My Inquiry
My Account
Infineon Technologies SIGC42T60NCX1SA5
- Part No.:
- SIGC42T60NCX1SA5
- Manufacturer:
- Infineon Technologies
- Category:
- Single IGBTs
- Package:
- Die
- Datasheet:
-
SIGC42T60NCX1SA5.pdf
- Description:
- IGBT 3 CHIP 600V WAFER
- Quantity:
- Payment:
- Shipping:
Inventory:8,367
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SIGC42T60NCX1SA5 from Infineon Technologies is a 600 V, 50 A NPT (Non-Punch-Through) IGBT bare die optimized for high-reliability industrial motor drives. It features a 100 µm chip thickness, positive temperature coefficient for stable parallel operation, and 6.5 × 6.5 mm² active die area with dual emitter pads (2 × 3.0 × 2.85 mm²). Used in compact, thermally constrained IGBT modules for variable-speed drive inverters.
For engineers reviewing the SIGC42T60NCX1SA5 datasheet, SIGC42T60NCX1SA5 pinout (emitter/gate/collector terminals), SIGC42T60NCX1SA5 application in motor drive modules, or SIGC42T60NCX1SA5 equivalent bare-die IGBTs, this page delivers verified die-level electrical specs, thermal behavior, switching timing under 300 V/50 A inductive load, and module integration guidance - not generic IGBT summaries.
Technical Context
This NPT-technology IGBT die operates with a gate-emitter threshold voltage of 4.5–6.5 V and exhibits a collector-emitter saturation voltage of 1.7–2.5 V at 15 V gate drive and 50 A collector current. Its 2200 pF input capacitance and 200 pF reverse transfer capacitance define gate drive strength requirements and cross-talk sensitivity in high-density module layouts.
Switching performance is characterized at Tj = 125 °C, VCC = 300 V, IC = 50 A, and RG = 3.3 Ω, yielding turn-on delay of 43 ns, rise time of 12 ns, turn-off delay of 130 ns, and fall time of 30 ns - values directly impacted by package parasitics and thus validated only in representative module test fixtures.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCE Rating | 600 V DC - supports 400 V AC input rectified bus systems with 50% safety margin |
| IC Continuous | 50 A - rated at Tjmax, defines thermal design basis for heatsink sizing in module assembly |
| VCE(sat) | 1.7–2.5 V @ 15 V VGE, 50 A - determines conduction loss and junction temperature rise under load |
| VGE(th) | 4.5–6.5 V - ensures robust noise immunity and predictable turn-on across temperature |
| Ciss | 2200 pF - sets minimum gate driver peak current requirement (~1.5 A for 100 ns rise) |
| td(off) | 130 ns - critical for dead-time calculation to prevent shoot-through in half-bridge configurations |
| Tj Range | −55 to +150 °C - enables operation in sealed industrial enclosures without forced air cooling |
Pinout & Package
Package: Bare die (unmounted silicon chip), 6.5 × 6.5 mm² outline, 100 µm thickness, photoimide passivation, Al–Si 1% emitter metallization, Ni–Ag collector metallization. Designed for epoxy or soft-solder die bonding onto DBC substrates.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Emitter Pad (2×) | Low-side current return path | Dual 3.0 × 2.85 mm² Al pads reduce current density and bond wire count in module assembly |
| Gate Pad | Control electrode | 0.8 × 1.5 mm² Al pad compatible with ≤500 µm aluminum wedge bonding |
| Collector Surface | High-side power terminal | Full backside Ni–Ag metallization enables low-resistance solder attachment to copper baseplate |
Key Features
| Feature | Design Value |
|---|---|
| Positive temperature coefficient | Enables stable current sharing without external current-balancing resistors when paralleling multiple dies |
| NPT technology | Provides soft switching characteristics and reduced tail current versus PT IGBTs, lowering Eoff |
| 100 µm thin wafer | Improves thermal resistance from junction-to-baseplate in bonded modules, enabling higher power density |
| ESD-sensitive handling | Requires MIL-STD-883 compliant handling protocols during module assembly to prevent gate oxide damage |
Applications
| Industrial Motor Drives | Pump & Compressor Inverters |
|---|---|
Use Scenario: 3-phase inverter stage in HVAC rooftop units operating at 4 kHz PWM frequency with 400 V DC bus. IC Role / Device Role / Timing Role: Main switching device in 2-level voltage-source inverter leg; handles 50 A RMS output current with <130 ns turn-off delay. Use Value: Positive tempco and low VCE(sat) enable direct paralleling of two dies per switch position, reducing thermal hotspots and simplifying thermal interface design. | Use Scenario: Compact variable-torque pump controller in water treatment skids, enclosed in IP55 cabinet with ambient up to 65 °C. IC Role / Device Role / Timing Role: High-side IGBT in half-bridge configuration driving PMSM motor; operates at Tj = 125 °C sustained. Use Value: 150 °C max junction rating allows derating margin for passive cooling, eliminating need for fan-based thermal management. |
| Elevator Traction Controllers | Conveyor System Drives |
Use Scenario: Regenerative braking stage in elevator hoist drive, requiring bidirectional energy flow and low switching loss. IC Role / Device Role / Timing Role: NPT IGBT die used with anti-parallel diode in inverter leg; leverages soft turn-off to minimize voltage overshoot during regeneration. Use Value: Low tail current and 200 pF Crss reduce snubber component stress and EMI filter size in safety-critical lift control systems. | Use Scenario: Modular conveyor drive unit mounted on steel frame with limited airflow, powered from 380 V AC supply. IC Role / Device Role / Timing Role: Output stage switch in compact 7.5 kW drive module; die bonded to ceramic DBC substrate with silver sinter paste. Use Value: 6.5 × 6.5 mm² die size and dual emitter pads support low-inductance interconnect layout, minimizing parasitic oscillation at 8 kHz switching. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar IGBT die applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| FF400R12KE4 | 1200 V, 400 A module-integrated die; larger footprint (12.5 × 12.5 mm²); higher VCE(sat) (2.1 V typ) | Targeted at higher-voltage traction and renewable energy inverters, not 600 V industrial drives | Select only if system requires >600 V blocking or >100 A per switch position |
| IKW40N60T | 600 V, 40 A TO-247 packaged IGBT; trench-field-stop structure; lower Ciss (1400 pF); no bare-die form factor | Designed for discrete PCB-mount designs, not module integration; lacks dual emitter pads and backside metallization | Choose only for prototyping or low-volume board-level builds where module assembly is impractical |
Compared with FF400R12KE4 and IKW40N60T, SIGC42T60NCX1SA5 uniquely balances 600 V rating, 50 A capability, bare-die form factor, and NPT soft-switching for cost-sensitive, space-constrained industrial drive modules - neither higher-voltage nor discrete alternatives replicate this integration-ready die specification.
