Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > IGBTs > Single IGBTs

STMicroelectronics STGP10H60DF

Name: STGP10H60DF
Brand: STMicroelectronics
SKU: STGP10H60DF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: STGP10H60DF

Manufacturer:: STMicroelectronics

Category:: Single IGBTs

Package:: TO-220-3

Datasheet:: STGP10H60DF.pdf

Description:: IGBT TRENCH FS 600V 20A TO220

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,771

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

STGP10H60DF from STMicroelectronics is a 600 V, 10 A trench-gate field-stop IGBT with integrated ultrafast soft-recovery antiparallel diode in TO-220 package. It delivers 1.95 V typical V_CE(sat) at 10 A/15 V_GE, 107 ns typ. diode trr, and 5 μs short-circuit withstand time - optimized for high-frequency PFC and motor control inverters operating up to 100 kHz.

For engineers reviewing the STGP10H60DF datasheet, STGP10H60DF pinout, STGP10H60DF application, or STGP10H60DF equivalent, key selection criteria include its positive V_CE(sat) temperature coefficient for safe paralleling, low R_thJC (1.3 °C/W), and tight parameter distribution across production lots.

Technical Context

This IGBT employs ST's proprietary trench gate field-stop structure to balance conduction and switching losses - achieving 83 μJ typ. E_on and 140 μJ typ. E_off at 400 V, 10 A, 175 °C junction temperature. Its gate charge profile (Q_g = 57 nC, Q_gc = 27 nC) supports precise turn-on/turn-off timing control in hard-switched topologies.

The co-packaged diode features soft reverse recovery (Q_rr = 120 nC, I_rrm = 2.24 A) and low forward voltage (V_F = 1.7 V at 10 A, 25 °C), minimizing commutation losses and EMI in bridge-leg configurations used in UPS and servo drives.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CES	600 V - Withstands DC bus voltages up to 400 V nominal systems with 50% safety margin.
I_C (T_C = 100 °C)	10 A - Sustains continuous output current in thermally constrained motor drive heatsinks.
V_CE(sat) (T_J = 175 °C)	1.70 V - Limits conduction loss to ≤17 W at 10 A, enabling compact thermal design.
t_sc	3–5 μs - Enables robust overcurrent protection without desaturation circuit complexity.
R_thJC (IGBT)	1.3 °C/W - Allows direct mounting to heatsink with minimal thermal interface resistance penalty.
trr (diode)	107 ns - Reduces voltage overshoot and snubber stress during freewheeling transitions.
Q_g	57 nC - Matches standard 15 V gate drivers (e.g., IR2110, UCC27531) without external amplification.

Pinout & Package

STGP10H60DF uses TO-220 package (type A) with isolated tab. The metal tab is electrically connected to the collector (C), requiring insulated mounting hardware in grounded-emitter configurations.

Pin/Terminal	Circuit Role	Design Meaning
1 (Left)	Gate (G)	High-impedance MOS-controlled terminal; requires ≤±20 V drive and low-inductance layout to suppress oscillation.
2 (Center)	Collector (C)	High-side power node tied to heatsink tab; must be isolated from chassis ground unless system topology permits.
3 (Right)	Emiter (E)	Low-side reference for gate drive and current sensing; common return path for IGBT and diode.

Key Features

Feature	Design Value
Trench gate field-stop structure	Enables 600 V blocking with <1.95 V V_CE(sat), reducing conduction loss by 22% vs planar IGBTs at same rating.
Positive V_CE(sat) tempco	Ensures current sharing within ±5% mismatch when two devices are paralleled without active balancing.
Ultrafast soft-recovery diode	107 ns trr and 2.24 A I_rrm limit dv/dt-induced shoot-through risk in 3-phase inverter leg commutation.
Short-circuit rated	Withstands 3–5 μs fault duration at V_CC ≤ 360 V, simplifying protection logic in industrial motor drives.
Low R_thJC (1.3 °C/W)	Permits 115 W total dissipation at T_C = 25 °C - supports >10 A RMS operation in forced-air-cooled enclosures.

Applications

Industrial Motor Drives

Uninterruptible Power Supplies (UPS)

Use Scenario: Three-phase inverter stage in 0.75–2.2 kW servo and pump drives operating at 8–20 kHz switching frequency.

IC Role / Device Role / Timing Role: Main switching device in each half-bridge leg, handling bidirectional energy flow with integrated diode freewheeling.

Use Value: Tight V_CE(sat) distribution ensures balanced current sharing across parallel legs; soft diode reduces EMI filter size by 30%.

Use Scenario: DC-AC inverter in line-interactive UPS delivering clean 50/60 Hz sine wave under battery backup mode.

IC Role / Device Role / Timing Role: High-efficiency switching element in full-bridge topology, conducting up to 10 A RMS with low conduction loss.

Use Value: 1.3 °C/W R_thJC enables stable operation at 100 °C case temperature without derating; short-circuit rating simplifies fault response.

Active PFC Front-Ends

Induction Heating Systems

Use Scenario: Boost converter switch in 1–3 kW telecom/server rectifiers targeting >98% efficiency and EN61000-3-2 Class C compliance.

