STMicroelectronics STGB19NC60HDT4

Overview

STGB19NC60HDT4 from STMicroelectronics is a 600 V, 19 A very fast IGBT with integrated ultra-fast soft-recovery antiparallel diode in D²PAK (TO-263) package. It delivers V_CE(sat) = 1.8 V (typ.) at 12 A/25 °C, 31 ns reverse recovery time (t_rr), and 53 nC total gate charge-optimized for high-frequency motor controls and resonant SMPS/PFC topologies.

For engineers reviewing the STGB19NC60HDT4 datasheet, STGB19NC60HDT4 pinout, STGB19NC60HDT4 application, or STGB19NC60HDT4 equivalent, key selection criteria include its low conduction loss, ultra-fast diode softness, thermal resistance of 0.95 °C/W (junction-to-case), and suitability for hard-switched and ZVS/ZCS converters operating up to 100 kHz.

Technical Context

This IGBT employs ST's PowerMESH process to balance switching speed and on-state voltage-achieving 27 ns turn-on delay (t_d(on)) and 73 ns current fall time (t_f) at 12 A/390 V with 10 Ω gate resistor. Its integrated diode exhibits 30 nC reverse recovery charge (Q_rr) and 2.6 V forward voltage (V_F) at 12 A, enabling low-loss commutation without external snubbers.

The device operates across –55 to 150 °C junction temperature, with R_thJC = 0.95 °C/W and maximum continuous collector current of 19 A at T_C = 100 °C. Its 1180 pF input capacitance (C_ies) and 36 pF reverse transfer capacitance (C_res) support stable gate drive design in high-dV/dt environments.

Key Specifications

Pinout & Package

D²PAK (TO-263) package with exposed drain tab (pin 3) for low-inductance, high-current source connection and thermal path. Standard 3-pin layout: Gate (pin 1), Collector (pin 2), Emitter (pin 3 / tab).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar very fast IGBT applications.

Compared with STGP19NC60HD and STGW19NC60HD, STGB19NC60HDT4 offers the smallest footprint and best PCB thermal integration via D²PAK's exposed tab, making it optimal for space-constrained, surface-mount PFC and motor control modules where thermal path optimization outweighs package ruggedness requirements.

Availability

STGB19NC60HDT4 is available at Aetrix Electronics and suitable for high-frequency motor controls, resonant SMPS, and hard-switched PFC applications requiring stable component supply, consistent parametric performance, and long-term manufacturing continuity.

Supply support for STGB19NC60HDT4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

This device belongs to ST's PowerMESH™ IGBT family, engineered specifically for high-efficiency, high-frequency power conversion in motor drives, SMPS, and PFC circuits where low conduction loss and fast, soft switching are critical.

FAQ

What gate drive voltage and resistance are recommended for STGB19NC60HDT4?

ST specifies ±20 V absolute maximum gate-emitter voltage. For optimal switching performance and safe operation, use V_GE = +15 V / –5 V with a 10 Ω gate resistor-verified to achieve 27 ns t_d(on), 97 ns t_d(off), and minimal oscillation in 390 V inductive tests per DS4967 Figure 20.

Does STGB19NC60HDT4 require an external freewheeling diode?

No. The device integrates a monolithic ultra-fast soft-recovery antiparallel diode with 31 ns t_rr, 30 nC Q_rr, and 2.6 V V_F at 12 A-fully qualified for freewheeling in bridge configurations without external diodes, as confirmed in DS4967 Table 7 and Figure 16.

How does thermal performance compare between STGB19NC60HDT4 and TO-247 variants?

STGB19NC60HDT4 has R_thJC = 0.95 °C/W (D²PAK), versus 0.9 °C/W for STGW19NC60HD (TO-247). Though TO-247 offers marginally better thermal resistance, the D²PAK's exposed tab enables superior PCB copper thermal spreading-yielding comparable or better system-level thermal performance in compact SMT designs.

Is STGB19NC60HDT4 compliant with RoHS and REACH regulations?

Yes. STGB19NC60HDT4 is manufactured in ST's ECOPACK®-compliant D²PAK package, meeting RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006, with lead-free terminations and halogen-free molding compound per DS4967 Section 4.