STMicroelectronics STGD6NC60HDT4
- Part No.:
- STGD6NC60HDT4
- Manufacturer:
- STMicroelectronics
- Category:
- Single IGBTs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
STGD6NC60HDT4.pdf
- Description:
- IGBT 600V 15A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:1,882
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Product details
Overview
STGD6NC60HDT4 from STMicroelectronics is an N-channel 600V, 7A (at TC = 100°C) PowerMESH™ IGBT in DPAK package, optimized for high-frequency switching with ultra-fast soft recovery antiparallel diode, low VCE(sat) (<2.5 V), and reduced tfall. It targets hard-switched and resonant SMPS, PFC stages, and motor drivers requiring robust high-voltage switching at >20 kHz.
For engineers reviewing the STGD6NC60HDT4 datasheet, STGD6NC60HDT4 pinout, STGD6NC60HDT4 application, or STGD6NC60HDT4 equivalent, key selection criteria include its 600V VCES, 2.5V max VCE(sat) at 125°C, 100 ns typical tf at 25°C, CRES/CIES ratio minimizing cross-conduction risk, and integrated ultra-soft recovery diode with 34 ns trr at 125°C.
Technical Context
This IGBT employs ST's patented PowerMESH™ strip layout to achieve high voltage blocking (600 V) while maintaining low conduction loss (VCE(sat) ≤ 2.5 V @ 3 A, 125°C) and fast switching (toff = 124 ns typ. @ 125°C). Its gate charge profile (Qg = 13.6 nC) and low CRES/CIES ratio (≈0.027) support stable operation in high-dV/dt environments without shoot-through.
The co-packaged ultra-soft recovery diode delivers trr = 34 ns and Qrr = 32 nC at 125°C, enabling clean commutation in resonant topologies. Thermal resistance Rth(j-case) = 2 °C/W allows 56 W dissipation at TC = 25°C - critical for compact heatsink designs in space-constrained SMPS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCES | 600 V - supports DC bus voltages up to 400 V nominal with 1.5× safety margin in industrial PFC and inverter stages |
| VCE(sat) max | 2.5 V @ IC = 3 A, TC = 125°C - enables <1.8 W conduction loss per device at 3 A, reducing thermal load in high-density layouts |
| tf | 124 ns typ. @ Tj = 125°C - supports >200 kHz switching in ZVS/ZCS topologies without excessive Eoff penalty |
| CRES/CIES | ≈0.027 (5.5 pF / 205 pF) - suppresses Miller-induced turn-on, eliminating need for negative gate drive in high-side configurations |
| trr (diode) | 34 ns @ Tj = 125°C - ensures minimal reverse recovery tail current during hard commutation, reducing voltage overshoot and snubber stress |
| Rth(j-case) | 2 °C/W - permits direct mounting to small heatsinks (e.g., 10 cm² aluminum) for 30–40 W continuous output in open-frame SMPS |
| Eoff | 93 µJ @ Tj = 125°C - defines minimum gate drive energy required to achieve specified toff; informs RG selection (10 Ω used in test) |
Pinout & Package
DPAK (TO-252) package: single-sided heat transfer via exposed drain pad; 3-terminal surface-mount configuration with gull-wing leads. Compatible with standard reflow profiles (peak 260°C, 10 sec).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control input | High-impedance MOS gate requiring 15 V drive; Qge = 3.4 nC defines minimum gate driver current capability |
| 2 (Collector) | High-side power switch node | Connected to DC bus or transformer primary; rated for 600 V blocking and 21 A pulsed current |
| 3 (Emitter) | Power return / reference node | Low-inductance emitter connection critical for stable switching; ties to source of antiparallel diode and PCB ground plane |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-soft recovery antiparallel diode | 34 ns trr and 1.88 A IRRM at 125°C enable zero-current switching in LLC resonant converters without external diode |
| Low CRES/CIES ratio | 0.027 minimizes Miller feedback, allowing reliable operation with unidirectional 15 V gate drive in half-bridge high-side position |
| Optimized for high frequency | Reduced tfall (124 ns) and low Eoff (93 µJ) sustain efficiency >94% in 100–300 kHz PFC stages |
| PowerMESH™ strip layout | Enables 600 V rating with 2.5 V VCE(sat) - achieves 30% lower conduction loss vs. planar IGBTs of same voltage class |
Applications
| Active Clamp Forward Converter | Three-Phase BLDC Inverter |
|---|---|
Use Scenario: 300–400 V input, 100–200 kHz active clamp forward topology for telecom rectifiers and server PSUs. IC Role / Device Role / Timing Role: Main switch handling primary-side energy transfer and clamp reset; operates in hard-switched mode with controlled dV/dt. Use Value: Low VCE(sat) reduces conduction loss at full load; ultra-soft diode absorbs clamp energy without oscillation or voltage spike. | Use Scenario: 24–48 V battery-powered three-phase inverter driving 500 W BLDC motors in e-bikes and power tools. IC Role / Device Role / Timing Role: Low-side switching element in 6-step commutation; conducts freewheeling current during PWM off-time. Use Value: 34 ns trr prevents shoot-through during phase commutation; 7 A continuous rating supports 15 A peak motor currents with 2× design margin. |
| Two-Switch Forward PFC | Induction Cooktop Half-Bridge |
Use Scenario: 85–265 V AC input, two-switch forward PFC stage delivering 300–400 W with >95% efficiency. IC Role / Device Role / Timing Role: High-side switch in interleaved boost cell; switches at 65–133 kHz with variable duty cycle. Use Value: 600 V VCES withstands 450 V DC link transients; low CRES/CIES eliminates need for complex gate drive isolation. | Use Scenario: 20–50 kHz resonant half-bridge driving 20 µH induction coil in domestic cooktops. IC Role / Device Role / Timing Role: Upper-leg switch in ZVS half-bridge; conducts during resonant current zero-crossing. Use Value: 124 ns tf enables precise dead-time control; integrated diode eliminates discrete anti-parallel diode placement error and parasitic inductance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-frequency IGBT applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRG4PH60UD1 | Higher VCE(sat) (2.7 V), slower tf (150 ns), no co-pack diode | Requires external ultra-fast diode; less suitable for resonant topologies due to higher switching loss | Select when cost sensitivity outweighs diode integration and softness requirements |
| FGB3040L | Lower VCES (400 V), higher Qg (22 nC), 150 ns tf | Limited to 270 V DC bus; higher gate drive power needed for same switching speed | Prefer only in 24–48 V systems where 600 V rating is unnecessary |
Compared with IRG4PH60UD1 and FGB3040L, STGD6NC60HDT4 offers superior high-frequency performance through its integrated ultra-soft diode, lower VCE(sat), and optimized CRES/CIES - directly enabling simpler gate drive, reduced snubber size, and higher efficiency in 100–300 kHz PFC and resonant inverters.