IC Role / Device Role / Timing Role: Fast-switching high-voltage switch synchronized to AC line zero-crossings, managing reactive power correction.

Use Value: 57 nC Q_g allows clean 100 kHz switching with standard gate drivers; low E_off minimizes boost diode reverse recovery loss.

Use Scenario: Half-bridge resonant inverter in 1–5 kW domestic and light-industrial induction cooktops operating at 20–50 kHz.

IC Role / Device Role / Timing Role: Primary power switch handling high di/dt (1170 A/μs) and repetitive hard-switching stress.

Use Value: 107 ns diode trr prevents destructive voltage spikes during ZVS transitions; 175 °C max T_J supports compact coil packaging.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed 600 V IGBT applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STGF10H60DF	TO-220FP package; R_thJC = 5 °C/W (vs 1.3 °C/W); same die, lower power dissipation (30 W).	Suitable for space-constrained PCB-mount designs where heatsink contact area is limited.	Select when board-level thermal management dominates over heatsink interface performance.
STGB10H60DF	D²PAK (TO-263) package; R_thJC = 1.3 °C/W; identical electrical specs but surface-mount compatible.	Preferred for automated assembly and high-density power modules requiring reflow compatibility.	Select when SMT production, reduced mechanical stress, or improved vibration tolerance are required.

Compared with STGF10H60DF and STGB10H60DF, STGP10H60DF offers optimal thermal interface performance in through-hole heatsink-mounted systems - delivering highest continuous current capability (10 A @ 100 °C) and lowest junction-to-case resistance among the H-series trio.

Availability

STGP10H60DF is available at Aetrix Electronics and suitable for industrial motor drives, uninterruptible power supplies (UPS), and active power factor correction (PFC) circuits requiring stable component supply and long-term production continuity.

Supply support for STGP10H60DF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.

STGP10H60DF belongs to ST's H-series IGBT portfolio - engineered specifically for high-efficiency, high-frequency switching converters where conduction and switching loss trade-offs must be tightly balanced.

FAQ

What gate drive voltage is recommended for STGP10H60DF?

ST specifies ±20 V absolute maximum gate-emitter voltage, with 15 V recommended for reliable turn-on and noise immunity. A 15 V drive achieves 1.95 V typical V_CE(sat) at 10 A and ensures sufficient Miller plateau margin to prevent spurious turn-on during high dv/dt events.

Can STGP10H60DF be paralleled safely without external current-sharing resistors?

Yes - its slightly positive V_CE(sat) temperature coefficient and tight parameter distribution (±5% V_CE(sat)) enable stable current sharing between matched devices. ST recommends matching devices from same wafer lot and using symmetrical PCB layout with Kelvin emitter connections.

How does the integrated diode differ from standard FRD counterparts?

The ultrafast soft-recovery antiparallel diode has 107 ns trr and 120 nC Q_rr at 10 A, with softness factor (t_a/t_b) > 1.2 - significantly reducing voltage overshoot and EMI compared to fast recovery diodes (typ. trr > 250 ns). This eliminates need for external snubbers in most 10–50 kHz applications.

What is the maximum allowable case temperature for continuous operation?

STGP10H60DF supports continuous operation up to 100 °C case temperature, delivering 10 A collector current per datasheet (Table 1). At this condition, junction temperature remains ≤175 °C with R_thJC = 1.3 °C/W and 1.70 V V_CE(sat), assuming no additional thermal interface resistance beyond specified test conditions.

STGP10H60DF Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Series:: -

Package/Case:: TO-220-3

Packaging:: Tube

Product Status:: Active

IGBT Type:: Trench Field Stop

Voltage - Collector Emitter Breakdown (Max):: 600 V

Current - Collector (Ic) (Max):: 20 A

Current - Collector Pulsed (Icm):: 40 A

Vce(on) (Max) @ Vge, Ic:: 1.95V @ 15V, 10A

Power - Max:: 115 W

Switching Energy:: 83µJ (on), 140µJ (off)

Input Type:: Standard

Gate Charge:: 57 nC

Td (on/off) @ 25°C:: 19.5ns/103ns

Test Condition:: 400V, 10A, 10Ohm, 15V

Reverse Recovery Time (trr):: 107 ns

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Through Hole

Supplier Device Package:: TO-220

STGP10H60DF FAQ

1.How can I place an order for STGP10H60DF through Aetrix?

Please submit a Request for Quotation (RFQ) for STGP10H60DF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STGP10H60DF reliable?

The price and inventory of STGP10H60DF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGP10H60DF is usually 5 days.

3.What payment methods are accepted for STGP10H60DF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGP10H60DF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STGP10H60DF?

STGP10H60DF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STGP10H60DF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STGP10H60DF?

For technical support, including STGP10H60DF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGP10H60DF requirements.

6.How does Aetrix verify that STGP10H60DF is sourced from the original manufacturer or authorized distributors?

All STGP10H60DF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGP10H60DF meets industry standards.

7.What is the process for return or replacement of STGP10H60DF?

All STGP10H60DF units undergo pre-shipment inspection (PSI). If there is an issue with STGP10H60DF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STGP10H60DF part is unused and in its original packaging.

Return procedure for STGP10H60DF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…