STMicroelectronics STGWA30H60DFB
- Part No.:
- STGWA30H60DFB
- Manufacturer:
- STMicroelectronics
- Category:
- Single IGBTs
- Package:
- TO-247-3
- Datasheet:
-
STGWA30H60DFB.pdf
- Description:
- IGBT
- Quantity:
- Payment:

- Shipping:

Inventory:6,339
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STGWA30H60DFB from STMicroelectronics is a 600 V, 30 A trench-gate field-stop IGBT with integrated ultra-fast soft-recovery antiparallel diode in TO-247 long leads package. It delivers VCE(sat) = 1.55 V (typ.) at IC = 30 A and TJ = 25 °C, tr = 14.6 ns, tf = 23 ns, and reverse recovery time trr = 53 ns - optimized for photovoltaic inverters and high-frequency converters requiring low conduction loss and minimized tail current.
For engineers reviewing the STGWA30H60DFB datasheet, STGWA30H60DFB pinout, STGWA30H60DFB application, or STGWA30H60DFB equivalent, key selection criteria include its positive VCE(sat) temperature coefficient for safe paralleling, RthJC = 0.58 °C/W (IGBT), and tight parameter distribution enabling stable operation at TJ up to 175 °C in high-power switching topologies.
Technical Context
This IGBT employs ST's proprietary trench gate field-stop structure to balance conduction and switching losses, targeting efficiency-critical frequency converters. Its HB series design emphasizes minimized tail current and very fast soft recovery of the co-packaged diode - critical for reducing Eoff and reverse recovery energy (Err = 104 µJ at TJ = 25 °C).
The device features a slightly positive VCE(sat) temperature coefficient and tight parameter spread across production lots, enabling robust parallel operation without external current-sharing resistors. Thermal resistance is optimized via direct copper bonding and low-RthJC packaging, supporting continuous IC = 30 A at TC = 100 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCES | 600 V - maximum blocking voltage under open-gate condition, suitable for 400–500 V DC-link systems with margin. |
| IC (TC = 100 °C) | 30 A - rated continuous collector current at case temperature 100 °C, defining thermal derating envelope. |
| VCE(sat) (IC = 30 A, TJ = 25 °C) | 1.55 V (typ.) - low saturation voltage directly reduces conduction loss and junction heating in hard-switched applications. |
| tf (inductive load) | 23 ns - fast current fall time enables high-frequency PWM operation up to 30 kHz with low Eoff (293 µJ). |
| trr (IF = 30 A, dI/dt = 1000 A/µs) | 53 ns - ultra-fast soft recovery minimizes voltage overshoot and diode switching loss during commutation. |
| RthJC (IGBT) | 0.58 °C/W - low thermal resistance enables efficient heat transfer to heatsink, supporting high power density designs. |
| Qg | 149 nC - total gate charge determines driver strength requirement and influences switching speed vs. EMI trade-off. |
Pinout & Package
STGWA30H60DFB uses the TO-247 long leads package (mechanical outline per Figure 32, DS10467 Rev 4), featuring three terminals: Collector (Tab), Gate, and Emitter - with the metal tab electrically connected to the collector. This configuration supports direct mounting to heatsinks with electrical isolation required.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Tab (Collector) | Main high-current output path and thermal interface | Electrically tied to collector; requires insulated mounting hardware to avoid shorting to heatsink ground. |
| Lead 1 (Gate) | Control input for IGBT turn-on/turn-off | Low-impedance gate terminal; sensitive to ESD and ringing - requires localized RC snubber and proper PCB layout. |
| Lead 2 (Emitter) | Reference node for gate drive and current sensing | Serves as common return path for both IGBT and diode; must be routed with minimal inductance for stable switching. |
Key Features
| Feature | Design Value |
|---|---|
| Maximum junction temperature | TJ = 175 °C - enables operation in high-ambient environments and extends lifetime under thermal cycling stress. |
| Positive VCE(sat) tempco | Enables inherent current balancing in parallel configurations without external ballasting resistors. |
| Tight parameter distribution | Ensures consistent dynamic behavior across units - critical for multi-phase inverter leg matching. |
| Minimized tail current | Reduces turn-off energy (Eoff) and improves efficiency in hard-switched topologies above 10 kHz. |
| Very fast soft recovery diode | trr = 53 ns with softness factor >1.5 - suppresses voltage spikes and EMI during freewheeling commutation. |
Applications
| Photovoltaic Inverters | High-Frequency UPS |
|---|---|
|
Use Scenario: DC-to-AC conversion in string inverters with 600–1000 V DC input and 50/60 Hz grid-synchronized output. IC Role / Device Role / Timing Role: Main switching device in 3-phase IGBT bridge, operating at 16–20 kHz PWM with sinusoidal modulation. Use Value: Low VCE(sat) and fast tf reduce conduction + switching losses, improving peak efficiency to >98.5% at 50% load. |
Use Scenario: Online double-conversion UPS delivering clean sine-wave AC output during mains failure. IC Role / Device Role / Timing Role: Inverter-stage switch handling bidirectional power flow and battery charging cycles. Use Value: Tight parameter spread ensures balanced phase currents across parallel modules, maintaining THD <3% under nonlinear loads. |
| Industrial Motor Drives | Induction Heating Systems |
|
Use Scenario: Variable-frequency drives controlling 3–30 kW AC induction motors in HVAC and pump applications. IC Role / Device Role / Timing Role: Half-bridge switch in 2-level inverter topology, modulated at 4–12 kHz with SVPWM. Use Value: Positive VCE(sat) tempco and low RthJC allow reliable parallel operation at full load without thermal runaway. |
