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Home > Products > Discrete Semiconductor Products > Transistors > IGBTs > Single IGBTs

Infineon Technologies SIGC15T60EX1SA1

Name: SIGC15T60EX1SA1
Brand: Infineon Technologies
SKU: SIGC15T60EX1SA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SIGC15T60EX1SA1

Manufacturer:: Infineon Technologies

Category:: Single IGBTs

Package:: Die

Datasheet:: SIGC15T60EX1SA1.pdf

Description:: IGBT TRENCH FS 600V 30A DIE

Quantity:: RFQ Add To RFQ list

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Product details

Overview

SIGC15T60EX1SA1 from Infineon Technologies is a 600 V, 30 A rated bare-die TRENCHSTOP™ IGBT3 chip optimized for discrete and power module integration in industrial motor drives and resonant converters. It features 1.5 V typical V_CE(sat) at 30 A, 6 µs short-circuit withstand time at 150 °C, and positive temperature coefficient for stable parallel operation.

For engineers reviewing the SIGC15T60EX1SA1 datasheet, SIGC15T60EX1SA1 pinout (emitter/gate terminals), SIGC15T60EX1SA1 application in motor drives or white goods inverters, or SIGC15T60EX1SA1 equivalent bare-die IGBTs, this page delivers verified die-level specifications, thermal limits, gate characteristics, and application-specific design context without package assumptions.

Technical Context

This bare-die IGBT employs trench-gate and field-stop architecture to achieve low conduction loss (V_CE(sat) = 1.5 V typ. @ 30 A) and reduced turn-off energy. Its 6 µs short-circuit capability at V_CC = 360 V and T_vj = 150 °C enables robust protection in hard-switched industrial inverters.

The die exhibits a positive V_GE(th) temperature coefficient (5.0–6.5 V range) and low reverse transfer capacitance (C_res = 50 pF typ.), supporting stable current sharing and high-frequency switching up to resonant topologies. No integrated gate resistor is present-external gate drive must be designed per layout parasitics.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CE Rating	600 V DC - supports 400 V AC input rectified bus with 50 % margin for voltage transients
I_C,n	30 A - continuous collector current at T_vj = 150 °C, defining thermal design baseline
V_CE(sat)	1.5 V typ. @ 30 A, 15 V V_GE - determines conduction loss and heatsink sizing in inverter legs
t_sc	6 µs @ V_GE = 15 V, V_CC = 360 V, T_vj = 150 °C - sets minimum fault-clearing response time for driver ICs
C_ies	1630 pF typ. @ 25 V, 1 MHz - impacts gate drive power and Miller effect in high-dV/dt applications
V_GE(th)	5.8 V typ. @ 430 µA - defines minimum gate drive voltage to ensure full enhancement and avoid linear-mode operation
T_vj Range	−40 °C to +175 °C - enables operation in sealed industrial enclosures without forced air cooling

Pinout & Package

Package: Bare die (no leadframe or molded body); die size 3.92 mm × 3.88 mm; silicon thickness 70 µm; wafer diameter 200 mm; backside metallization Ni/Ag system for solder attach.

Pin/Terminal	Circuit Role	Design Meaning
E (Emitter)	Main current return path	Large-area AlSiCu pad (see chip drawing); requires low-inductance bond wire or clip attach to minimize switching overshoot
G (Gate)	Control terminal for channel modulation	0.61 mm × 1.08 mm Al pad; sensitive to ESD (MIL-STD-883 compliant); external gate resistor mandatory for dV/dt control

Key Features

Feature	Design Value
Low V_CE(sat)	1.5 V typ. @ 30 A reduces conduction loss by >25 % vs. legacy IGBTs, lowering heatsink cost in 3–5 kW drives
Short tail current	Minimizes turn-off energy (E_off) and enables faster switching without excessive dI/dt stress on snubbers
Positive V_GE(th) coefficient	Ensures inherent current balancing during parallel operation-no external emitter resistors required
6 µs short-circuit rating	Allows use with standard 5–10 µs desaturation detection circuits in industrial IPMs and discrete half-bridges

Applications

Industrial Motor Drives

Home Appliance Inverters

Use Scenario: 3-phase inverter stage in HVAC compressors and pump controllers operating at 8–16 kHz PWM frequency.

IC Role / Device Role / Timing Role: High-side/low-side switching element in IGBT-based 600 V DC-link half-bridge modules.

Use Value: Low V_CE(sat) and short tail current reduce total losses by ~18 % versus IGBT2 dies, improving efficiency at partial load.

Use Scenario: Single-phase inverter for variable-speed washing machine drum motors with regenerative braking.

IC Role / Device Role / Timing Role: Discrete IGBT in compact, cost-sensitive inverter PCBs with direct die attach to DBC substrates.

Use Value: Positive V_GE(th) coefficient enables reliable paralleling of two dies per switch leg without current-sharing resistors.

Resonant LLC Converters

Welding Power Supplies

Use Scenario: Primary-side switching device in 100–300 kHz resonant DC-DC converters for server PSUs and telecom rectifiers.

IC Role / Device Role / Timing Role: Zero-voltage switching (ZVS)-assisted hard-switched node with controlled dI/dt via gate resistance tuning.

