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STMicroelectronics STGB7NB60KDT4

Part No.:
STGB7NB60KDT4
Manufacturer:
STMicroelectronics
Category:
Single IGBTs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixSTGB7NB60KDT4.pdf
Description:
IGBT 600V 14A 80W D2PAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,830

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Product details

Overview

STGB7NB60KDT4 from STMicroelectronics is a short-circuit-rated N-channel 600 V, 7 A PowerMESH™ IGBT co-packaged with a Turboswitch™ antiparallel diode in D2PAK (TO-263) package. It delivers 2.3–2.8 V VCE(sat) at 7 A and 15 VGE, supports 10 µs short-circuit withstand time at Tj = 125 °C, and targets high-frequency motor control and resonant SMPS/PFC topologies.

For engineers reviewing the STGB7NB60KDT4 datasheet, STGB7NB60KDT4 pinout, STGB7NB60KDT4 application, or STGB7NB60KDT4 equivalent, key selection criteria include its 600 V blocking capability, low gate charge (32.7 nC), 10 µs short-circuit rating, thermal resistance (Rthj-case = 5 °C/W), and integrated fast recovery diode (trr = 50 ns).

Technical Context

This IGBT employs ST's patented PowerMESH™ strip layout for high current density and reduced conduction losses. Its gate threshold voltage (5–7 V) ensures robust noise immunity, while the integrated Turboswitch™ diode enables bidirectional current handling without external components.

The device is optimized for hard-switched and resonant topologies operating up to 100 kHz, with turn-off switching loss of 300 µJ at Tj = 125 °C and RG = 10 Ω. Its safe operating area (SOA) is validated for inductive loads with VCC = 480 V and IC = 7 A.

Key Specifications

ParameterValue and Actual Design Meaning
VCES600 V - Enables use in 400 V DC bus systems with 50 % safety margin
VCE(sat)2.3–2.8 V @ 7 A, 15 VGE - Minimizes conduction loss in continuous motor drive
IC (cont.)7 A @ TC = 100 °C - Sustains rated current under industrial ambient conditions
Qg32.7 nC - Reduces gate driver power requirement and switching transition time
tscw10 µs @ VCE = 300 V, Tj = 125 °C - Supports fault detection and protection circuitry response time
Rthj-case5 °C/W - Enables thermal design with standard heatsink for <10 W dissipation
trr (diode)50 ns @ IF = 7 A, Tj = 125 °C - Limits reverse recovery loss in bridge-leg commutation

Pinout & Package

D2PAK (TO-263) surface-mount package with exposed drain pad for enhanced thermal performance and mechanical robustness in high-power applications.

Pin/TerminalCircuit RoleDesign Meaning
1 (Gate)Control inputHigh-impedance voltage-driven terminal requiring ≤ ±20 VGE; 32.7 nC total gate charge defines driver sizing
2 (Collector)High-side power outputConnected to DC bus or inductive load; handles 600 V blocking and 7 A conduction
3 (Emitter)Power return / referenceCommon node for gate drive reference and current sensing; tied to source of antiparallel diode

Key Features

FeatureDesign Value
Short-circuit rated10 µs withstand time at 125 °C junction temperature enables reliable overcurrent protection
Co-packaged Turboswitch™ diodeIntegrated 7 A/50 ns fast recovery diode eliminates discrete placement and layout parasitics
Low VCE(sat)2.3 V typical at 7 A reduces conduction loss by >15 % vs. comparable 600 V IGBTs
High dI/dt capability980 A/µs turn-on di/dt supports rapid current ramping in PFC boost stages
Optimized for high frequency395 µJ total switching loss at 125 °C enables operation up to 100 kHz in resonant converters

Applications

Motor Drive Inverter StageIndustrial PFC Boost Converter

Use Scenario: Three-phase inverter driving 0.75 kW BLDC motor in HVAC compressor.

IC Role / Device Role / Timing Role: High-side switch in 6-step commutation; switches at 16 kHz with dead-time control.

Use Value: 2.3 V VCE(sat) reduces conduction loss by 1.6 W per device vs. legacy 600 V IGBTs, lowering heatsink requirements.

Use Scenario: Active front-end PFC stage in 3 kW server PSU using interleaved boost topology.

IC Role / Device Role / Timing Role: Main switching element in hard-switched boost cell operating at 65 kHz.

Use Value: 10 µs short-circuit rating allows full-cycle fault detection before thermal runaway, improving system reliability.

Resonant LLC Half-BridgeUPS Inverter Output Stage

Use Scenario: Secondary-side synchronous rectification control in 1.5 kW telecom LLC resonant converter.

IC Role / Device Role / Timing Role: Low-side switch in half-bridge configuration; operates in ZVS region with 300 kHz fundamental frequency.

Use Value: Integrated Turboswitch™ diode provides controlled reverse recovery (50 ns) to minimize voltage spikes during zero-voltage turn-on.

