My Inquiry
My Account
STMicroelectronics STGB20NB32LZ
- Part No.:
- STGB20NB32LZ
- Manufacturer:
- STMicroelectronics
- Category:
- Single IGBTs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
STGB20NB32LZ.pdf
- Description:
- IGBT 375V 40A 150W I2PAK
- Quantity:
- Payment:
- Shipping:
Inventory:9,819
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STGB20NB32LZ from STMicroelectronics is an N-channel internally clamped PowerMESH™ IGBT with 350 V clamped VCES, 20 A continuous collector current at Tc = 25 °C, 1.8 V typical VCE(sat) at 10 A/25 °C, and integrated gate-emitter zener ESD protection. It is designed for automotive electronic ignition systems requiring robust overvoltage clamping and high pulsed current capability.
For engineers reviewing the STGB20NB32LZ datasheet, STGB20NB32LZ pinout, STGB20NB32LZ application, or STGB20NB32LZ equivalent, key selection criteria include clamped breakdown voltage (350 V typ), low threshold voltage (1.4 V typ), thermal resistance (1 °C/W junction-to-case), and D2PAK package compatibility with high-power ignition coil drivers.
Technical Context
This IGBT uses ST's patented strip-layout PowerMESH™ structure to achieve precise active clamping via an integrated collector-gate zener and ESD protection via a gate-emitter zener. Its low VGE(th) (1.4 V typ) enables direct drive from low-voltage microcontrollers, while its 700 mJ single-pulse avalanche energy rating supports unclamped inductive switching in ignition coils.
The device operates up to 175 °C junction temperature with 1 °C/W Rthj-case, enabling compact heatsink designs. Its dynamic parameters-11.5 µs td(off), 2 µs tf, and 11.8 mJ Eoff at 25 °C-support fast, controlled turn-off critical for spark timing accuracy in gasoline engine ignition systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCES | Clamped at 350 V typical - ensures reliable operation under inductive kickback without external snubber |
| IC (continuous) | 20 A at Tc = 25 °C - supports sustained coil energization in 4–8 cylinder engine cycles |
| VCE(sat) | 1.8 V max at 10 A/25 °C - minimizes conduction loss and thermal stress during dwell time |
| VGE(th) | 1.4 V typical - allows direct interface with 3.3 V or 5 V MCU GPIO without level-shifting |
| Eas | 700 mJ single-pulse - sustains repeated unclamped inductive switching in coil-on-plug architectures |
| Rthj-case | 1 °C/W max - enables efficient heat transfer to PCB copper or small heatsinks in space-constrained modules |
| Qg | 51 nC - determines gate driver power requirement and switching speed trade-off in ignition control |
Pinout & Package
STGB20NB32LZ is housed in a surface-mount D2PAK (TO-263) package with three terminals: Gate (G), Collector (C), and Emitter (E). The package features a large exposed drain pad for thermal dissipation and mechanical stability on high-current PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control input | Receives voltage-driven signal; zener-protected against ±14 V transients per BVGE spec |
| 2 (Collector) | High-side switch output | Connected to ignition coil primary; clamped by internal zener to limit VCE during flyback |
| 3 (Emitter) | Power return path | Serves as common reference for gate drive and current sensing; bonded to exposed thermal pad |
Key Features
| Feature | Design Value |
|---|---|
| Internally clamped VCES | 350 V typical with tight ±25 V tolerance - eliminates need for external clamp diode in ignition coil drivers |
| Integrated gate-emitter zener | 14 V breakdown - provides Class 4 HBM ESD protection (4 kV) without external TVS |
| Low VGE(th) | 1.4 V typical - enables direct drive from automotive MCUs with 3.3 V LDO outputs |
| High ICM | 80 A pulsed - supports peak currents during cold-start and high-RPM spark events |
| 175 °C max Tj | Rated for under-hood environments - maintains safe SOA in engine compartment temperatures up to 150 °C ambient |
Applications
| Automotive Ignition Coil Driver | Industrial Inductive Load Switch |
|---|---|
|
Use Scenario: Driving primary winding of distributorless ignition system (DIS) or coil-on-plug (COP) units in gasoline engines. IC Role / Device Role / Timing Role: High-side switch controlling dwell time and spark timing via precise IGBT turn-on/turn-off. Use Value: Internal clamping eliminates external snubber components, reducing BOM count and PCB area by ~30% in compact ignition modules. |
Use Scenario: Controlling solenoid valves, contactors, or relay coils in industrial PLC output stages. IC Role / Device Role / Timing Role: Robust unclamped inductive switching element handling repetitive 10–100 ms pulses at 20–50 V. Use Value: 700 mJ Eas rating enables reliable operation without external freewheeling diodes in cost-sensitive valve driver designs. |
| Motor Starter Circuit | DC-DC Converter Primary Switch |
|
Use Scenario: High-current pulse switching in automotive starter motor pre-engagement circuits. IC Role / Device Role / Timing Role: Low-loss, high-current switch managing 40 A peak pulses during gear engagement. Use Value: 40 A IC rating at 25 °C and 1.8 V VCE(sat) minimize voltage drop and heat generation during cranking. |
Use Scenario: Primary-side switch in isolated flyback or forward converters operating up to 300 V DC input. IC Role / Device Role / Timing Role: Voltage-driven power switch with fast turn-off (11.5 µs td(off)) for high-frequency PWM control. Use Value: 51 nC Qg and 11.8 mJ Eoff support efficient 50–100 kHz switching with standard gate drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar IGBT switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STGP20NC60WD | 600 V VCES, higher VCE(sat) (2.2 V), no internal clamping | Requires external RC snubber for inductive loads; suited for higher bus voltage SMPS | Select when >400 V blocking is required and clamping can be implemented externally |
| FGB20N30AP | 300 V VCES, lower IC (15 A), no integrated zener ESD protection | Lacks gate-emitter zener; requires external ESD protection in automotive environments | Choose only if board-level ESD protection is already implemented and lower current suffices |
Compared with STGP20NC60WD and FGB20N30AP, STGB20NB32LZ uniquely combines 350 V clamping, 20 A rating, and integrated ESD protection-making it the only drop-in solution for space-constrained, high-reliability automotive ignition modules without added protection components.
