STMicroelectronics STGWA40M120DF3
- Part No.:
- STGWA40M120DF3
- Manufacturer:
- STMicroelectronics
- Category:
- Single IGBTs
- Package:
- TO-247-3
- Datasheet:
-
STGWA40M120DF3.pdf
- Description:
- IGBT TRENCH FS 1200V 80A TO247
- Quantity:
- Payment:

- Shipping:

Inventory:389
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STGWA40M120DF3 from STMicroelectronics is a 1200 V, 40 A trench-gate field-stop IGBT with integrated soft-recovery antiparallel diode in TO-247 long leads package. It delivers VCE(sat) = 1.85 V (typ.) at IC = 40 A, 10 µs short-circuit withstand time, and RthJC = 0.32 °C/W (IGBT), enabling high-efficiency, robust operation in high-power industrial inverters and UPS systems.
For engineers reviewing the STGWA40M120DF3 datasheet, STGWA40M120DF3 pinout, STGWA40M120DF3 application, or STGWA40M120DF3 equivalent, key selection criteria include its positive VCE(sat) temperature coefficient for safe paralleling, tight parameter distribution, low thermal resistance, and diode reverse recovery charge (Qrr = 2575 nC at TJ = 25 °C) for reduced switching loss in hard-switched topologies.
Technical Context
This IGBT employs ST's M-series trench gate field-stop architecture optimized for balanced conduction and switching losses in 1200 V systems. Its design integrates a monolithic, soft-recovery antiparallel diode with low Qrr and controlled dIrr/dt to minimize voltage overshoot and EMI during turn-off.
The device supports stable operation up to TJ = 175 °C and features a gate threshold voltage (VGE(th)) of 5–7 V, ensuring reliable turn-on margin under high-temperature conditions while maintaining low gate drive power via Cies = 2500 pF and Qg = 125 nC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCES | 1200 V - Withstands DC bus voltages up to 1200 V in solar inverters and industrial drives without breakdown. |
| IC (TC = 100 °C) | 40 A - Continuous current rating at case temperature of 100 °C, defining usable output power in forced-air-cooled systems. |
| VCE(sat) (TJ = 25 °C) | 1.85 V (typ.) - Low saturation voltage reduces conduction loss and improves system efficiency at rated load. |
| tsc | 10 µs - Minimum short-circuit withstand time under VCC ≤ 600 V and TJ,start ≤ 150 °C, enabling robust fault handling in motor drives. |
| RthJC (IGBT) | 0.32 °C/W - Low junction-to-case thermal resistance allows efficient heat transfer to heatsink, supporting high power density designs. |
| Qrr (TJ = 25 °C) | 2575 nC - Reverse recovery charge of integrated diode determines turn-on loss contribution in bridge-leg configurations. |
| Eoff | 2.25 mJ (typ.) - Turn-off energy at 600 V, 40 A, TJ = 25 °C, directly impacting thermal design and snubber requirements. |
Pinout & Package
STGWA40M120DF3 uses the TO-247 long leads package (mechanical dimensions per Table 8, DS10301 Rev 4), featuring insulated tab (collector), three leads: Gate (G), Emitter (E), and Collector (C). The collector tab is electrically connected to pin 2 (C), while pin 1 is Gate and pin 3 is Emitter - confirmed by ST's official pin diagram (Figure 33) and marking "NG1E3C2T" indicating pin 1 = G, pin 2 = C (tab), pin 3 = E.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (G) | Gate terminal | Controls IGBT conduction; requires ±20 V max gate-emitter voltage and 125 nC total gate charge for full turn-on. |
| Pin 2 (C / Tab) | Collector terminal (isolated metal tab) | Main high-side current path; tab serves as primary thermal interface and must be electrically isolated from heatsink unless system design permits common-collector topology. |
| Pin 3 (E) | Emitter terminal | Reference node for gate drive and current sensing; shared emitter path for IGBT and integrated diode enables compact half-bridge layout. |
Key Features
| Feature | Design Value |
|---|---|
| Positive VCE(sat) temperature coefficient | Enables inherently stable current sharing when multiple devices are paralleled, reducing need for external current-balancing resistors. |
| Tight parameter distribution | Minimizes unit-to-unit variation in VCE(sat), VGE(th), and switching times - critical for consistent system-level timing and loss matching in multi-phase inverters. |
| Soft and fast-recovery antiparallel diode | Reverse recovery time trr = 355 ns (TJ = 25 °C) with low dIrr/dt (1110 A/µs) suppresses voltage spikes and EMI during commutation. |
| 175 °C maximum junction temperature | Supports operation in high-ambient environments (e.g., enclosed UPS cabinets) without derating, extending thermal design margin. |
| Low RthJC (0.32 °C/W) | Reduces temperature rise per watt dissipated, allowing higher continuous power output or smaller heatsinks in space-constrained applications. |
Applications
| Industrial Motor Drives | Uninterruptible Power Supplies (UPS) |
|---|---|
|
Use Scenario: Three-phase inverter stage in 15–30 kW variable-frequency drives for HVAC and pumps. IC Role / Device Role / Timing Role: High-side switch in six-pack IGBT module configuration; handles 1200 V DC link and 40 A RMS output current with precise PWM-controlled switching. Use Value: 10 µs short-circuit capability ensures survival during motor stall faults, while low VCE(sat) maintains >98% inverter efficiency at full load. |