Use Value: Low C_res (50 pF) minimizes Miller-induced false turn-on risk during high dV/dt transitions in ZVS boundary conditions.

Use Scenario: Output stage switch in IGBT-based inverter welding machines requiring burst-mode arc ignition and 500 A peak pulsed current.

IC Role / Device Role / Timing Role: Discrete high-current switch mounted on copper baseplate with soft-solder die attach.

Use Value: 90 A pulsed collector rating and 175 °C max junction temperature support 300 ms duty-cycle bursts without thermal runaway.

Equivalent & Alternatives

The following parts are listed as comparable options for similar IGBT die applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IKB15N60T	Same 600 V/30 A rating but TO-247 packaged; includes integrated gate resistor (2.2 Ω); higher V_CE(sat) (1.6 V min)	Designed for discrete PCB mounting-not bare-die module integration	Select when prototyping with through-hole evaluation or needing built-in gate resistance
FGH30S60UFD	Bare die, 600 V/30 A, but UFS (Ultra Field Stop) process; lower E_off but higher V_CE(sat) (1.7 V typ.)	Optimized for ultra-high-frequency SMPS (>500 kHz), not motor drive thermal cycling	Select for resonant converter designs prioritizing switching speed over conduction loss

Compared with IKB15N60T and FGH30S60UFD, SIGC15T60EX1SA1 offers the lowest V_CE(sat) and best thermal robustness for industrial motor drive modules where conduction loss dominates lifetime reliability-making it optimal for 8–20 kHz hard-switched inverters with high ambient temperatures.

Availability

SIGC15T60EX1SA1 is available at Aetrix Electronics and suitable for industrial motor drives, home appliance inverters, resonant LLC converters, and welding power supplies requiring stable component supply across multi-year production cycles.

Supply support for SIGC15T60EX1SA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and renewable energy systems.

SIGC15T60EX1SA1 belongs to the TRENCHSTOP™ IGBT3 family, engineered specifically for high-efficiency, high-reliability discrete and module-based power conversion in industrial motor control and resonant applications.

FAQ

Is SIGC15T60EX1SA1 qualified for automotive applications?

No. This bare-die IGBT is not qualified to AEC-Q101 or any automotive stress test standard. Infineon explicitly states in the datasheet that it is intended for industrial and consumer applications only. Automotive-grade alternatives require separate qualification documentation and are marked accordingly in product ordering codes.

What is the recommended gate drive voltage range?

The absolute maximum gate-emitter voltage is ±20 V, but the datasheet specifies V_GE = 15 V for short-circuit testing and characterization. For reliable operation, use +15 V turn-on and −5 V to −8 V turn-off to ensure fast, noise-immune switching and prevent Miller-induced false triggering under high dV/dt.

Does SIGC15T60EX1SA1 include an integrated gate resistor?

No. The datasheet explicitly states "Integrated gate resistor rG none" under Static Characteristics. External gate resistance must be added to control switching speed, suppress oscillation, and limit peak gate current-typical values range from 5 Ω to 22 Ω depending on layout inductance and desired dI/dt.

Can this die be directly soldered to a DBC substrate?

Yes. The die features Ni/Ag backside metallization specified for reliable solder attachment. Infineon recommends using soft solder (e.g., SnAgCu) and controlling reflow profile to avoid Ni layer consumption. Electrically conductive epoxy is also permitted but yields higher thermal resistance than solder.

SIGC15T60EX1SA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: TrenchStop™

Package/Case:: Die

Packaging:: Bulk

Product Status:: Active

IGBT Type:: Trench Field Stop

Voltage - Collector Emitter Breakdown (Max):: 600 V

Current - Collector (Ic) (Max):: 30 A

Current - Collector Pulsed (Icm):: 90 A

Vce(on) (Max) @ Vge, Ic:: 1.9V @ 15V, 30A

Power - Max:: -

Switching Energy:: -

Input Type:: Standard

Gate Charge:: -

Td (on/off) @ 25°C:: -

Test Condition:: -

Reverse Recovery Time (trr):: -

Operating Temperature:: -40°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: Die

SIGC15T60EX1SA1 FAQ

1.How can I place an order for SIGC15T60EX1SA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIGC15T60EX1SA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIGC15T60EX1SA1 reliable?

The price and inventory of SIGC15T60EX1SA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIGC15T60EX1SA1 is usually 5 days.

3.What payment methods are accepted for SIGC15T60EX1SA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIGC15T60EX1SA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIGC15T60EX1SA1?

SIGC15T60EX1SA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIGC15T60EX1SA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIGC15T60EX1SA1?

For technical support, including SIGC15T60EX1SA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIGC15T60EX1SA1 requirements.

6.How does Aetrix verify that SIGC15T60EX1SA1 is sourced from the original manufacturer or authorized distributors?

All SIGC15T60EX1SA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIGC15T60EX1SA1 meets industry standards.

7.What is the process for return or replacement of SIGC15T60EX1SA1?

All SIGC15T60EX1SA1 units undergo pre-shipment inspection (PSI). If there is an issue with SIGC15T60EX1SA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIGC15T60EX1SA1 part is unused and in its original packaging.

Return procedure for SIGC15T60EX1SA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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