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STMicroelectronics STGW50H65DFB2-4

Part No.:
STGW50H65DFB2-4
Manufacturer:
STMicroelectronics
Category:
Single IGBTs
Package:
TO-247-4
Datasheet:
AetrixSTGW50H65DFB2-4.pdf
Description:
TRENCH GATE FIELD-STOP, 650 V, 5
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,645

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Product details

Overview

STGW50H65DFB2-4 from STMicroelectronics is a 650 V, 50 A high-speed IGBT with co-packaged soft-recovery diode in TO-247-4 package, featuring Kelvin emitter gate drive (pin 4), 1.55 V typical VCE(sat) at 50 A/25 °C, 175 °C max junction temperature, and optimized switching energy for hard-switched PFC and solar inverters.

For engineers reviewing the STGW50H65DFB2-4 datasheet, STGW50H65DFB2-4 pinout, STGW50H65DFB2-4 application, or STGW50H65DFB2-4 equivalent, key selection criteria include VCE(sat) temperature coefficient, diode reverse recovery charge (Qrr = 673 nC @ 25 °C), turn-off energy (Eoff = 478 µJ), thermal resistance (RthJC = 0.55 °C/W), and Kelvin-emitter layout for gate drive stability.

Technical Context

This IGBT uses ST's trench-gate field-stop HB2 architecture, delivering improved conduction efficiency at low currents and reduced switching losses via minimized tail current and fast soft-recovery antiparallel diode. Its positive VCE(sat) temperature coefficient enables inherent current sharing in parallel configurations.

The TO-247-4 package integrates a dedicated Kelvin emitter terminal (Pin 4) to eliminate gate drive loop inductance effects, enabling precise control of VGE during high-di/dt switching-critical for maintaining stable turn-on behavior and minimizing dynamic VCE overshoot in 10–100 kHz PFC and inverter stages.

Key Specifications

Parameter Value and Actual Design Meaning
VCES 650 V - Maximum blocking voltage under open-gate conditions; supports 400 V DC bus designs with 1.6× safety margin.
IC (TC = 100 °C) 53 A - Continuous collector current derated for industrial ambient; enables 5 kW+ PFC stages without forced air.
VCE(sat) (25 °C) 1.55 V typ. - Low conduction loss at rated current; reduces I²R heating and improves system efficiency above 98% in 3-phase inverters.
Eoff 478 µJ @ 400 V/50 A - Measured turn-off energy including diode tail; enables <100 kHz operation with <1.5 W switching loss per device.
Qrr 673 nC @ 25 °C - Low reverse recovery charge minimizes diode-induced voltage spikes and EMI in hard-switched topologies.
RthJC (IGBT) 0.55 °C/W - Low junction-to-case thermal resistance allows direct mounting to heatsink; supports 272 W total dissipation at TC = 25 °C.
trr 92 ns - Fast soft recovery time reduces diode switching stress and enables tighter dead-time control in bridge legs.
TJ(max) 175 °C - Extended junction rating permits operation in high-ambient environments (e.g., enclosed UPS cabinets) without derating.

Pinout & Package

TO-247-4 package with isolated tab (collector), 4-pin configuration: Pin 1 = Gate, Pin 2 = Emitter (power), Pin 3 = Collector (tab), Pin 4 = Kelvin Emitter (sensing).

Pin/Terminal Circuit Role Design Meaning
Pin 1 (G) Gate input Standard gate terminal; driven with ±20 V max; connects to gate driver IC output.
Pin 2 (E) Power emitter Main emitter current path; carries full load current; connects to power ground or low-side shunt.
Pin 3 (C) Collector (tab) High-current collector terminal; electrically connected to metal tab; mounted to heatsink for thermal conduction.
Pin 4 (K-E) Kelvin emitter sense Reference node for gate drive return; eliminates source inductance impact on VGE, ensuring accurate threshold control during fast switching.

Key Features

Feature Design Value
Low VCE(sat) temperature coefficient Positive slope ensures stable current sharing in paralleled IGBTs without external ballasting resistors.
Co-packaged soft-recovery diode Qrr = 673 nC and trr = 92 ns enable clean commutation in boost PFC with minimal snubber requirements.
Kelvin emitter configuration Separate sense emitter (Pin 4) decouples gate loop from power loop, reducing gate oscillation risk at >50 A/µs di/dt.
Tight parameter distribution VCE(sat) min/typ/max spread of 1.55/1.8/1.9 V across temperature ensures predictable thermal design and BOM consistency.
Optimized switching energy Eon + Eoff = 1.11 mJ @ 400 V/50 A enables high-frequency operation up to 80 kHz in solar string inverters.

Applications

Welding Inverters Industrial UPS Systems

Use Scenario: High-frequency DC-link switching in 20–50 kHz IGBT-based inverter stages for arc stability and dynamic response.

IC Role / Device Role / Timing Role: Main switching device in full-bridge output stage; handles 50–100 A pulsed loads with <100 ns switching transitions.

Use Value: Low tail current and soft diode recovery minimize voltage overshoot during short-circuit events, extending IGBT lifetime under repeated arc strikes.

Use Scenario: Bidirectional DC-AC conversion in online double-conversion UPS with 96–100 V battery strings and 400 V DC bus.

IC Role / Device Role / Timing Role: High-side switch in three-phase inverter leg; operates at 16 kHz with tight dead-time control enabled by fast trr.

Use Value: 175 °C TJ(max) and RthJC = 0.55 °C/W support continuous 10 kVA operation in sealed enclosures without active cooling.

Solar String Inverters Active PFC Modules

Use Scenario: DC-AC conversion in transformerless grid-tied inverters with ungrounded PV arrays and 600–1000 V DC input.

