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STMicroelectronics STGB20H65FB2

Part No.:
STGB20H65FB2
Manufacturer:
STMicroelectronics
Category:
Single IGBTs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixSTGB20H65FB2.pdf
Description:
IGBT 600V 40A 167W D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,786

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Product details

Overview

STGB20H65FB2 from STMicroelectronics is a 650 V, 20 A high-speed trench gate field-stop IGBT in D²PAK package, optimized for fast-switching PFC, solar inverters, and EV DC fast charging. It delivers low VCE(sat) = 1.65 V (typ.) at 20 A/25 °C, minimized tail current, positive VCE(sat) temperature coefficient, and RthJC = 1.02 °C/W for thermal reliability in high-power welding and UPS systems.

For engineers reviewing the STGB20H65FB2 datasheet, STGB20H65FB2 pinout, STGB20H65FB2 application, or STGB20H65FB2 equivalent, key selection criteria include conduction loss at 175 °C junction, switching energy (Eon = 265 µJ / Eoff = 214 µJ @ 25 °C), gate charge (Qg = 56 nC), and safe operating area up to 100 µs pulse width.

Technical Context

This IGBT employs ST's proprietary HB2-series trench gate field-stop structure, engineered to reduce conduction losses at low-to-moderate currents while lowering total switching energy-especially turn-off energy including tail current contribution. Its positive VCE(sat) temperature coefficient enables inherent current sharing in parallel configurations.

The device operates with ±20 V gate-emitter voltage rating and supports robust switching under VCC = 400–520 V, IC = 20 A, and RG = 10 Ω conditions. Thermal design is enabled by validated junction-to-case resistance (1.02 °C/W) and defined FSOA up to TJ = 175 °C across pulse widths from 1 µs to 1 ms.

Key Specifications

Parameter Value and Actual Design Meaning
VCES 650 V - Withstands full DC bus voltage in single-phase PFC and 600 V-class solar string inverters without derating.
IC (TC = 100 °C) 25 A - Sustains continuous conduction in thermally constrained UPS and EV charger modules at 100 °C case temperature.
VCE(sat) (20 A, 25 °C) 1.65 V (typ.) - Reduces conduction loss to ~33 W at 20 A, critical for efficiency in high-duty-cycle welding applications.
Eoff (20 A, 25 °C) 214 µJ - Includes tail current contribution; enables <100 kHz switching in central solar inverters with controlled thermal rise.
RthJC 1.02 °C/W - Allows direct heatsink mounting in D²PAK footprint; limits ΔTJ-C to ≤102 °C at 100 W dissipation.
Qg 56 nC - Determines gate drive power requirement (~1.7 W @ 100 kHz, 15 V swing); compatible with standard IGBT drivers (e.g., STGAP2S).
TJ max 175 °C - Enables operation in high-ambient environments like enclosed EV charging cabinets without forced air cooling.

Pinout & Package

D²PAK (TO-263) package with isolated tab (collector), 3-pin outline: G (pin 1), C (pin 2 + tab), E (pin 3). The metal tab is electrically connected to the collector and serves as primary thermal path to heatsink.

Pin/Terminal Circuit Role Design Meaning
Pin 1 (G) Gate Controls IGBT turn-on/off; requires ±20 V rating and low-inductance layout to suppress oscillation during fast dV/dt transitions.
Pin 2 + Tab (C) Collector Main high-side power terminal; tab provides low-thermal-resistance path to heatsink and must be electrically isolated from PCB ground plane.
Pin 3 (E) Emitter Reference node for gate drive and current sensing; low-inductance Kelvin emitter connection recommended for accurate VCE(sat) monitoring.

Key Features

Feature Design Value
Minimized tail current Reduces Eoff dependency on temperature and enables faster turn-off with lower voltage overshoot in inductive loads.
Tight parameter distribution Ensures consistent VCE(sat) and switching timing across production lots-critical for parallel IGBT operation in multi-level inverters.
Positive VCE(sat) tempco Provides natural current balancing when multiple devices share load, eliminating need for external emitter resistors in paralleled designs.
Low thermal resistance RthJC = 1.02 °C/W allows >100 W continuous dissipation with modest heatsinking-ideal for space-constrained industrial welders.

Applications

Welding Power Supplies Solar String Inverters

Use Scenario: High-current, medium-frequency (10–50 kHz) DC output stage in IGBT-based inverter welders.

IC Role / Device Role / Timing Role: Main switching device in full-bridge output stage, handling 20–40 A pulsed load with 100 µs–1 ms duty cycles.

Use Value: Low VCE(sat) minimizes conduction loss during long on-times; tight parameter spread ensures balanced current sharing across paralleled bridges.

Use Scenario: DC–AC conversion stage in residential solar string inverters with 600 V DC input.

IC Role / Device Role / Timing Role: High-side switch in three-phase inverter leg, switching at 16–20 kHz with sinusoidal PWM modulation.

Use Value: Optimized Eon/Eoff balance reduces total switching loss at partial load; 175 °C rating supports passive-cooled enclosure designs.

Uninterruptible Power Supplies EV DC Fast Charging Stations

Use Scenario: Bidirectional AC–DC converter in online double-conversion UPS systems.

IC Role / Device Role / Timing Role: IGBT in active rectifier stage, conducting continuous 25 A at 100 °C case temperature.