Use Scenario: Resonant half-bridge inverter generating 20–100 kHz RF power for metal heating in manufacturing. IC Role / Device Role / Timing Role: High-speed switching element in zero-voltage switching (ZVS) topology with soft-commutated turn-on. Use Value: Ultra-fast soft diode (trr = 53 ns) enables reliable ZVS over full load range, minimizing dead-time losses and device stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed IGBT applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STGW30H60DFB | Same die, TO-247 standard leadform (shorter leads); RthJC identical but mechanical mounting differs. | Better suited for compact PCB layouts where lead length affects routing inverter leg symmetry. | Select when board space is constrained and heatsink interface allows standard TO-247 mounting. |
| STGWT30H60DFB | Same die, TO-3P package; higher RthJC (0.65 °C/W) and larger footprint; no isolated tab option. | Preferred in legacy industrial systems requiring TO-3P compatibility and higher creepage/clearance. | Choose only if mechanical redesign is impractical and thermal margin ≥15 °C remains at full load. |
Compared with STGWA30H60DFB, STGW30H60DFB offers identical electrical performance with shorter leads for tighter gate loop control, while STGWT30H60DFB trades thermal efficiency for legacy package compliance - making the "A" variant optimal for new high-density, high-efficiency converter designs.
Availability
STGWA30H60DFB is available at Aetrix Electronics and suitable for photovoltaic inverters, high-frequency UPS systems, and industrial motor drives requiring stable component supply, long-term lifecycle support, and traceable sourcing for production ramp-up.
Supply support for STGWA30H60DFB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.
STGWA30H60DFB belongs to ST's HB-series high-speed IGBT portfolio, engineered specifically for frequency converters demanding optimal trade-offs between conduction loss, switching speed, and ruggedness in renewable energy and industrial power systems.
FAQ
What is the maximum recommended gate resistor value for STGWA30H60DFB in a 20 kHz solar inverter?
For 20 kHz operation with acceptable Eon/Eoff balance and EMI control, ST recommends RG = 10 Ω (as validated in datasheet Figure 20). Increasing beyond 15 Ω raises td(off) and Eoff significantly - e.g., at RG = 20 Ω, Eoff rises by ~45% per Figure 16 - risking thermal overload at full load.
Does STGWA30H60DFB support parallel operation without external emitter resistors?
Yes - its slightly positive VCE(sat) temperature coefficient and tight parameter distribution (±5% VCE(sat), ±8% Qg) enable stable current sharing across parallel units. ST confirms this in Application Note AN4722, provided gate drive loops are symmetrical and thermal coupling is uniform.
How does the integrated diode's reverse recovery performance compare at 175 °C versus 25 °C?
At TJ = 175 °C, trr increases to 104 ns (+96%), Qrr rises to 1352 nC (+253%), and Err reaches 407 µJ (+290%) - all confirmed in Table 6. Designers must account for this degradation in thermal design and snubber sizing for high-temperature operation.
Is the metal tab electrically isolated in STGWA30H60DFB?
No - the metal tab is internally connected to the collector terminal. Electrical isolation from the heatsink is mandatory using insulating pads or ceramic washers. Failure to isolate risks short-circuiting the DC bus to chassis ground, as specified in Section 4.2 of DS10467 Rev 4.
STGWA30H60DFB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- HB
- Package/Case:
- TO-247-3
- Packaging:
- Tube
- Product Status:
- Active
- IGBT Type:
- Trench Field Stop
- Voltage - Collector Emitter Breakdown (Max):
- 600 V
- Current - Collector (Ic) (Max):
- 60 A
- Current - Collector Pulsed (Icm):
- 120 A
- Vce(on) (Max) @ Vge, Ic:
- 2V @ 15V, 30A
- Power - Max:
- 260 W
- Switching Energy:
- 383µJ (on), 293µJ (off)
- Input Type:
- Standard
- Gate Charge:
- 149 nC
- Td (on/off) @ 25°C:
- 37ns/146ns
- Test Condition:
- 400V, 30A, 10Ohm, 15V
- Reverse Recovery Time (trr):
- 53 ns
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247 Long Leads
STGWA30H60DFB FAQ
1.How can I place an order for STGWA30H60DFB through Aetrix?
Please submit a Request for Quotation (RFQ) for STGWA30H60DFB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STGWA30H60DFB reliable?
The price and inventory of STGWA30H60DFB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGWA30H60DFB is usually 5 days.
3.What payment methods are accepted for STGWA30H60DFB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGWA30H60DFB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STGWA30H60DFB?
STGWA30H60DFB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STGWA30H60DFB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STGWA30H60DFB?
For technical support, including STGWA30H60DFB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGWA30H60DFB requirements.
6.How does Aetrix verify that STGWA30H60DFB is sourced from the original manufacturer or authorized distributors?
All STGWA30H60DFB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGWA30H60DFB meets industry standards.
7.What is the process for return or replacement of STGWA30H60DFB?
All STGWA30H60DFB units undergo pre-shipment inspection (PSI). If there is an issue with STGWA30H60DFB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STGWA30H60DFB part is unused and in its original packaging.
Return procedure for STGWA30H60DFB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STGWA30H60DFB Tags
;;2.jpg)
-
STGD3NB60SDT4
STMicroelectronics

-
HGTD1N120BNS9A
onsemi

-
STGF7NB60SL
STMicroelectronics

-
FGD5T120SH
onsemi

-
STGB3NC120HDT4
STMicroelectronics

-
IKP20N60TXKSA1
Infineon Technologies

-
STGW30H60DFB
STMicroelectronics

-
STGB30M65DF2
STMicroelectronics

-
IKB20N60TATMA1
Infineon Technologies

-
STGB30V60DF
STMicroelectronics
-
IKW30N60DTPXKSA1
Infineon Technologies

-
ISL9V3040P3
onsemi
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