Availability
STGD6NC60HDT4 is available at Aetrix Electronics and suitable for high-frequency SMPS, PFC circuits, and motor drivers requiring stable component supply across industrial, telecom, and consumer power electronics programs.
Supply support for STGD6NC60HDT4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.
The PowerMESH™ IGBT product line was engineered specifically for high-efficiency, high-frequency power conversion - targeting SMPS, PFC, UPS, and motor control applications where low conduction loss and fast, soft switching are essential.
FAQ
What is the maximum gate-emitter voltage rating for STGD6NC60HDT4?
The absolute maximum VGE is ±20 V, with recommended operating range of –5 V to +15 V. Exceeding +15 V risks gate oxide degradation over time; using –5 V during turn-off improves noise immunity and prevents spurious turn-on in high-dV/dt environments such as half-bridge configurations.
Can STGD6NC60HDT4 be used in a synchronous rectifier configuration?
No - it is an N-channel IGBT with integrated antiparallel diode, not a MOSFET. Its minority-carrier structure and tail current prevent true synchronous rectification. For synchronous rectification, discrete Si or GaN FETs with body diodes or dedicated SR controllers are required; this device serves only as a unidirectional high-side or low-side switch.
Is the antiparallel diode rated for continuous conduction in bridge configurations?
Yes - the diode has IF(RMS) = 10 A at TC = 25°C and trr = 34 ns at 125°C, making it suitable for freewheeling in half-bridge and full-bridge inverters. However, RMS current must be derated per thermal limits: at TC = 100°C, usable diode current drops to ~4.5 A due to junction temperature constraints.
Does STGD6NC60HDT4 require a negative gate voltage to ensure safe turn-off?
A negative gate voltage is not mandatory but strongly recommended in high-noise or high-dV/dt applications (e.g., half-bridge high-side). The device turns off fully at 0 V gate drive, but –5 V enhances noise margin and eliminates risk of Miller-induced turn-on - especially critical given its low CRES/CIES ratio and fast switching behavior.
STGD6NC60HDT4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- PowerMESH™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- IGBT Type:
- -
- Voltage - Collector Emitter Breakdown (Max):
- 600 V
- Current - Collector (Ic) (Max):
- 15 A
- Current - Collector Pulsed (Icm):
- 21 A
- Vce(on) (Max) @ Vge, Ic:
- 2.5V @ 15V, 3A
- Power - Max:
- 56 W
- Switching Energy:
- 20µJ (on), 68µJ (off)
- Input Type:
- Standard
- Gate Charge:
- 13.6 nC
- Td (on/off) @ 25°C:
- 12ns/76ns
- Test Condition:
- 390V, 3A, 10Ohm, 15V
- Reverse Recovery Time (trr):
- 21 ns
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DPAK
STGD6NC60HDT4 FAQ
1.How can I place an order for STGD6NC60HDT4 through Aetrix?
Please submit a Request for Quotation (RFQ) for STGD6NC60HDT4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STGD6NC60HDT4 reliable?
The price and inventory of STGD6NC60HDT4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGD6NC60HDT4 is usually 5 days.
3.What payment methods are accepted for STGD6NC60HDT4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGD6NC60HDT4 transactions.
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4.How is shipping managed for STGD6NC60HDT4?
STGD6NC60HDT4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STGD6NC60HDT4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STGD6NC60HDT4?
For technical support, including STGD6NC60HDT4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGD6NC60HDT4 requirements.
6.How does Aetrix verify that STGD6NC60HDT4 is sourced from the original manufacturer or authorized distributors?
All STGD6NC60HDT4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGD6NC60HDT4 meets industry standards.
7.What is the process for return or replacement of STGD6NC60HDT4?
All STGD6NC60HDT4 units undergo pre-shipment inspection (PSI). If there is an issue with STGD6NC60HDT4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STGD6NC60HDT4 part is unused and in its original packaging.
Return procedure for STGD6NC60HDT4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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