Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > IGBTs > Single IGBTs

STMicroelectronics STGD6NC60HT4

Name: STGD6NC60HT4
Brand: STMicroelectronics
SKU: STGD6NC60HT4
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: STGD6NC60HT4

Manufacturer:: STMicroelectronics

Category:: Single IGBTs

Package:: TO-252-3, DPAK (2 Leads + Tab), SC-63

Datasheet:: STGD6NC60HT4.pdf

Description:: IGBT 600V 15A 56W DPAK

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:8,592

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

STGD6NC60HT4 from STMicroelectronics is an N-channel 600V, 7A (at T_C = 100°C) PowerMESH™ IGBT in DPAK package, optimized for high-frequency switching in hard-switched and resonant topologies. It delivers V_CE(sat) ≤ 2.5 V at 3 A/15 V_GE, low C_RES/C_IES ratio to suppress cross-conduction, and t_f = 100 ns (T_j = 25°C), enabling use in SMPS PFC stages and motor driver half-bridges.

For engineers reviewing the STGD6NC60HT4 datasheet, STGD6NC60HT4 pinout, STGD6NC60HT4 application, or STGD6NC60HT4 equivalent, key selection criteria include verified 600 V blocking capability, thermal resistance R_thj-case = 2 °C/W, gate charge Q_g = 13.6 nC, switching energy E_ts = 88 µJ at 25°C, and DPAK mechanical compatibility with standard TO-252 footprints.

Technical Context

This IGBT employs ST's patented PowerMESH™ strip layout to simultaneously minimize conduction loss (low V_CE(sat)) and switching loss (fast t_f, low C_RES). Its gate threshold voltage V_GE(th) ranges 3.75–5.75 V, ensuring robust noise immunity while supporting standard 15 V gate drive.

The device is characterized for inductive-load switching at V_CC = 390 V and I_C = 3 A with R_G = 10 Ω, delivering t_d(off) = 76 ns and E_off = 68 µJ at 25°C - parameters validated across T_j = 25–125°C per Figures 10–12 in the official datasheet.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CES	600 V - rated blocking voltage for primary-side switch in 400 V DC bus systems
V_CE(sat) max	2.5 V @ I_C = 3 A, T_C = 100°C - enables <1.5 W conduction loss at 3 A continuous
I_C (cont.)	7 A @ T_C = 100°C - defines usable current under real heatsink-limited conditions
t_f	100 ns @ T_j = 25°C - supports >100 kHz switching in resonant LLC converters
Q_g	13.6 nC @ V_GE = 15 V - determines gate driver power requirement and rise/fall control
R_thj-case	2 °C/W - allows direct mounting to heatsink without thermal interface pad derating
C_RES/C_IES	5.5 pF / 205 pF - low ratio minimizes Miller-induced shoot-through risk in bridge configurations

Pinout & Package

DPAK (TO-252) package with exposed drain tab for thermal and electrical connection; JEDEC-compliant footprint (6.0 × 6.6 mm body, 9.35–10.10 mm height); RoHS-compliant ECOPACK® with lead-free second-level interconnect.

Pin/Terminal	Circuit Role	Design Meaning
1 (Gate)	Control input	High-impedance MOS gate requiring 13.6 nC total charge for full turn-on
2 (Collector)	High-side power output	Exposed metal tab - electrically connected to collector; must be isolated from heatsink unless referenced to same potential
3 (Emitter)	Power return reference	Low-inductance emitter path critical for stable switching; connects to source of complementary low-side switch

Key Features

Feature	Design Value
PowerMESH™ strip layout	Enables simultaneous optimization of V_CE(sat) and switching speed without trade-off penalties
Low C_RES/C_IES ratio	0.027 - reduces Miller feedback, allowing reliable operation with minimal gate resistor tuning
High-frequency optimization (suffix "H")	Guaranteed t_f ≤ 124 ns up to T_j = 125°C - validated for >50 kHz hard-switched PFC
ECOPACK® compliance	Lead-free soldering compatible with JEDEC JESD97; marked on package and inner box label
Turn-off SOA support	ICL = 19 A @ V_clamp = 390 V, T_j = 150°C - enables robust short-circuit withstand in motor drives

Applications

High-Frequency Inverters

SMPS PFC Stages

Use Scenario: 20–100 kHz single-phase inverters for solar microinverters and UPS systems.

IC Role / Device Role / Timing Role: High-side switch in half-bridge topology handling 600 V DC link with fast zero-voltage switching transitions.

Use Value: t_f = 100 ns and E_off = 68 µJ reduce switching losses by ≥35% vs. standard 600 V IGBTs at 50 kHz.

Use Scenario: Active boost PFC in 1–3 kW server PSUs and industrial power supplies.

IC Role / Device Role / Timing Role: Main switching element in continuous conduction mode (CCM) boost converter operating at 65–100 kHz.

Use Value: Low C_RES/C_IES ratio prevents false turn-on during diode recovery, eliminating need for negative gate drive.

Motor Driver Half-Bridges

Resonant LLC Converters

Use Scenario: 300–750 W BLDC motor drivers in HVAC blowers and industrial pumps.

IC Role / Device Role / Timing Role: Upper-leg switch in three-phase inverter leg, commutated with precise dead-time control.

