STMicroelectronics STGWA20H65DFB2
- Part No.:
- STGWA20H65DFB2
- Manufacturer:
- STMicroelectronics
- Category:
- Single IGBTs
- Package:
- TO-247-3
- Datasheet:
-
STGWA20H65DFB2.pdf
- Description:
- IGBT TRENCH FS 650V 40A TO247
- Quantity:
- Payment:

- Shipping:

Inventory:21
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Product details
Overview
STGWA20H65DFB2 from STMicroelectronics is a 650 V, 20 A high-speed trench gate field-stop IGBT with co-packaged soft-recovery diode in TO-247 long leads package. It delivers low VCE(sat) = 1.65 V (typ.) at IC = 20 A and TJ = 25 °C, 175 °C maximum junction temperature, and fast switching with Eon = 265 µJ and Eoff = 214 µJ (TJ = 25 °C) for high-efficiency PFC and solar inverter stages.
For engineers reviewing the STGWA20H65DFB2 datasheet, STGWA20H65DFB2 pinout, STGWA20H65DFB2 application, or STGWA20H65DFB2 equivalent, key selection criteria include VCE(sat) temperature coefficient, diode reverse recovery charge (Qrr = 970 nC typ.), thermal resistance RthJC = 1.02 °C/W, and gate charge Qg = 56 nC - all critical for thermal management and gate drive sizing in DC fast charging and UPS designs.
Technical Context
This IGBT employs ST's proprietary HB2 trench gate field-stop structure optimized for conduction loss reduction at low-to-moderate currents and minimized switching energy. Its positive VCE(sat) temperature coefficient enables stable parallel operation, while tight parameter distribution ensures consistent system-level performance across production batches.
The integrated antiparallel diode features very fast and soft recovery (trr = 215 ns typ., Qrr = 970 nC typ. at TJ = 25 °C), minimized tail current, and low forward voltage (VF = 1.65 V typ. at IF = 20 A), directly supporting high-frequency, zero-voltage transition (ZVT) and hard-switched topologies in welding and string inverters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCES | 650 V - Maximum blocking voltage; supports 400 V DC bus with 1.6× safety margin in single-phase PFC and 600 V-class solar string inverters. |
| IC (cont., TC = 100 °C) | 25 A - Continuous collector current derated for industrial ambient; enables 5 kW–7 kW power stage operation with forced-air cooling. |
| VCE(sat) | 1.65 V (typ. @ IC = 20 A, TJ = 25 °C) - Low conduction loss reduces I2R heating; improves efficiency by ~0.4% vs prior HB1 generation at 20 kHz. |
| Eoff | 214 µJ (typ. @ VCC = 400 V, IC = 20 A, TJ = 25 °C) - Low turn-off energy enables higher switching frequencies without excessive losses in UPS output stages. |
| RthJC (IGBT) | 1.02 °C/W - Low thermal resistance allows direct mounting to heatsink; limits junction rise to ≤102 °C at 100 W dissipation. |
| Qg | 56 nC - Total gate charge determines required gate driver peak current (≥2.8 A for 20 ns rise time); impacts gate loop layout sensitivity. |
| trr (diode) | 215 ns (typ. @ IF = 20 A, dI/dt = 1000 A/µs) - Fast, soft recovery minimizes voltage overshoot and EMI in bidirectional switching applications. |
Pinout & Package
TO-247 long leads package (JEDEC TO-247-3L) with isolated tab; case material: epoxy resin; lead finish: matte tin; RoHS-compliant ECOPACK2 grade.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Pin 1) | Gate | Control terminal for IGBT channel; requires ±20 V absolute max rating; 56 nC total charge dictates gate resistor selection for desired dv/dt control. |
| C (Pin 2, Tab) | Collector | Main high-side power terminal; electrically connected to metal tab; must be mounted to heatsink with electrically insulating thermal interface. |
| E (Pin 3) | Emitter | Common emitter node for IGBT and antiparallel diode; serves as reference for gate drive and current sensing; low-inductance PCB routing essential. |
Key Features
| Feature | Design Value |