Use Value: RthJC = 1.02 °C/W enables stable thermal performance without fan-assisted cooling; positive VCE(sat) tempco improves reliability under load transients.

Use Scenario: Primary switching element in 15–30 kW DC fast charging modules converting AC grid to 200–1000 V DC output.

IC Role / Device Role / Timing Role: High-efficiency switch in interleaved boost PFC and DC–DC isolation stages, operating at 30–60 kHz.

Use Value: Minimized tail current reduces Eoff at high TJ, enabling >98% system efficiency even at 55 °C ambient cabinet temperature.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed 650 V IGBT applications.

Alternative Part Technical Difference Application Difference Selection Advice
IXYS IXGN20N60B3 600 V rating, higher VCE(sat) = 1.8 V (20 A), RthJC = 1.2 °C/W, no specified tail current optimization. Limited to ≤600 V DC bus; less suitable for 650 V solar string inverters or 700 V EV charger front-ends. Select only if system DC link is strictly ≤600 V and thermal margin exceeds 20 °C above STGB20H65FB2 capability.
Infineon IKP20N65ES5 650 V, 20 A, but higher Eoff = 320 µJ (20 A, 25 °C), VCE(sat) = 1.75 V, RthJC = 1.15 °C/W. Higher switching loss increases heatsink size in 50+ kHz EV charger PFC stages; less efficient at light load. Preferable only where gate drive compatibility with older Infineon driver families (e.g., 1ED020I12FA) is mandatory.

Compared with IXGN20N60B3 and IKP20N65ES5, STGB20H65FB2 offers superior conduction efficiency at 20 A, lower thermal resistance, and specifically minimized tail current-making it the optimal choice for high-frequency, high-temperature applications demanding both low Eoff and stable VCE(sat) behavior across -40 to 175 °C.

Availability

STGB20H65FB2 is available at Aetrix Electronics and suitable for welding power supplies, solar string inverters, and EV DC fast charging stations requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial-grade production.

Supply support for STGB20H65FB2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

The HB2-series IGBTs are part of ST's high-efficiency power switching portfolio, developed specifically to address efficiency and thermal challenges in next-generation renewable energy and electrified transportation systems.

FAQ

What is the maximum continuous collector current at 100 °C case temperature?

The STGB20H65FB2 supports 25 A continuous collector current at TC = 100 °C, as specified in Table 1 of DS13362 Rev 2. This rating assumes proper heatsinking and adherence to the derating curve in Figure 2, where current decreases linearly from 40 A at 25 °C to 25 A at 100 °C.

Does this IGBT require a negative gate voltage for reliable turn-off?

No. STGB20H65FB2 is rated for VGE = ±20 V, but stable turn-off is achieved with 0 V gate bias. A negative voltage (e.g., –5 V) is optional and used only to improve noise immunity in high-dV/dt environments; it is not required for functional operation per datasheet test conditions.

Can STGB20H65FB2 be paralleled with identical units without external emitter resistors?

Yes. Its positive VCE(sat) temperature coefficient ensures inherent current balancing across paralleled devices. ST's application note AN4729 confirms that matched HB2-series IGBTs can be paralleled with shared gate drive and Kelvin emitter routing-no external emitter resistors needed for static or dynamic balancing.

What is the recommended gate resistor value for 400 V, 20 A switching at 50 kHz?

For VCC = 400 V, IC = 20 A, and fsw = 50 kHz, ST recommends RG = 10 Ω (per Figure 19 and Table 5). This value balances switching speed (td(off) ≈ 98 ns at 175 °C) and voltage overshoot, while keeping gate drive power within 2 W for typical 15 V logic-level drivers.

STGB20H65FB2 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
HB2
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Active
IGBT Type:
Trench Field Stop
Voltage - Collector Emitter Breakdown (Max):
650 V
Current - Collector (Ic) (Max):
40 A
Current - Collector Pulsed (Icm):
60 A
Vce(on) (Max) @ Vge, Ic:
2.1V @ 15V, 20A
Power - Max:
147 W
Switching Energy:
265µJ (on), 214µJ (off)
Input Type:
Standard
Gate Charge:
56 nC
Td (on/off) @ 25°C:
16ns/78.8ns
Test Condition:
400V, 20A, 10Ohm, 15V
Reverse Recovery Time (trr):
-
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-263 (D2PAK)

STGB20H65FB2 FAQ

1.How can I place an order for STGB20H65FB2 through Aetrix?

Please submit a Request for Quotation (RFQ) for STGB20H65FB2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STGB20H65FB2 reliable?

The price and inventory of STGB20H65FB2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGB20H65FB2 is usually 5 days.

3.What payment methods are accepted for STGB20H65FB2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGB20H65FB2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STGB20H65FB2?

STGB20H65FB2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STGB20H65FB2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STGB20H65FB2?

For technical support, including STGB20H65FB2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGB20H65FB2 requirements.

6.How does Aetrix verify that STGB20H65FB2 is sourced from the original manufacturer or authorized distributors?

All STGB20H65FB2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGB20H65FB2 meets industry standards.

7.What is the process for return or replacement of STGB20H65FB2?

All STGB20H65FB2 units undergo pre-shipment inspection (PSI). If there is an issue with STGB20H65FB2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STGB20H65FB2 part is unused and in its original packaging.

Return procedure for STGB20H65FB2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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