Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > IGBTs > Single IGBTs

STMicroelectronics STGP15H60DF

Name: STGP15H60DF
Brand: STMicroelectronics
SKU: STGP15H60DF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: STGP15H60DF

Manufacturer:: STMicroelectronics

Category:: Single IGBTs

Package:: TO-220-3

Datasheet:: STGP15H60DF.pdf

Description:: IGBT 600V 30A 115W TO220

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:977

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

STGP15H60DF from STMicroelectronics is a 600 V, 15 A trench gate field-stop IGBT with integrated ultrafast soft-recovery antiparallel diode in TO-220 package. It delivers 1.6–2.0 V V_CE(sat) at 15 A/25 °C, 3 μs short-circuit withstand time, and 103 ns diode reverse recovery time (T_J = 25 °C), enabling high-efficiency motor control inverters and PFC stages operating up to 20 kHz.

For engineers reviewing the STGP15H60DF datasheet, STGP15H60DF pinout, STGP15H60DF application, or STGP15H60DF equivalent, key selection criteria include V_CE(sat) temperature coefficient, R_thJC = 1.3 °C/W, diode Q_rr = 128 nC, safe paralleling capability, and TO-220 thermal performance under 100 °C case temperature constraints.

Technical Context

This IGBT employs ST's proprietary trench gate field-stop structure optimized for high switching frequency converters, balancing conduction and switching losses. Its slightly positive V_CE(sat) temperature coefficient and tight parameter distribution enable stable parallel operation without current imbalance.

Dynamic performance is characterized by 24.5 ns turn-on delay, 118 ns turn-off delay, and 136 μJ E_on + 207 μJ E_off at 400 V/15 A/10 Ω gate resistance. The co-packaged diode features soft recovery (I_rrm = 2.5 A, trr = 103 ns) to minimize voltage overshoot and EMI in hard-switched topologies.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CES	600 V - Maximum blocking voltage before avalanche; supports 400 V DC bus designs with 50 % safety margin.
I_C (T_C = 100 °C)	15 A - Continuous collector current derated for industrial ambient; defines usable output power in forced-air-cooled motor drives.
V_CE(sat)	1.6–2.0 V @ 15 A/25 °C - Low conduction loss enables <1.5 W static dissipation per device at rated current.
t_sc	3–5 μs - Short-circuit withstand time at V_CC ≤ 360 V; enables robust overcurrent protection without external desaturation sensing.
Q_rr	128 nC @ T_J = 25 °C - Low reverse recovery charge reduces turn-on losses of complementary switch and snubber stress.
R_thJC (IGBT)	1.3 °C/W - Junction-to-case thermal resistance; allows 115 W total dissipation at T_C = 25 °C, critical for heatsink sizing.
trr	103 ns @ I_F = 15 A, di_F/dt = 100 A/μs - Ultrafast soft recovery minimizes voltage spikes and EMI in bridge-leg commutation.

Pinout & Package

STGP15H60DF uses a standard TO-220 package with isolated tab (pin 2). The metal tab serves as the collector terminal and provides direct thermal path to heatsink. Pin 1 is gate (G), pin 2 is collector (C), and pin 3 is emitter (E).

Pin/Terminal	Circuit Role	Design Meaning
Pin 1 (G)	Gate	Control input requiring ±20 V max; 81 nC total gate charge dictates gate driver peak current ≥ 8 A for 10 ns rise time.
Pin 2 (C / Tab)	Collector	High-side switching node; electrically isolated tab enables mounting without insulating washer while maintaining creepage/clearance.
Pin 3 (E)	Emitter	Power return and gate reference; low-inductance layout essential to suppress V_GE ringing during fast switching.

Key Features

Feature	Design Value
Trench gate field-stop structure	Optimizes trade-off between V_CE(sat) and switching speed for 10–50 kHz PFC and inverter applications.
Slightly positive V_CE(sat) tempco	Enables stable current sharing in parallel configurations without active current balancing circuitry.
Ultrafast soft-recovery antiparallel diode	103 ns trr and 2.5 A I_rrm reduce commutation losses and EMI vs standard FRDs in 3-phase motor drives.
Short-circuit rated (3–5 μs)	Supports cycle-by-cycle overcurrent protection using simple gate monitoring-no external desat detection needed.
Low R_thJC = 1.3 °C/W	Permits higher continuous power density than TO-220FP variants (R_thJC = 5 °C/W), reducing heatsink mass and cost.

Applications

Industrial Motor Drives

Uninterruptible Power Supplies (UPS)

Use Scenario: 3-phase inverter stage in 1–3 kW servo drives with 16 kHz PWM and air-cooled heatsinks.

IC Role / Device Role / Timing Role: High-side/low-side switching element in IGBT half-bridge modules; handles 15 A RMS load current with <1.8 V V_CE(sat) at 175 °C junction.

Use Value: 1.3 °C/W R_thJC enables 25 °C lower junction temperature vs TO-220FP variant at same power, extending lifetime by >2× per Arrhenius model.

Use Scenario: Boost PFC front-end in online double-conversion UPS delivering 2 kVA with THD <5 %.

IC Role / Device Role / Timing Role: Fast-switching PFC switch operating at 30–50 kHz; leverages low Q_rr (128 nC) to minimize diode-induced turn-on loss in discontinuous conduction mode.

Use Value: Soft-recovery diode eliminates need for external RC snubbers, reducing BOM count and board area by 12 % in compact 1U rack-mount designs.

Appliance Inverter Systems

Renewable Energy Converters

Use Scenario: Variable-speed compressor drive in inverter air conditioners with ambient up to 60 °C.