Availability
STGB20NB32LZ is available at Aetrix Electronics and suitable for automotive ignition systems, industrial solenoid drivers, and DC-DC converter primary switches requiring stable component supply across extended production lifecycles.
Supply support for STGB20NB32LZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power discrete technologies with vertical manufacturing capabilities.
STGB20NB32LZ belongs to the PowerMESH™ IGBT family, engineered specifically for high-reliability automotive ignition and industrial inductive load switching where internal voltage clamping and gate robustness are critical.
FAQ
Is STGB20NB32LZ still in active production?
No-STGB20NB32LZ is marked as Obsolete Product(s) in the official ST datasheet (Rev. December 2003). However, Aetrix Electronics maintains legacy inventory with full traceability and offers engineering support for design continuity, including cross-reference guidance and obsolescence mitigation strategies.
What is the maximum recommended gate resistor value for driving STGB20NB32LZ in ignition applications?
Based on the datasheet's switching test conditions (RG = 1 kΩ), the maximum recommended gate resistor is 1.2 kΩ to maintain td(off) ≤ 12 µs and Eoff ≤ 17.8 mJ at 150 °C. Higher values increase switching losses and risk thermal runaway during high-duty-cycle operation.
Can STGB20NB32LZ replace STGB20NB32LZ-1 in a D2PAK footprint?
No-STGB20NB32LZ-1 uses the I2PAK (TO-262) package with different mechanical dimensions and thermal pad layout. While both share identical electrical specs, the D2PAK (STGB20NB32LZ) has a larger exposed pad and different lead pitch; PCB layout and thermal design are not interchangeable.
Does the internal clamping feature eliminate the need for an external freewheeling diode?
No-the internal collector-gate zener clamps VCE during inductive flyback but does not provide a current path for stored coil energy. An external freewheeling diode remains necessary to complete the current loop and prevent destructive reverse voltage across the coil winding.
STGB20NB32LZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- PowerMESH™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tube
- Product Status:
- Obsolete
- IGBT Type:
- -
- Voltage - Collector Emitter Breakdown (Max):
- 375 V
- Current - Collector (Ic) (Max):
- 40 A
- Current - Collector Pulsed (Icm):
- 80 A
- Vce(on) (Max) @ Vge, Ic:
- 2V @ 4.5V, 20A
- Power - Max:
- 150 W
- Switching Energy:
- 11.8mJ (off)
- Input Type:
- Standard
- Gate Charge:
- 51 nC
- Td (on/off) @ 25°C:
- 2.3µs/11.5µs
- Test Condition:
- 250V, 20A, 1kOhm, 4.5V
- Reverse Recovery Time (trr):
- -
- Operating Temperature:
- 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
STGB20NB32LZ FAQ
1.How can I place an order for STGB20NB32LZ through Aetrix?
Please submit a Request for Quotation (RFQ) for STGB20NB32LZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STGB20NB32LZ reliable?
The price and inventory of STGB20NB32LZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGB20NB32LZ is usually 5 days.
3.What payment methods are accepted for STGB20NB32LZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGB20NB32LZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STGB20NB32LZ?
STGB20NB32LZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STGB20NB32LZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STGB20NB32LZ?
For technical support, including STGB20NB32LZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGB20NB32LZ requirements.
6.How does Aetrix verify that STGB20NB32LZ is sourced from the original manufacturer or authorized distributors?
All STGB20NB32LZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGB20NB32LZ meets industry standards.
7.What is the process for return or replacement of STGB20NB32LZ?
All STGB20NB32LZ units undergo pre-shipment inspection (PSI). If there is an issue with STGB20NB32LZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STGB20NB32LZ part is unused and in its original packaging.
Return procedure for STGB20NB32LZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STGB20NB32LZ Tags
;;2.jpg)
-
STGD3NB60SDT4
STMicroelectronics
-
HGTD1N120BNS9A
onsemi
-
STGF7NB60SL
STMicroelectronics
-
FGD5T120SH
onsemi
-
STGB3NC120HDT4
STMicroelectronics
-
IKP20N60TXKSA1
Infineon Technologies
-
STGW30H60DFB
STMicroelectronics
-
STGB30M65DF2
STMicroelectronics
-
IKB20N60TATMA1
Infineon Technologies
-
STGB30V60DF
STMicroelectronics
-
IKW30N60DTPXKSA1
Infineon Technologies
-
ISL9V3040P3
onsemi
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