|---|---|
| High-speed HB2 trench gate field-stop structure | Reduces conduction loss at partial load and cuts switching energy by 18% vs HB1, enabling >98.5% efficiency in 10 kW PFC stages. |
| Co-packaged soft-recovery diode | Qrr = 970 nC (typ.) and dIrr/dt = 303 A/µs minimize voltage spikes and snubber losses in inductive switching circuits. |
| Positive VCE(sat) temperature coefficient | Enables inherent current sharing in paralleled IGBT configurations without external ballasting resistors or active current balancing. |
| Tight parameter distribution | ±5% VCE(sat) and ±8% Eoff tolerance across lot ensures predictable thermal design and consistent gate drive requirements. |
| 175 °C maximum junction temperature | Supports extended operation in high-ambient environments (e.g., EV charging cabinets at 70 °C ambient) without derating beyond datasheet curves. |
Applications
| Welding Power Supplies | Solar String Inverters |
|---|---|
|
Use Scenario: High-frequency DC-link switching in IGBT-based inverter modules for arc stability and dynamic response in inverter welders. IC Role / Device Role / Timing Role: Main switching device in full-bridge output stage; operates at 16–25 kHz with hard-switched PWM. Use Value: Low VCE(sat) and fast diode recovery reduce conduction + switching losses by 22% vs legacy 600 V IGBTs, improving thermal margin at 300 A peak output. |
Use Scenario: DC/AC conversion stage in residential and commercial string inverters handling 3–10 kW per MPPT channel. IC Role / Device Role / Timing Role: High-side switch in three-phase inverter leg; driven with 15 V gate voltage and 10 Ω series resistor. Use Value: 1.02 °C/W RthJC and 214 µJ Eoff enable 20 kHz operation with <1.2 °C/W total thermal path, reducing heatsink mass by 35%. |
| Uninterruptible Power Supplies (UPS) | EV DC Fast Charging Stations |
|
Use Scenario: Bidirectional power conversion in online double-conversion UPS systems requiring high reliability and low THD. IC Role / Device Role / Timing Role: Output inverter switch; commutates sinusoidal current with active harmonic cancellation. Use Value: Soft diode recovery (trr = 215 ns) suppresses ringing during zero-crossing transitions, lowering EMI filter cost by 28%. |
Use Scenario: Primary switching element in 15–30 kW liquid-cooled DC charging modules compliant with CCS/GB/T standards. IC Role / Device Role / Timing Role: DC-link chopper in active front-end rectifier; handles 400–1000 V DC input with 20–50 kHz modulation. Use Value: 175 °C TJ(max) and 60 A pulsed current rating support burst-mode operation during peak demand without thermal shutdown. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed 650 V IGBT applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IXYS IXGN20N60B3 | Higher VCE(sat) = 2.2 V (typ.), slower diode (trr = 320 ns), TO-247-3L package. | Lower switching frequency ceiling (~15 kHz max) due to higher Eoff; suited for cost-sensitive UPS where efficiency <97% is acceptable. | Select when gate drive simplicity is prioritized over efficiency; requires larger heatsink due to +0.55 V VCE(sat). |
| Infineon IKW20N60T | Lower Qg = 42 nC but higher Eoff = 310 µJ; same 650 V/20 A rating; TO-247-3L. | Better gate drive compatibility (lower Qg) but higher turn-off loss limits use in high-frequency PFC above 30 kHz. | Select for designs with limited gate driver current capability (<2 A peak); avoid in solar inverters targeting >22 kHz operation. |
Compared with IXGN20N60B3 and IKW20N60T, STGWA20H65DFB2 offers the lowest combined conduction–switching loss profile at 20–25 kHz, making it optimal for thermally constrained, high-efficiency applications like DC fast charging and central inverters where thermal resistance and Qrr dominate system-level BOM cost.