IC Role / Device Role / Timing Role: Low-side switch in H-bridge topology; switches at 16–32 kHz with sinusoidal PWM modulation.

Use Value: Tight VCE(sat) distribution ensures balanced current sharing across parallel devices, critical for >5 kW per string scalability.

Use Scenario: Boost-stage switching in 3–10 kW server PSU or telecom rectifier with universal AC input (90–264 VAC).

IC Role / Device Role / Timing Role: High-efficiency boost switch operating at 65–100 kHz; requires low Qg (151 nC) and minimal Eoff for high PF.

Use Value: 1.55 V VCE(sat) reduces conduction loss by 12% vs. prior-generation HB1 IGBTs, improving full-load efficiency to >99.2%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed IGBT applications.

Alternative Part Technical Difference Application Difference Selection Advice
IXYS IXGN50N60B4 600 V rating, higher VCE(sat) (1.8 V typ.), no Kelvin emitter, RthJC = 0.65 °C/W Limited to ≤40 kHz due to slower diode recovery (trr = 140 ns) and higher Eoff Preferred where cost sensitivity outweighs efficiency targets and Kelvin drive is not required.
Infineon IKW50N65ES5 650 V, 50 A, integrated diode with Qrr = 1.1 µC, no Kelvin emitter, RthJC = 0.62 °C/W Higher diode losses limit use in high-frequency PFC; better suited for motor drives than solar inverters Selected when robustness against overvoltage transients is prioritized over switching speed.

Compared with IXGN50N60B4 and IKW50N65ES5, STGW50H65DFB2-4 delivers superior high-frequency efficiency via its Kelvin emitter, lower Qrr, and tighter VCE(sat) distribution-making it optimal for space-constrained, thermally demanding PFC and inverter designs requiring >98.5% system efficiency.

Availability

STGW50H65DFB2-4 is available at Aetrix Electronics and suitable for welding inverters, solar string inverters, and industrial UPS systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for STGW50H65DFB2-4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power discrete devices, microcontrollers, and analog ICs for industrial, automotive, and energy applications.

This device belongs to ST's HB2-series high-speed IGBT portfolio, engineered specifically for high-efficiency, high-frequency switching in renewable energy and industrial power conversion systems.

FAQ

What is the purpose of the Kelvin emitter (Pin 4) in STGW50H65DFB2-4?

The Kelvin emitter (Pin 4) provides a dedicated low-inductance return path for the gate driver, isolating gate control from high di/dt emitter current flow. This prevents voltage drop across emitter stray inductance from distorting the actual VGE, ensuring consistent turn-on timing and eliminating parasitic oscillations during hard switching at >50 A/µs.

Can STGW50H65DFB2-4 replace older STGW50H65FB2 in existing designs?

Yes-STGW50H65DFB2-4 is a direct drop-in replacement for STGW50H65FB2, offering identical pinout, voltage/current ratings, and package. It improves upon the FB2 with lower VCE(sat) (1.55 V vs. 1.65 V), reduced Eoff (478 µJ vs. 520 µJ), and enhanced diode softness (Qrr reduced by 18%), enabling higher efficiency without board redesign.

What is the maximum recommended gate resistor value for reliable switching?

For stable operation at 50 A and 400 V, ST recommends RG(on) = 12 Ω and RG(off) = 6.8 Ω (per datasheet Figure 28). Exceeding 22 Ω for turn-off increases Eoff nonlinearly and risks shoot-through in bridge configurations; values below 4.7 Ω require careful PCB layout to avoid gate ringing.

How does the diode's reverse recovery performance change at elevated temperature?

At TJ = 175 °C, Qrr increases to 3500 nC and trr extends to 209 ns-more than 5× the 25 °C values. This necessitates conservative dead-time adjustment (≥1.2 µs) and snubber optimization in high-temperature environments to prevent cross-conduction and voltage overshoot.

STGW50H65DFB2-4 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
HB2
Package/Case:
TO-247-4
Packaging:
Tube
Product Status:
Active
IGBT Type:
Trench Field Stop
Voltage - Collector Emitter Breakdown (Max):
650 V
Current - Collector (Ic) (Max):
86 A
Current - Collector Pulsed (Icm):
150 A
Vce(on) (Max) @ Vge, Ic:
2V @ 15V, 50A
Power - Max:
272 W
Switching Energy:
629µJ (on), 478µJ (off)
Input Type:
Standard
Gate Charge:
151 nC
Td (on/off) @ 25°C:
18ns/128ns
Test Condition:
400V, 50A, 12Ohm, 15V
Reverse Recovery Time (trr):
92 ns
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-247-4

STGW50H65DFB2-4 FAQ

1.How can I place an order for STGW50H65DFB2-4 through Aetrix?

Please submit a Request for Quotation (RFQ) for STGW50H65DFB2-4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STGW50H65DFB2-4 reliable?

The price and inventory of STGW50H65DFB2-4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGW50H65DFB2-4 is usually 5 days.

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STGW50H65DFB2-4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STGW50H65DFB2-4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STGW50H65DFB2-4?

For technical support, including STGW50H65DFB2-4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGW50H65DFB2-4 requirements.

6.How does Aetrix verify that STGW50H65DFB2-4 is sourced from the original manufacturer or authorized distributors?

All STGW50H65DFB2-4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGW50H65DFB2-4 meets industry standards.

7.What is the process for return or replacement of STGW50H65DFB2-4?

All STGW50H65DFB2-4 units undergo pre-shipment inspection (PSI). If there is an issue with STGW50H65DFB2-4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STGW50H65DFB2-4 part is unused and in its original packaging.

Return procedure for STGW50H65DFB2-4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STGW50H65DFB2-4 Tags

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