Use Scenario: 2 kVA online UPS delivering sine-wave output with double-conversion architecture.

IC Role / Device Role / Timing Role: Output inverter switch in H-bridge; modulated via SPWM at 10 kHz carrier.

Use Value: 5 °C/W Rthj-case enables direct PCB copper pour heatsinking, eliminating clip-on heatsinks in compact chassis designs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar IGBT switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRG4PH60KDHigher VCE(sat) (2.7 V typ), higher Qg (54 nC), no integrated diodeRequires external fast diode; less suitable for space-constrained PFC layoutsSelect when gate drive strength exceeds 2 A peak and discrete diode layout is acceptable
FGH60N60SMDLower IC rating (6 A @ 100 °C), higher tscw (15 µs), same D2PAK packageBetter short-circuit margin but lower current headroom in motor drive overload conditionsSelect when system-level fault duration exceeds 12 µs and thermal derating allows 6 A continuous

Compared with IRG4PH60KD and FGH60N60SMD, STGB7NB60KDT4 offers the lowest combined conduction–switching loss (2.3 V + 395 µJ) and integrated diode functionality-critical for minimizing board area and EMI in high-density PFC and inverter modules.

Availability

STGB7NB60KDT4 is available at Aetrix Electronics and suitable for high-frequency motor controls, industrial PFC boost converters, and resonant LLC half-bridges requiring stable component supply and tape-and-reel delivery for automated assembly.

Supply support for STGB7NB60KDT4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

The PowerMESH™ IGBT product line targets high-efficiency, high-reliability power conversion systems-including motor drives, UPS, and renewable energy inverters-with emphasis on short-circuit ruggedness and high-frequency operability.

FAQ

What is the maximum gate-emitter voltage rating for STGB7NB60KDT4?

The absolute maximum VGE is ±20 V. Exceeding this risks permanent gate oxide damage. Recommended operating range is –10 V to +15 V for reliable turn-off and noise immunity. Gate drive circuits must include clamping (e.g., Zener diodes) to prevent overshoot during fast switching transitions.

Does STGB7NB60KDT4 require an external freewheeling diode?

No. The device integrates a Turboswitch™ antiparallel diode rated for 7 A continuous forward current and 50 ns reverse recovery time. This eliminates the need for an external diode in half-bridge or inverter leg configurations, reducing component count and layout complexity.

How does the short-circuit withstand time vary with junction temperature?

tscw is specified at 10 µs at Tj = 125 °C and VCE = 300 V. At Tj = 25 °C, it extends to ~18 µs; at Tj = 150 °C, it drops below 8 µs. System protection must be designed for worst-case 125 °C condition to ensure consistent fault clearance.

Can STGB7NB60KDT4 be used in parallel configurations?

Yes, but only with matched devices, identical gate drive loop inductance, and symmetrical thermal mounting. The positive VGE(th) temperature coefficient (5–7 V) supports current sharing, but gate resistance tuning (typically 10–15 Ω per device) is required to balance dynamic current distribution during switching transients.

STGB7NB60KDT4 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
PowerMESH™
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
IGBT Type:
-
Voltage - Collector Emitter Breakdown (Max):
600 V
Current - Collector (Ic) (Max):
14 A
Current - Collector Pulsed (Icm):
56 A
Vce(on) (Max) @ Vge, Ic:
2.8V @ 15V, 7A
Power - Max:
80 W
Switching Energy:
140µJ (off)
Input Type:
Standard
Gate Charge:
32.7 nC
Td (on/off) @ 25°C:
15ns/50ns
Test Condition:
480V, 7A, 10Ohm, 15V
Reverse Recovery Time (trr):
50 ns
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
D2PAK

STGB7NB60KDT4 FAQ

1.How can I place an order for STGB7NB60KDT4 through Aetrix?

Please submit a Request for Quotation (RFQ) for STGB7NB60KDT4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STGB7NB60KDT4 reliable?

The price and inventory of STGB7NB60KDT4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGB7NB60KDT4 is usually 5 days.

3.What payment methods are accepted for STGB7NB60KDT4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGB7NB60KDT4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STGB7NB60KDT4?

STGB7NB60KDT4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STGB7NB60KDT4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STGB7NB60KDT4?

For technical support, including STGB7NB60KDT4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGB7NB60KDT4 requirements.

6.How does Aetrix verify that STGB7NB60KDT4 is sourced from the original manufacturer or authorized distributors?

All STGB7NB60KDT4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGB7NB60KDT4 meets industry standards.

7.What is the process for return or replacement of STGB7NB60KDT4?

All STGB7NB60KDT4 units undergo pre-shipment inspection (PSI). If there is an issue with STGB7NB60KDT4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STGB7NB60KDT4 part is unused and in its original packaging.

Return procedure for STGB7NB60KDT4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STGB7NB60KDT4 Tags

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