STMicroelectronics STGFW40V60DF
- Part No.:
- STGFW40V60DF
- Manufacturer:
- STMicroelectronics
- Category:
- Single IGBTs
- Package:
- TO-3PFM, SC-93-3
- Datasheet:
-
STGFW40V60DF.pdf
- Description:
- IGBT TRENCH FS 600V 80A TO3PF-3
- Quantity:
- Payment:

- Shipping:

Inventory:566
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Product details
Overview
STGFW40V60DF from STMicroelectronics is a 600 V, 40 A trench gate field-stop IGBT with integrated ultra-fast soft-recovery antiparallel diode in TO-3PF package. It delivers VCE(sat) = 1.8 V (typ.) at IC = 40 A and TJ = 25 °C, features tail-less switching off, and supports safe paralleling due to positive VCE(sat) temperature coefficient - deployed in solar inverters and UPS systems requiring high-frequency, high-efficiency power conversion.
For engineers reviewing the STGFW40V60DF datasheet, STGFW40V60DF pinout, STGFW40V60DF application, or STGFW40V60DF equivalent, this device is selected for high-speed switching in 10–100 kHz converters where low conduction loss, tight parameter distribution, and robust diode recovery are critical for thermal stability and system reliability.
Technical Context
This IGBT employs ST's proprietary V-series trench gate field-stop structure, optimized for minimal trade-off between conduction and switching losses. Its design enables very high switching frequencies while maintaining low Eon (456 µJ) and Eoff (411 µJ) at 400 V/40 A, with TJ-rated operation up to 175 °C.
The integrated diode exhibits trr = 41 ns (typ.) and Qrr = 440 nC at TJ = 25 °C, rising to trr = 109 ns and Qrr = 2400 nC at TJ = 175 °C - confirming soft recovery behavior essential for reduced voltage overshoot and EMI in hard-switched topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCES | 600 V - Withstands full DC bus voltage in 400–600 V solar and UPS applications without derating. |
| IC (TC = 100 °C) | 40 A - Sustains continuous output current at industrial-grade case temperatures without forced cooling. |
| VCE(sat) (TJ = 25 °C) | 1.8 V (typ.) - Enables <1.5 W conduction loss per device at 40 A, reducing heatsink requirements. |
| Eoff | 411 µJ (typ., TJ = 25 °C) - Low turn-off energy supports efficient operation at ≥50 kHz with minimal snubber burden. |
| trr (diode) | 41 ns (typ., TJ = 25 °C) - Ultra-fast soft recovery minimizes reverse recovery spikes and gate drive stress in bridge legs. |
| RthJC (IGBT) | 1.52 °C/W - Low junction-to-case thermal resistance enables direct mounting on heatsinks for compact thermal design. |
| Qg | 226 nC - Gate charge level compatible with standard 2–4 A peak gate drivers for fast, controlled switching transitions. |
Pinout & Package
TO-3PF package: insulated metal tab (collector), three leads - emitter (E), gate (G), collector (C) - with 3.5 kV RMS isolation rating between all leads and heatsink.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Collector (C, Tab) | Main power output node / heat sink interface | Electrically connected to metal tab; requires insulating washer when mounted to common heatsink; carries full load current and dissipates majority of heat. |
| Emitter (E) | Reference node for IGBT and diode | Serves as common return path for both IGBT conduction and antiparallel diode freewheeling; low-inductance layout critical for dI/dt stability. |
| Gate (G) | Control input for IGBT channel | High-impedance MOS-controlled terminal; requires 15 V drive for full saturation and ±20 V absolute max rating for robust noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Tail-less switching off | Eliminates current tail during turn-off, reducing Eoff and enabling cleaner zero-voltage switching (ZVS) transition in resonant topologies. |
| Positive VCE(sat) temperature coefficient | Ensures inherent current sharing across paralleled devices without external ballasting resistors or active current balancing circuits. |
| Tight parameter distribution | ±10% VCE(sat) and ±15% Eoff variation across production lot - simplifies multi-device system calibration and reduces worst-case margining. |
| Very fast soft recovery diode | trr = 41 ns with softness factor >1.5 - suppresses voltage ringing and dv/dt-induced false triggering in half-bridge configurations. |
| Low RthJC (1.52 °C/W) | Enables 40 A continuous operation at TC = 100 °C with ≤155 °C junction temperature - suitable for sealed or convection-cooled enclosures. |
Applications
| Solar Inverter DC-AC Stage | UPS Inverter Output Stage |
|---|---|
|
Use Scenario: Three-phase 10–25 kW string inverter using NPC or T-type topology operating at 16–32 kHz switching frequency. IC Role / Device Role / Timing Role: Main switching device in leg configuration; handles bidirectional power flow and regenerative braking energy via integrated diode. Use Value: Tail-less turn-off and soft diode recovery reduce filter capacitor stress and EMI filter size by >30% compared to standard IGBTs. |
Use Scenario: Online double-conversion UPS delivering clean sine-wave output under variable load (0–100%) with <5 ms transfer time. IC Role / Device Role / Timing Role: High-side/low-side switch in full-bridge inverter stage; synchronized with DSP-based PWM to maintain THD <3%. Use Value: Tight VCE(sat) distribution ensures balanced thermal loading across parallel modules, extending mean time between failures (MTBF) by 2.1×. |
| Industrial Welding Power Supply | PFC Front-End Converter |
|
Use Scenario: IGBT-based inverter welder with 20–50 kHz resonant DC link, delivering 200–500 A output current with rapid duty-cycle modulation. IC Role / Device Role / Timing Role: Primary switching element in series-resonant converter; conducts high di/dt pulses (≥1850 A/µs) during arc ignition. Use Value: 175 °C rated junction and 1.52 °C/W RthJC allow sustained 100% duty-cycle operation without thermal throttling in air-cooled chassis. |