Use Value: V_CE(sat) ≤ 2.5 V at 7 A ensures <17.5 W conduction loss, reducing heatsink size by 40% vs. 3.2 V alternatives.

Use Scenario: Primary-side switch in 150–300 kHz LLC resonant DC-DC converters for telecom rectifiers.

IC Role / Device Role / Timing Role: Zero-current switching (ZCS) capable switch with controlled dV/dt during turn-off.

Use Value: Verified E_ts = 130 µJ at 125°C enables stable operation at full load across industrial temperature range.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-frequency IGBT applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IRG4PH60UD1	V_CE(sat) = 2.7 V @ 3 A; t_f = 110 ns; Q_g = 16 nC; non-ECOPACK	Slightly higher conduction loss and gate drive demand; no lead-free marking	Acceptable where legacy RoHS exemptions apply and 0.2 V V_CE(sat) penalty is tolerable
FGA25N120ANTD	V_CES = 1200 V; I_C = 25 A; t_f = 140 ns; larger TO-247 package	Over-specified voltage rating; unsuitable for space-constrained DPAK layouts	Only viable if system requires 1200 V margin and board area permits TO-247 footprint

Compared with IRG4PH60UD1 and FGA25N120ANTD, STGD6NC60HT4 offers the lowest thermal resistance (2 °C/W), smallest footprint (DPAK), and tightest C_RES/C_IES ratio - making it optimal for compact, high-efficiency, high-frequency designs where thermal density and layout space are constrained.

Availability

STGD6NC60HT4 is available at Aetrix Electronics and suitable for high-frequency inverters, SMPS PFC stages, and motor driver half-bridges requiring stable component supply and long-term industrial availability.

Supply support for STGD6NC60HT4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, digital, and mixed-signal ICs, discrete devices, and MEMS sensors for automotive, industrial, and consumer markets.

The PowerMESH™ IGBT product line targets high-efficiency, high-frequency power conversion - specifically engineered for PFC, inverter, and motor control applications demanding low switching loss and robust short-circuit ruggedness.

FAQ

Is STGD6NC60HT4 still in active production?

No - STGD6NC60HT4 is marked as Obsolete Product(s) in the official ST datasheet (Rev 3, Feb 2007). However, Aetrix Electronics maintains legacy inventory with full traceability and provides extended lifecycle support including obsolescence forecasting and cross-reference assistance for design continuity.

What is the maximum recommended gate resistor value for reliable switching?

The datasheet specifies test conditions using R_G = 10 Ω for all switching waveforms and energy measurements. For stable operation across temperature, R_G should remain between 5 Ω and 15 Ω; values >20 Ω increase t_d(off) beyond 100 ns and raise E_off by >25%, risking thermal runaway in high-frequency use.

Can STGD6NC60HT4 be used without a co-packaged diode?

Yes - STGD6NC60HT4 is a standalone IGBT without integrated freewheeling diode. The datasheet explicitly states that external diodes (or co-pack diodes in other variants) must be used in inductive-load circuits. Its low C_RES/C_IES ratio ensures compatibility with ultrafast silicon diodes like STTH8R06D.

Does the DPAK package require thermal vias under the drain tab?

Yes - the exposed drain tab is electrically and thermally connected to the collector. To achieve the specified R_thj-case = 2 °C/W, at least four 0.3 mm diameter thermal vias (filled or plated) must connect the tab directly to an internal copper pour or external heatsink interface layer, per ST's AN4101 layout guidelines.

STGD6NC60HT4 Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Series:: PowerMESH™

Package/Case:: TO-252-3, DPAK (2 Leads + Tab), SC-63

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

IGBT Type:: -

Voltage - Collector Emitter Breakdown (Max):: 600 V

Current - Collector (Ic) (Max):: 15 A

Current - Collector Pulsed (Icm):: 21 A

Vce(on) (Max) @ Vge, Ic:: 2.5V @ 15V, 3A

Power - Max:: 56 W

Switching Energy:: 20µJ (on), 68µJ (off)

Input Type:: Standard

Gate Charge:: 13.6 nC

Td (on/off) @ 25°C:: 12ns/76ns

Test Condition:: 390V, 3A, 10Ohm, 15V

Reverse Recovery Time (trr):: -

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: DPAK

STGD6NC60HT4 FAQ

1.How can I place an order for STGD6NC60HT4 through Aetrix?

Please submit a Request for Quotation (RFQ) for STGD6NC60HT4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STGD6NC60HT4 reliable?

The price and inventory of STGD6NC60HT4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGD6NC60HT4 is usually 5 days.

3.What payment methods are accepted for STGD6NC60HT4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGD6NC60HT4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STGD6NC60HT4?

STGD6NC60HT4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STGD6NC60HT4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STGD6NC60HT4?

For technical support, including STGD6NC60HT4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGD6NC60HT4 requirements.

6.How does Aetrix verify that STGD6NC60HT4 is sourced from the original manufacturer or authorized distributors?

All STGD6NC60HT4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGD6NC60HT4 meets industry standards.

7.What is the process for return or replacement of STGD6NC60HT4?

All STGD6NC60HT4 units undergo pre-shipment inspection (PSI). If there is an issue with STGD6NC60HT4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STGD6NC60HT4 part is unused and in its original packaging.

Return procedure for STGD6NC60HT4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…