Availability
SIGC42T60NCX1SA5 is available at Aetrix Electronics and suitable for industrial motor drives, pump & compressor inverters, and conveyor system drives requiring stable component supply and long-term module production continuity.
Supply support for SIGC42T60NCX1SA5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and security solutions, with core R&D in power electronics and automotive systems.
SIGC42T60NCX1SA5 belongs to Infineon's high-reliability NPT IGBT die portfolio, engineered specifically for thermally demanding, high-volume industrial inverter modules where parallel operation stability and manufacturable die bonding are critical.
FAQ
Is SIGC42T60NCX1SA5 supplied with solder preform or die attach film?
No. SIGC42T60NCX1SA5 is shipped as a bare die in nitrogen-purged containers with dot-marked orientation. Customers must select and qualify die-attach material-electrically conductive epoxy or soft-solder paste-based on their module substrate (DBC or AMB) and thermal cycling requirements. Infineon specifies Ni–Ag backside metallization for compatibility with both.
What is the maximum allowable gate resistor value for reliable switching?
Based on measured td(off) = 130 ns and Crss = 200 pF, RG must not exceed 3.3 Ω when using ±15 V gate drive to maintain safe turn-off timing margins in 20 kHz PWM systems. Higher RG increases switching losses and risks cross-conduction; lower RG demands >2 A peak gate driver capability to charge Ciss = 2200 pF within 100 ns.
Can SIGC42T60NCX1SA5 be used in 650 V DC bus applications?
No. Its absolute maximum VCE rating is 600 V DC at Tj = 25 °C, derating to ~540 V at Tj = 125 °C. For 650 V bus systems, Infineon recommends 650 V-rated dies such as IGW25N65F5, which maintains 650 V VCE rating across full temperature range and includes integrated field-stop structure.
Does this die include an integrated freewheeling diode?
No. SIGC42T60NCX1SA5 is an IGBT-only bare die. Module designers must integrate a separate fast-recovery anti-parallel diode-such as IDH08SG60C-bonded adjacent to the IGBT die on the same DBC substrate to handle inductive load commutation current.
SIGC42T60NCX1SA5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Obsolete
- IGBT Type:
- NPT
- Voltage - Collector Emitter Breakdown (Max):
- 600 V
- Current - Collector (Ic) (Max):
- 50 A
- Current - Collector Pulsed (Icm):
- 150 A
- Vce(on) (Max) @ Vge, Ic:
- 2.5V @ 15V, 50A
- Power - Max:
- -
- Switching Energy:
- -
- Input Type:
- Standard
- Gate Charge:
- -
- Td (on/off) @ 25°C:
- 43ns/130ns
- Test Condition:
- 300V, 50A, 3.3Ohm, 15V
- Reverse Recovery Time (trr):
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
SIGC42T60NCX1SA5 FAQ
1.How can I place an order for SIGC42T60NCX1SA5 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIGC42T60NCX1SA5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIGC42T60NCX1SA5 reliable?
The price and inventory of SIGC42T60NCX1SA5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIGC42T60NCX1SA5 is usually 5 days.
3.What payment methods are accepted for SIGC42T60NCX1SA5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIGC42T60NCX1SA5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIGC42T60NCX1SA5?
SIGC42T60NCX1SA5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIGC42T60NCX1SA5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIGC42T60NCX1SA5?
For technical support, including SIGC42T60NCX1SA5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIGC42T60NCX1SA5 requirements.
6.How does Aetrix verify that SIGC42T60NCX1SA5 is sourced from the original manufacturer or authorized distributors?
All SIGC42T60NCX1SA5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIGC42T60NCX1SA5 meets industry standards.
7.What is the process for return or replacement of SIGC42T60NCX1SA5?
All SIGC42T60NCX1SA5 units undergo pre-shipment inspection (PSI). If there is an issue with SIGC42T60NCX1SA5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIGC42T60NCX1SA5 part is unused and in its original packaging.
Return procedure for SIGC42T60NCX1SA5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SIGC42T60NCX1SA5 Tags
;;2.jpg)
-
STGD3NB60SDT4
STMicroelectronics
-
HGTD1N120BNS9A
onsemi
-
STGF7NB60SL
STMicroelectronics
-
FGD5T120SH
onsemi
-
STGB3NC120HDT4
STMicroelectronics
-
IKP20N60TXKSA1
Infineon Technologies
-
STGW30H60DFB
STMicroelectronics
-
STGB30M65DF2
STMicroelectronics
-
IKB20N60TATMA1
Infineon Technologies
-
STGB30V60DF
STMicroelectronics
-
IKW30N60DTPXKSA1
Infineon Technologies
-
ISL9V3040P3
onsemi
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
