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STMicroelectronics STGF15H60DF

Part No.:
STGF15H60DF
Manufacturer:
STMicroelectronics
Category:
Single IGBTs
Package:
TO-220-3 Full Pack
Datasheet:
AetrixSTGF15H60DF.pdf
Description:
IGBT 600V 30A 30W TO220FP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:59

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Product details

Overview

STGF15H60DF from STMicroelectronics is a 600 V, 15 A trench gate field-stop IGBT with integrated ultrafast soft-recovery antiparallel diode in TO-220FP package. It delivers 1.6–2.0 V VCE(sat) at 15 A/25 °C, 103 ns typ. reverse recovery time (TJ = 25 °C), and 3–5 μs short-circuit withstand capability-optimized for high-frequency PFC and motor control inverters requiring robust paralleling and thermal stability.

For engineers reviewing the STGF15H60DF datasheet, STGF15H60DF pinout, STGF15H60DF application, or STGF15H60DF equivalent, key selection criteria include its positive VCE(sat) temperature coefficient (enabling safe parallel operation), low RthJC of 5 °C/W (IGBT) and 6.25 °C/W (diode), and tight parameter distribution across production lots.

Technical Context

This IGBT employs ST's proprietary trench gate field-stop structure to balance conduction and switching losses-achieving 136 μJ typ. Eon and 207 μJ typ. Eoff at 400 V/15 A/10 Ω gate resistance. Its slightly positive VCE(sat) temperature coefficient (1.7 V @ 125 °C, 1.8 V @ 175 °C) ensures current sharing stability in paralleled configurations.

The integrated diode features soft reverse recovery (Qrr = 128 nC, Irrm = 2.5 A at 25 °C), minimizing voltage overshoot and EMI in hard-switched topologies. Dynamic parameters-including 24.5 ns td(on), 118 ns td(off), and 69 ns tf-are characterized under standardized inductive load conditions (VCC = 400 V, RG = 10 Ω).

Key Specifications

Parameter Value and Actual Design Meaning
VCES 600 V - Maximum blocking voltage before avalanche; enables use in 400 V AC input PFC and 3-phase motor drives.
IC (TC = 100 °C) 15 A - Continuous collector current derated for thermal management in enclosed industrial enclosures.
VCE(sat) 1.6–2.0 V @ 15 A/25 °C - Low conduction loss directly reduces power stage heat generation and heatsink size.
tsc 3–5 μs - Short-circuit ruggedness allows reliable operation without immediate desaturation protection in fault events.
trr 103 ns (25 °C), 182 ns (175 °C) - Ultrafast soft recovery minimizes diode switching loss and voltage spikes during commutation.
RthJC (IGBT) 5 °C/W - Thermal resistance from junction to case enables predictable thermal design in TO-220FP mounting.
Qg 81 nC - Total gate charge determines driver strength requirement and influences switching speed vs. loss trade-off.

Pinout & Package

STGF15H60DF uses the TO-220FP (Full-Pak) package: insulated plastic housing with internal isolation between leads and metal tab, rated for 2500 VRMS insulation withstand voltage. The metal tab is electrically connected to the collector (C), enabling direct heatsink mounting without insulating hardware.

Pin/Terminal Circuit Role Design Meaning
1 (Left) Gate (G) Control terminal; requires ±20 V absolute max rating and 81 nC total charge for full turn-on.
2 (Middle) Emitter (E) Reference node for gate drive and current sensing; low-inductance layout critical for dV/dt immunity.
3 (Right, Tab) Collector (C) High-side power output node; electrically tied to insulated metal tab for direct heatsink attachment.

Key Features

Feature Design Value
Field-stop trench gate structure Optimizes trade-off between VCE(sat) and switching energy-enabling >20 kHz operation in PFC stages.
Positive VCE(sat) tempco Ensures inherent current balancing when multiple devices operate in parallel without external ballasting resistors.
Tight parameter distribution Minimizes unit-to-unit variation in VCE(sat), Qg, and tsc-reducing design margin requirements and improving system predictability.
Ultrafast soft-recovery diode 103 ns trr with low Irrm (2.5 A) and softness factor >1.5 suppresses voltage ringing and EMI in bridge-leg commutation.
Short-circuit rated Withstands 3–5 μs at VCC ≤ 360 V without destructive failure-enables robust overcurrent protection timing in motor drives.

Applications

Industrial Motor Drives Server & Telecom UPS

Use Scenario: Three-phase inverter stage in 3–5 kW servo drives operating at 8–16 kHz switching frequency.

IC Role / Device Role / Timing Role: Main switching device in each leg of the inverter bridge; handles bidirectional current flow via integrated diode during freewheeling.

Use Value: Low VCE(sat) and soft diode recovery reduce conduction and commutation losses, enabling >97% inverter efficiency at full load.

Use Scenario: Boost PFC front-end in 3 kVA online double-conversion UPS with active cooling.

IC Role / Device Role / Timing Role: High-side switch in continuous conduction mode (CCM) boost converter; conducts during duty cycle, recovers during off-time.

Use Value: Tight VCE(sat) distribution and positive tempco allow paralleling two devices per phase without current imbalance or thermal runaway.

Solar String Inverters EV Onboard Chargers

Use Scenario: DC-AC H-bridge in single-phase 3.3 kW photovoltaic string inverters with transformerless topology.