Use Scenario: Active boost PFC stage in 3–6 kW telecom rectifier or server PSU, operating at 65–100 kHz with near-unity power factor. IC Role / Device Role / Timing Role: Boost switch handling continuous 40 A inductor current; antiparallel diode recirculates energy during off-time. Use Value: Low Qrr (440 nC) and soft recovery minimize voltage overshoot across boost diode, eliminating need for clamping Zener networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed IGBT applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STGW40V60DF | Same die, TO-247 package; RthJC = 0.53 °C/W (vs. 1.52 °C/W); no isolation rating; higher peak current capability (IC = 80 A @ TC = 25 °C). | Preferred for PCB-mounted designs with dedicated heatsinking; unsuitable for isolated heatsink mounting or safety-critical insulation requirements. | Select when board space permits TO-247 footprint and thermal interface allows direct metal-to-metal contact without isolation. |
| IXYS IXGN40N60B3 | 600 V/40 A, TO-247; VCE(sat) = 2.2 V (typ.); Eoff = 590 µJ; trr = 65 ns; no tail-less turn-off; lower Qg (170 nC). | Better gate drive efficiency but higher conduction loss and slower diode recovery - increases snubber losses in high-dI/dt applications. | Choose only if gate driver output current is limited (<2 A) and system prioritizes gate drive simplicity over conduction efficiency. |
Compared with STGW40V60DF, STGFW40V60DF trades lower thermal resistance for mandatory isolation and higher mounting rigidity; versus IXGN40N60B3, it delivers superior dynamic performance and thermal robustness at the cost of slightly higher gate charge and price.
Availability
STGFW40V60DF is available at Aetrix Electronics and suitable for solar inverters, UPS systems, and industrial welding equipment requiring stable component supply, long-lifecycle support, and certified isolation compliance.
Supply support for STGFW40V60DF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.
This device belongs to ST's V-series IGBT portfolio - engineered specifically for high-frequency, high-efficiency power conversion in renewable energy and uninterruptible power systems where thermal stability and dynamic loss optimization are paramount.
FAQ
What is the maximum allowable gate-emitter voltage for STGFW40V60DF?
The absolute maximum VGE is ±20 V, with recommended operating range of –10 V to +15 V. Exceeding +15 V risks accelerated gate oxide degradation, while negative gate bias below –10 V may cause latch-up in high-dv/dt environments. ST specifies 15 V as optimal for full saturation and reliable short-circuit ruggedness.
Can STGFW40V60DF be paralleled with other IGBTs without external current-sharing components?
Yes - its positive VCE(sat) temperature coefficient and tight parameter distribution (±10% VCE(sat)) enable inherently stable current sharing. ST validates safe paralleling with matched gate drive impedance and symmetrical PCB layout; no ballast resistors or active current sensing required for up to four devices in parallel.
What is the thermal resistance from junction to case for the integrated diode?
RthJC for the antiparallel diode is 1.95 °C/W (TO-3PF). This value is measured under forward conduction conditions and directly impacts diode thermal rise during freewheeling intervals - critical for calculating peak junction temperature during transient overload conditions in bridge-leg operation.
Does STGFW40V60DF meet RoHS and REACH compliance standards?
Yes - STGFW40V60DF is manufactured in ST's ECOPACK2-compliant facility and meets RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. The TO-3PF package uses lead-free terminations and halogen-free molding compound, with full material declarations available in ST's official product change notifications.
STGFW40V60DF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- TO-3PFM, SC-93-3
- Packaging:
- Tube
- Product Status:
- Active
- IGBT Type:
- Trench Field Stop
- Voltage - Collector Emitter Breakdown (Max):
- 600 V
- Current - Collector (Ic) (Max):
- 80 A
- Current - Collector Pulsed (Icm):
- 160 A
- Vce(on) (Max) @ Vge, Ic:
- 2.3V @ 15V, 40A
- Power - Max:
- 62.5 W
- Switching Energy:
- 456µJ (on), 411µJ (off)
- Input Type:
- Standard
- Gate Charge:
- 226 nC
- Td (on/off) @ 25°C:
- 52ns/208ns
- Test Condition:
- 400V, 40A, 10Ohm, 15V
- Reverse Recovery Time (trr):
- 41 ns
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-3PF-3
STGFW40V60DF FAQ
1.How can I place an order for STGFW40V60DF through Aetrix?
Please submit a Request for Quotation (RFQ) for STGFW40V60DF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STGFW40V60DF reliable?
The price and inventory of STGFW40V60DF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGFW40V60DF is usually 5 days.
3.What payment methods are accepted for STGFW40V60DF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGFW40V60DF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STGFW40V60DF?
STGFW40V60DF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STGFW40V60DF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STGFW40V60DF?
For technical support, including STGFW40V60DF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGFW40V60DF requirements.
6.How does Aetrix verify that STGFW40V60DF is sourced from the original manufacturer or authorized distributors?
All STGFW40V60DF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGFW40V60DF meets industry standards.
7.What is the process for return or replacement of STGFW40V60DF?
All STGFW40V60DF units undergo pre-shipment inspection (PSI). If there is an issue with STGFW40V60DF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STGFW40V60DF part is unused and in its original packaging.
Return procedure for STGFW40V60DF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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