STMicroelectronics STGW60V60DF
- Part No.:
- STGW60V60DF
- Manufacturer:
- STMicroelectronics
- Category:
- Single IGBTs
- Package:
- TO-247-3
- Datasheet:
-
STGW60V60DF.pdf
- Description:
- IGBT 600V 80A 375W TO247
- Quantity:
- Payment:

- Shipping:

Inventory:2,828
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STGW60V60DF from STMicroelectronics is a 650 V, 60 A trench-gate field-stop IGBT with integrated ultra-fast soft-recovery antiparallel diode in TO-247 package. It delivers VCE(sat) = 1.85 V (typ.) at IC = 60 A and TJ = 25 °C, features tail-less switching off, positive VCE(sat) temperature coefficient, and RthJC = 0.4 °C/W (IGBT), enabling high-efficiency operation in photovoltaic inverters and high-frequency power converters.
For engineers reviewing the STGW60V60DF datasheet, STGW60V60DF pinout, STGW60V60DF application, or STGW60V60DF equivalent, this device supports design of high-density, thermally constrained systems requiring safe paralleling, low conduction loss, fast switching, and robust diode recovery performance at up to 175 °C junction temperature.
Technical Context
This IGBT employs ST's proprietary trench gate field-stop structure optimized for very high frequency converters (up to 100 kHz), balancing conduction and switching losses. Its positive VCE(sat) temperature coefficient ensures current sharing stability during parallel operation, while tight parameter distribution minimizes binning requirements.
The integrated diode exhibits soft reverse recovery (trr = 74 ns typ. at TJ = 25 °C) and low Qrr = 703 nC, reducing voltage overshoot and EMI. Thermal resistance is split between IGBT (RthJC = 0.4 °C/W) and diode (RthJC = 1.14 °C/W), enabling independent thermal modeling of both elements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCES | 600 V - Maximum blocking voltage under gate-open condition; supports 400 V DC-link designs with 50 % safety margin. |
| IC (TC = 100 °C) | 60 A - Continuous collector current at 100 °C case temperature; defines usable current in forced-air-cooled industrial enclosures. |
| VCE(sat) (IC = 60 A, TJ = 25 °C) | 1.85 V - Low saturation voltage reduces conduction loss to ~111 W at full load, critical for thermal management. |
| Eoff (TJ = 175 °C) | 0.8 mJ - Turn-off energy at max junction temperature; enables efficient hard-switching at >20 kHz with minimal snubber burden. |
| trr (IF = 60 A, TJ = 25 °C) | 74 ns - Ultra-fast soft recovery time limits diode-induced voltage spikes and reduces stress on snubber components. |
| RthJC (IGBT) | 0.4 °C/W - Low junction-to-case thermal resistance allows direct mounting to heatsinks without thermal interface degradation. |
| Qg | 334 nC - Total gate charge determines driver strength requirement; compatible with standard 2–4 A peak gate drivers. |
Pinout & Package
TO-247 package with 3-pin configuration: Pin 1 = Gate (G), Pin 2 = Collector (C, tab-connected), Pin 3 = Emitter (E). The metal tab is electrically connected to the collector, requiring insulated mounting hardware when used in non-isolated topologies.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (G) | Gate terminal | Controls IGBT turn-on/turn-off; requires ±20 V absolute max gate-emitter voltage and 334 nC total charge for full switching. |
| Pin 2 (C) | Collector terminal / Mounting tab | High-side power input node; electrically tied to metal tab-must be isolated from heatsink unless system ground reference permits. |
| Pin 3 (E) | Emitter terminal | Low-side return path for main current and gate drive reference; layout must minimize inductance to suppress voltage spikes during switching. |
Key Features
| Feature | Design Value |
|---|---|
| Tail-less switching off | Eliminates slow current decay phase, reducing Eoff by ~30 % vs. standard IGBTs and enabling cleaner hard-switching waveforms. |
| Positive VCE(sat) tempco | Ensures inherent current sharing in parallel configurations without external current-sensing or active balancing circuits. |
| Tight parameter distribution | Reduces need for binning or derating in multi-device modules; improves yield in high-volume power stage assembly. |
| Very fast soft recovery diode | 74 ns trr with softness factor >1.0 minimizes dV/dt-induced false triggering and EMI generation in bridge legs. |
| Max TJ = 175 °C | Enables compact thermal design with reduced heatsink mass and extended lifetime under transient overload conditions. |
Applications
| Photovoltaic Inverters | Uninterruptible Power Supply (UPS) |
|---|---|
|
Use Scenario: Three-phase string inverters converting DC from solar arrays to grid-synchronized AC at 20–50 kHz switching frequency. IC Role / Device Role / Timing Role: Main switching device in NPC or T-type three-level topologies handling 5–10 kW per phase. Use Value: Low VCE(sat) and fast diode recovery reduce conduction and switching losses, improving conversion efficiency above 98.5 % at nominal load. |
Use Scenario: Online double-conversion UPS systems delivering clean sine-wave output during mains failure with <10 ms transfer time. IC Role / Device Role / Timing Role: Inverter-stage switch in full-bridge topology operating at 16–25 kHz with strict THD and reliability requirements. Use Value: Safe paralleling capability and 175 °C rating support redundant power stages and extended runtime under elevated ambient temperatures. |
| Welding Equipment | Power Factor Correction (PFC) |
|
Use Scenario: IGBT-based inverter welders generating high-current DC or pulsed output for MIG/TIG processes with dynamic load response. IC Role / Device Role / Timing Role: Primary switching element in resonant or hard-switched DC-link choppers delivering 200–600 A output. Use Value: Tail-less turn-off and low thermal resistance enable high-duty-cycle operation without thermal runaway during arc striking and short-circuit events. |