IC Role / Device Role / Timing Role: High-voltage switching element handling 600 V DC bus; integrated diode provides path for reactive current during grid synchronization.

Use Value: 2500 VRMS isolation rating eliminates need for additional creepage/clearance barriers in compact PCB layouts.

Use Scenario: Isolated DC-DC stage in 6.6 kW bidirectional OBC using dual-active-bridge (DAB) architecture.

IC Role / Device Role / Timing Role: Primary-side switch operating at 100–200 kHz; requires fast, low-loss switching and robust short-circuit tolerance.

Use Value: 5 μs short-circuit withstand time aligns with DAB controller fault response latency, enabling deterministic protection without overdesign.

Equivalent & Alternatives

The following parts are listed as comparable options for similar IGBT switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
STGP15H60DF Same die, TO-220 (non-isolated) package; RthJC = 1.3 °C/W (IGBT), no 2500 VRMS isolation. Requires insulating washer/mica pad for heatsink mounting; higher thermal performance but lower safety margin in grounded systems. Select when thermal priority outweighs isolation needs and mechanical layout permits insulator integration.
STGB15H60DF Same die, D²PAK (TO-263) package; RthJC = 1.3 °C/W (IGBT), surface-mount compatible. Enables automated assembly and higher power density; limited to PCB-mounted heatsinking or clip-based thermal solutions. Select for space-constrained designs where reflow compatibility and board-level thermal management are critical.

Compared with STGP15H60DF and STGB15H60DF, STGF15H60DF uniquely combines certified 2500 VRMS isolation, TO-220FP mechanical robustness, and industry-standard through-hole assembly-making it optimal for safety-critical industrial power supplies where creepage, serviceability, and thermal reliability intersect.

Availability

STGF15H60DF is available at Aetrix Electronics and suitable for industrial motor drives, telecom UPS systems, and solar string inverters requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized channels.

Supply support for STGF15H60DF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

STGF15H60DF belongs to ST's H-series IGBT portfolio-engineered specifically for high-efficiency, high-frequency power conversion in PFC, motor control, and UPS applications where conduction-switching loss trade-offs and paralleling safety are critical.

FAQ

What is the maximum gate-emitter voltage rating for STGF15H60DF?

The absolute maximum VGE is ±20 V, with recommended operating range of –10 V to +15 V. Exceeding ±20 V risks permanent gate oxide damage. Gate drive circuits must include clamping (e.g., Zener diodes) to prevent transient overvoltage during switching transitions or layout-induced ringing.

Does STGF15H60DF require a negative gate voltage for reliable turn-off?

No-STGF15H60DF is fully specified for 0 V turn-off (VGE = 0 V) and does not require negative bias. However, applying –5 V to –10 V improves noise immunity and dV/dt ruggedness in high-noise environments such as industrial motor drives with long cable runs or shared ground paths.

Can STGF15H60DF be paralleled with other IGBTs without external emitter resistors?

Yes-its slightly positive VCE(sat) temperature coefficient and tight parameter distribution enable stable current sharing in parallel configurations without emitter ballast resistors. Layout symmetry (matched gate and emitter loop inductances) remains essential to avoid dynamic imbalance.

What is the thermal resistance from junction to ambient (RthJA) for STGF15H60DF?

RthJA is 62.5 °C/W (typical) under standard JEDEC test conditions (single-layer FR-4, 1 in² copper pad). This value assumes minimal PCB copper area; actual RthJA improves significantly with extended copper pour, thermal vias, and heatsink attachment-making junction temperature prediction highly layout-dependent.

STGF15H60DF Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
TO-220-3 Full Pack
Packaging:
Tube
Product Status:
Active
IGBT Type:
Trench Field Stop
Voltage - Collector Emitter Breakdown (Max):
600 V
Current - Collector (Ic) (Max):
30 A
Current - Collector Pulsed (Icm):
60 A
Vce(on) (Max) @ Vge, Ic:
2V @ 15V, 15A
Power - Max:
30 W
Switching Energy:
136µJ (on), 207µJ (off)
Input Type:
Standard
Gate Charge:
81 nC
Td (on/off) @ 25°C:
24.5ns/118ns
Test Condition:
400V, 15A, 10Ohm, 15V
Reverse Recovery Time (trr):
103 ns
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220FP

STGF15H60DF FAQ

1.How can I place an order for STGF15H60DF through Aetrix?

Please submit a Request for Quotation (RFQ) for STGF15H60DF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STGF15H60DF reliable?

The price and inventory of STGF15H60DF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGF15H60DF is usually 5 days.

3.What payment methods are accepted for STGF15H60DF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGF15H60DF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STGF15H60DF?

STGF15H60DF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STGF15H60DF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STGF15H60DF?

For technical support, including STGF15H60DF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGF15H60DF requirements.

6.How does Aetrix verify that STGF15H60DF is sourced from the original manufacturer or authorized distributors?

All STGF15H60DF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGF15H60DF meets industry standards.

7.What is the process for return or replacement of STGF15H60DF?

All STGF15H60DF units undergo pre-shipment inspection (PSI). If there is an issue with STGF15H60DF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STGF15H60DF part is unused and in its original packaging.

Return procedure for STGF15H60DF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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