IC Role / Device Role / Timing Role: Main inverter switch in 2-level topology; operates with 15 A peak current and 175 °C max junction temperature.

Use Value: Tight V_CE(sat) distribution (±0.1 V) ensures consistent thermal loading across production units, eliminating unit-to-unit calibration.

Use Scenario: DC-AC inverter stage in residential solar microinverters (250–350 W per unit) with natural convection cooling.

IC Role / Device Role / Timing Role: Bridge-leg switch handling bidirectional energy flow; relies on 3 μs short-circuit rating for fault containment during grid transients.

Use Value: 600 V V_CES supports 450 V PV string inputs with 20 % margin, avoiding derating penalties common with 500 V IGBTs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed IGBT applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STGF15H60DF	Same die, TO-220FP package with R_thJC = 5 °C/W and no isolated tab; lower power dissipation (30 W vs 115 W).	Used in space-constrained, low-power (<500 W) applications where heatsinking is via PCB copper, not external heatsink.	Select when footprint size is critical and thermal budget permits higher junction temperature at reduced current.
STGB15H60DF	Same die, D²PAK (TO-263) package with R_thJC = 1.3 °C/W but surface-mount mounting; requires reflow-compatible PCB layout.	Preferred for automated SMT production lines and high-density power boards where through-hole TO-220 is incompatible.	Select for volume manufacturing with pick-and-place assembly and where thermal vias can replicate TO-220 tab performance.

Compared with STGF15H60DF and STGB15H60DF, STGP15H60DF uniquely combines through-hole mechanical robustness, isolated-tab thermal efficiency, and legacy-compatible TO-220 footprint-making it optimal for field-serviceable industrial drives and retrofit designs requiring drop-in replacement.

Availability

STGP15H60DF is available at Aetrix Electronics and suitable for industrial motor drives, uninterruptible power supplies (UPS), and power factor correction (PFC) systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for STGP15H60DF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and power applications.

STGP15H60DF belongs to ST's H-series IGBT portfolio, engineered specifically for high-frequency switching converters where efficiency, thermal reliability, and paralleling safety are prioritized over ultra-low V_CE(sat).

FAQ

What is the maximum recommended gate resistor value for reliable switching?

The datasheet specifies RG = 10 Ω for characterization, yielding td(on) = 24.5 ns and td(off) = 118 ns. For 16 kHz motor drive use, RG ≤ 15 Ω maintains E_on/E_off balance and avoids excessive V_GE ringing; values >22 Ω increase switching losses by >35 % and risk shoot-through in bridge configurations.

Can STGP15H60DF be paralleled without external current-sharing components?

Yes-its slightly positive V_CE(sat) temperature coefficient and tight parameter distribution (±5 % on V_CE(sat)) enable passive current sharing. ST recommends matched gate resistors (±1 %), symmetrical layout, and shared heatsink to achieve <10 % current imbalance at 15 A per device up to 175 °C junction temperature.

Is the integrated diode suitable for freewheeling in hard-switched topologies?

Yes-the ultrafast soft-recovery diode (trr = 103 ns, Q_rr = 128 nC) is specifically qualified for freewheeling in hard-switched 3-phase inverters. Its soft recovery limits di/dt-induced voltage overshoot to <150 V above bus voltage, eliminating need for snubbers in 400 V systems.

What thermal interface material is recommended for the TO-220 tab?

ST specifies minimum thermal resistance of 0.25 °C·in²/W for the interface. A 0.1 mm thick, 1.5 W/m·K silicone-based thermal pad (e.g., Laird T-flex 200) or 0.05 mm cured thickness of non-silicone phase-change material (e.g., Henkel Gap Pad VOX) achieves R_th < 0.3 °C/W with 25 psi mounting pressure-ensuring full utilization of the 1.3 °C/W R_thJC.

STGP15H60DF Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Series:: -

Package/Case:: TO-220-3

Packaging:: Tube

Product Status:: Active

IGBT Type:: Trench Field Stop

Voltage - Collector Emitter Breakdown (Max):: 600 V

Current - Collector (Ic) (Max):: 30 A

Current - Collector Pulsed (Icm):: 60 A

Vce(on) (Max) @ Vge, Ic:: 2V @ 15V, 15A

Power - Max:: 115 W

Switching Energy:: 136µJ (on), 207µJ (off)

Input Type:: Standard

Gate Charge:: 81 nC

Td (on/off) @ 25°C:: 24.5ns/118ns

Test Condition:: 400V, 15A, 10Ohm, 15V

Reverse Recovery Time (trr):: 103 ns

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Through Hole

Supplier Device Package:: TO-220

STGP15H60DF FAQ

1.How can I place an order for STGP15H60DF through Aetrix?

Please submit a Request for Quotation (RFQ) for STGP15H60DF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STGP15H60DF reliable?

The price and inventory of STGP15H60DF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGP15H60DF is usually 5 days.

3.What payment methods are accepted for STGP15H60DF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGP15H60DF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STGP15H60DF?

STGP15H60DF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STGP15H60DF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STGP15H60DF?

For technical support, including STGP15H60DF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGP15H60DF requirements.

6.How does Aetrix verify that STGP15H60DF is sourced from the original manufacturer or authorized distributors?

All STGP15H60DF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGP15H60DF meets industry standards.

7.What is the process for return or replacement of STGP15H60DF?

All STGP15H60DF units undergo pre-shipment inspection (PSI). If there is an issue with STGP15H60DF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STGP15H60DF part is unused and in its original packaging.

Return procedure for STGP15H60DF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…