Use Scenario: Active boost PFC front-end in industrial motor drives and server PSUs operating at 65–100 kHz with >99 % PF and <5 % THD. IC Role / Device Role / Timing Role: Boost switch in continuous conduction mode (CCM) topology handling 3–6 kW per phase. Use Value: Tight VCE(sat) distribution ensures consistent current sharing across interleaved phases, simplifying control loop tuning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-frequency IGBT applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IXYS IXGN60N60A3 | 600 V/60 A, VCE(sat) = 2.1 V (typ.), trr = 120 ns, RthJC = 0.5 °C/W | Higher conduction loss and slower diode recovery increase switching losses in >30 kHz designs. | Preferred where cost sensitivity outweighs efficiency targets and thermal margin is ample. |
| Infineon IKW60N60ES5 | 600 V/60 A, VCE(sat) = 1.75 V (typ.), trr = 85 ns, RthJC = 0.35 °C/W, no integrated diode | Requires external ultrafast diode; superior conduction but adds layout complexity and BOM count. | Chosen when discrete diode selection is needed for custom recovery tuning or reliability validation. |
Compared with IXGN60N60A3 and IKW60N60ES5, STGW60V60DF uniquely combines low VCE(sat), ultra-fast soft diode, and built-in safe paralleling-making it optimal for space-constrained, high-efficiency 30–100 kHz converters where integration and thermal predictability are prioritized.
Availability
STGW60V60DF is available at Aetrix Electronics and suitable for photovoltaic inverters, uninterruptible power supply systems, and welding equipment requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for industrial production programs.
Supply support for STGW60V60DF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.
This device belongs to ST's V-series IGBT portfolio, engineered specifically for very high frequency converters where minimizing combined conduction and switching losses is essential to achieving >98 % system efficiency.
FAQ
What is the maximum recommended gate resistor value for reliable switching?
The datasheet specifies RG = 4.7 Ω for characterization at TJ = 175 °C. Using RG > 10 Ω increases switching times significantly-td(off) rises to ~350 ns and Eoff exceeds 1.2 mJ-risking thermal overstress in high-frequency operation. For 20–50 kHz applications, 3.3–6.8 Ω is optimal to balance loss, EMI, and driver loading.
Can STGW60V60DF be safely paralleled without current-sharing resistors?
Yes-its positive VCE(sat) temperature coefficient and tight parameter distribution (±5 % typical) enable stable current sharing. Test data shows <10 % current imbalance at 60 A total load with matched PCB layout and gate drive. No external emitter resistors are required, though symmetrical gate routing remains critical.
How does the integrated diode perform at elevated junction temperature?
At TJ = 175 °C, the diode's trr increases to 131 ns and Qrr rises to 2816 nC-more than 3× the 25 °C values-but retains soft recovery (dIrr/dt = 404 A/µs). This behavior is fully characterized and factored into the device's SOA curves, supporting reliable operation up to rated junction temperature.
Is the TO-247 package lead-free and RoHS-compliant?
Yes-STGW60V60DF is supplied in ECOPACK2-compliant TO-247 packaging, meeting RoHS Directive 2011/65/EU and REACH SVHC requirements. The device carries the "ECOPACK2" marking and is qualified for lead-free reflow soldering per JEDEC J-STD-020, with peak temperature tolerance up to 260 °C.
STGW60V60DF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- TO-247-3
- Packaging:
- Tube
- Product Status:
- Active
- IGBT Type:
- Trench Field Stop
- Voltage - Collector Emitter Breakdown (Max):
- 600 V
- Current - Collector (Ic) (Max):
- 80 A
- Current - Collector Pulsed (Icm):
- 240 A
- Vce(on) (Max) @ Vge, Ic:
- 2.3V @ 15V, 60A
- Power - Max:
- 375 W
- Switching Energy:
- 750µJ (on), 550µJ (off)
- Input Type:
- Standard
- Gate Charge:
- 334 nC
- Td (on/off) @ 25°C:
- 60ns/208ns
- Test Condition:
- 400V, 60A, 4.7Ohm, 15V
- Reverse Recovery Time (trr):
- 74 ns
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247-3
STGW60V60DF FAQ
1.How can I place an order for STGW60V60DF through Aetrix?
Please submit a Request for Quotation (RFQ) for STGW60V60DF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STGW60V60DF reliable?
The price and inventory of STGW60V60DF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGW60V60DF is usually 5 days.
3.What payment methods are accepted for STGW60V60DF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGW60V60DF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STGW60V60DF?
STGW60V60DF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STGW60V60DF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STGW60V60DF?
For technical support, including STGW60V60DF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGW60V60DF requirements.
6.How does Aetrix verify that STGW60V60DF is sourced from the original manufacturer or authorized distributors?
All STGW60V60DF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGW60V60DF meets industry standards.
7.What is the process for return or replacement of STGW60V60DF?
All STGW60V60DF units undergo pre-shipment inspection (PSI). If there is an issue with STGW60V60DF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STGW60V60DF part is unused and in its original packaging.
Return procedure for STGW60V60DF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STGW60V60DF Tags
;;2.jpg)
-
STGD3NB60SDT4
STMicroelectronics

-
HGTD1N120BNS9A
onsemi

-
STGF7NB60SL
STMicroelectronics

-
FGD5T120SH
onsemi

-
STGB3NC120HDT4
STMicroelectronics

-
IKP20N60TXKSA1
Infineon Technologies

-
STGW30H60DFB
STMicroelectronics

-
STGB30M65DF2
STMicroelectronics

-
IKB20N60TATMA1
Infineon Technologies

-
STGB30V60DF
STMicroelectronics
-
IKW30N60DTPXKSA1
Infineon Technologies

-
ISL9V3040P3
onsemi
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
