inverter stages in refrigerators and washing machines with PFC front-end.

IC Role / Device Role / Timing Role: Low-loss switching element in half-bridge topology; operates at 8–16 kHz with soft gate driving.

Use Value: Reduces audible noise and EMI through controlled dV/dt and low tail current during commutation.

Resonant LLC Converters

Welding Power Supplies

Use Scenario: Primary-side switching in high-efficiency 1–3 kW LLC resonant DC-DC converters for server PSUs.

IC Role / Device Role / Timing Role: Zero-voltage switching (ZVS)-enabled hard-switched node; leverages low C_res (32 pF) for precise timing control.

Use Value: Supports ZVS down to 50% load with <1.1 V V_CE(sat) ensuring stable regulation and reduced transformer stress.

Use Scenario: Output chopper stage in IGBT-based inverter welders delivering 200–500 A DC output.

IC Role / Device Role / Timing Role: High-current, high-repetition-rate switching device; withstands repeated 6 µs short-circuit events during arc ignition.

Use Value: Eliminates need for external crowbar circuits due to validated 6 µs t_sc at 150 °C junction temperature.

Availability

SIGC10T60EX7SA1 is available at Aetrix Electronics and suitable for industrial motor drives, home appliance inverters, and resonant LLC converters requiring stable component supply and wafer-level traceability.

Supply support for SIGC10T60EX7SA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power, sensor, and automotive ICs, with global R&D and fabrication facilities.

This bare die belongs to the TRENCHSTOP™ IGBT3 product line, engineered specifically for high-efficiency, high-reliability industrial power conversion where low conduction loss and robust short-circuit capability are critical.

FAQ

Is SIGC10T60EX7SA1 qualified for automotive applications?

No. The datasheet explicitly states this device is not qualified per AEC-Q101. It is intended for industrial and consumer power applications only. Automotive-grade alternatives require separate qualification evidence, including HTOL, TC, and UHAST testing reports.

What is the recommended die-attach method for SIGC10T60EX7SA1?

Infineon specifies electrically conductive epoxy glue or soft solder for die attachment. Backside metallization uses Ni/Ag to ensure solder wetting; the Ni layer must not be fully consumed during reflow to maintain mechanical integrity and thermal conductivity.

Does SIGC10T60EX7SA1 include an integrated gate resistor?

No. The datasheet lists "rG none" under Static Characteristics, confirming no monolithic gate resistor is integrated. External gate resistance must be selected based on desired dV/dt, E_off, and gate drive strength to avoid oscillation or overshoot.

How is short-circuit ruggedness verified for this bare die?

Short-circuit withstand time (t_sc = 6 µs) is verified by design and characterization-not production tested. It is validated under V_GE = 15 V, V_CC = 360 V, and T_vj = 150 °C, with a maximum of 1000 events and ≥1 s between pulses per the datasheet's safety guidance.

SIGC10T60EX7SA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: TrenchStop™

Package/Case:: Die

Packaging:: Bulk

Product Status:: Active

IGBT Type:: Trench Field Stop

Voltage - Collector Emitter Breakdown (Max):: 600 V

Current - Collector (Ic) (Max):: 20 A

Current - Collector Pulsed (Icm):: 60 A

Vce(on) (Max) @ Vge, Ic:: 1.9V @ 15V, 20A

Power - Max:: -

Switching Energy:: -

Input Type:: Standard

Gate Charge:: -

Td (on/off) @ 25°C:: -

Test Condition:: -

Reverse Recovery Time (trr):: -

Operating Temperature:: -40°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: Die

SIGC10T60EX7SA1 FAQ

1.How can I place an order for SIGC10T60EX7SA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIGC10T60EX7SA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIGC10T60EX7SA1 reliable?

The price and inventory of SIGC10T60EX7SA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIGC10T60EX7SA1 is usually 5 days.

3.What payment methods are accepted for SIGC10T60EX7SA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIGC10T60EX7SA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIGC10T60EX7SA1?

SIGC10T60EX7SA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIGC10T60EX7SA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIGC10T60EX7SA1?

For technical support, including SIGC10T60EX7SA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIGC10T60EX7SA1 requirements.

6.How does Aetrix verify that SIGC10T60EX7SA1 is sourced from the original manufacturer or authorized distributors?

All SIGC10T60EX7SA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIGC10T60EX7SA1 meets industry standards.

7.What is the process for return or replacement of SIGC10T60EX7SA1?

All SIGC10T60EX7SA1 units undergo pre-shipment inspection (PSI). If there is an issue with SIGC10T60EX7SA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIGC10T60EX7SA1 part is unused and in its original packaging.

Return procedure for SIGC10T60EX7SA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…