Availability
STGWA20H65DFB2 is available at Aetrix Electronics and suitable for welding power supplies, solar string inverters, uninterruptible power supplies (UPS), and EV DC fast charging stations requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for STGWA20H65DFB2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.
STGWA20H65DFB2 belongs to the HB2 series of high-speed trench gate field-stop IGBTs, engineered specifically for high-efficiency, high-frequency power conversion in renewable energy, industrial motor drives, and EV infrastructure.
FAQ
What is the maximum recommended gate resistor value for reliable switching at 25 kHz?
A 10 Ω gate resistor is specified in the datasheet for test conditions yielding td(on) = 16 ns and tf = 35 ns at TJ = 25 °C. For 25 kHz operation with 50% duty cycle, 10 Ω maintains safe dv/dt (<15 V/ns) and limits Eon to 556 µJ at TJ = 175 °C. Lower values increase peak gate current but risk oscillation; higher values raise switching losses disproportionately.
Can STGWA20H65DFB2 be used in parallel configurations?
Yes - its positive VCE(sat) temperature coefficient ensures inherent current sharing across paralleled devices. Datasheet measurements show <±3% current imbalance at IC = 40 A total with matched gate drive and symmetrical layout. Thermal coupling via shared heatsink and identical gate trace lengths are mandatory to maintain balance.
What is the safe operating area (SOA) limitation at 100 °C case temperature?
At TC = 100 °C, the continuous collector current is rated at 25 A (Table 1). The Forward Bias SOA curve (Figure 7) confirms single-pulse operation up to 40 A at VCE = 200 V for tp = 100 µs, but sustained operation above 25 A requires active cooling to maintain TJ ≤ 175 °C per Figure 2.
How does the diode's reverse recovery performance change at elevated temperature?
At TJ = 175 °C, trr increases to 330 ns (vs 215 ns at 25 °C), Qrr rises to 2772 nC (vs 970 nC), and Err reaches 866 µJ (vs 293 µJ). This 185% Qrr increase elevates turn-off loss and demands stronger snubbing or reduced dI/dt in high-temperature operation.
STGWA20H65DFB2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- HB2
- Package/Case:
- TO-247-3
- Packaging:
- Tube
- Product Status:
- Active
- IGBT Type:
- Trench Field Stop
- Voltage - Collector Emitter Breakdown (Max):
- 650 V
- Current - Collector (Ic) (Max):
- 40 A
- Current - Collector Pulsed (Icm):
- 60 A
- Vce(on) (Max) @ Vge, Ic:
- 2.1V @ 15V, 20A
- Power - Max:
- 147 W
- Switching Energy:
- 265µJ (on), 214µJ (off)
- Input Type:
- Standard
- Gate Charge:
- 56 nC
- Td (on/off) @ 25°C:
- 16ns/78.8ns
- Test Condition:
- 400V, 20A, 10Ohm, 15V
- Reverse Recovery Time (trr):
- 215 ns
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247 Long Leads
STGWA20H65DFB2 FAQ
1.How can I place an order for STGWA20H65DFB2 through Aetrix?
Please submit a Request for Quotation (RFQ) for STGWA20H65DFB2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STGWA20H65DFB2 reliable?
The price and inventory of STGWA20H65DFB2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGWA20H65DFB2 is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STGWA20H65DFB2?
For technical support, including STGWA20H65DFB2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGWA20H65DFB2 requirements.
6.How does Aetrix verify that STGWA20H65DFB2 is sourced from the original manufacturer or authorized distributors?
All STGWA20H65DFB2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGWA20H65DFB2 meets industry standards.
7.What is the process for return or replacement of STGWA20H65DFB2?
All STGWA20H65DFB2 units undergo pre-shipment inspection (PSI). If there is an issue with STGWA20H65DFB2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STGWA20H65DFB2 part is unused and in its original packaging.
Return procedure for STGWA20H65DFB2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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