Use Scenario: Online double-conversion UPS delivering clean 230 V AC output from battery-backed DC bus. IC Role / Device Role / Timing Role: Inverter-stage IGBT in full-bridge topology; switches at 8–16 kHz to synthesize sinusoidal output with low THD. Use Value: Integrated soft-recovery diode minimizes reverse recovery loss during zero-voltage switching transitions, improving battery runtime by ~2.3% versus standard diodes. |
| Solar String Inverters | Industrial Welding Equipment |
|
Use Scenario: DC–AC conversion stage in 10–25 kW string inverters interfacing PV arrays to grid. IC Role / Device Role / Timing Role: Main switching device in H-bridge or NPC topology; operates with unipolar PWM at 16–20 kHz under 1000 V+ DC input. Use Value: Tight VCE(sat) distribution ensures uniform thermal loading across parallel legs, preventing premature failure in outdoor-rated enclosures. |
Use Scenario: Primary inverter in IGBT-based inverter welders delivering 200–500 A DC output with rapid current slew rates. IC Role / Device Role / Timing Role: High-current switching element in resonant or hard-switched DC output stage; sustains pulsed IC up to 160 A (ICP). Use Value: 175 °C TJ rating and low RthJC allow sustained arc initiation duty cycles without thermal shutdown, increasing welder uptime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage IGBT applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IXYS IXGN40N120A3 | Higher VCE(sat) = 2.4 V (typ.), lower Qg = 95 nC, no integrated diode - requires external ultrafast diode. | Requires separate diode selection and layout; better suited for resonant topologies where diode recovery is managed externally. | Choose when gate drive power minimization is prioritized over board area and when diode recovery can be independently optimized. |
| Infineon IKW40N120H3 | Lower Eoff = 1.8 mJ, higher tsc = 12 µs, same TO-247 package but standard lead length (not long leads). | Superior switching efficiency at high frequency (>15 kHz); less suitable for high-thermal-resistance heatsink interfaces requiring longer leads. | Prefer for high-frequency UPS or solar inverters where switching loss dominates; avoid if mechanical clearance mandates long-lead mounting. |
Compared with STGWA40M120DF3, IXGN40N120A3 trades conduction loss for gate drive simplicity and external diode flexibility, while IKW40N120H3 improves switching efficiency but lacks long-lead mechanical compatibility - making STGWA40M120DF3 optimal for thermally demanding, space-constrained industrial drives requiring integrated diode reliability and mounting flexibility.
Availability
STGWA40M120DF3 is available at Aetrix Electronics and suitable for industrial motor drives, uninterruptible power supplies (UPS), and solar string inverters requiring stable component supply, long-lifecycle support, and traceable sourcing for production ramp-up.
Supply support for STGWA40M120DF3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.
STGWA40M120DF3 belongs to ST's M-series IGBT product line, engineered specifically for high-efficiency, high-reliability inverter systems where low conduction loss, short-circuit ruggedness, and safe paralleling are essential - targeting industrial drives, UPS, and renewable energy conversion.
FAQ
What is the difference between STGWA40M120DF3 and STGW40M120DF3?
STGWA40M120DF3 uses the TO-247 long leads package (L ≈ 20 mm), whereas STGW40M120DF3 uses the standard TO-247 (L ≈ 14.5 mm). Both share identical electrical specifications, silicon die, and marking "G40M120DF3", but differ mechanically to accommodate varied heatsink clearance and PCB mounting constraints.
Can STGWA40M120DF3 be used in parallel configurations?
Yes - its positive VCE(sat) temperature coefficient and tight parameter distribution enable stable current sharing without external emitter resistors. ST recommends using matched gate resistors and symmetrical layout; parallel operation is validated up to four devices in industrial drive reference designs.
What gate resistor value is recommended for 16 kHz operation at 175 °C junction temperature?
A gate resistor of 10 Ω is specified in the datasheet for characterization (Table 5), yielding td(off) = 150 ns and Eoff = 3.45 mJ at TJ = 175 °C. For 16 kHz operation, 10 Ω balances switching loss and EMI; reduce to 6–8 Ω only if dv/dt limits permit and thermal margin allows increased gate loss.
Does the integrated diode support bidirectional current in synchronous rectification?
No - the antiparallel diode is optimized for freewheeling in inverter leg configurations, not synchronous rectification. Its forward voltage (VF = 2.85 V typ. at 40 A) and recovery characteristics are tuned for inductive load commutation, not low-VF conduction; use discrete SiC Schottky diodes for true synchronous rectification.
STGWA40M120DF3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- TO-247-3
- Packaging:
- Tube
- Product Status:
- Active
- IGBT Type:
- Trench Field Stop
- Voltage - Collector Emitter Breakdown (Max):
- 1200 V
- Current - Collector (Ic) (Max):
- 80 A
- Current - Collector Pulsed (Icm):
- 160 A
- Vce(on) (Max) @ Vge, Ic:
- 2.3V @ 15V, 40A
- Power - Max:
- 468 W
- Switching Energy:
- 1.03mJ (on), 480µJ (off)
- Input Type:
- Standard
- Gate Charge:
- 125 nC
- Td (on/off) @ 25°C:
- 35ns/140ns
- Test Condition:
- 600V, 40A, 10Ohm, 15V
- Reverse Recovery Time (trr):
- 355 ns
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247 Long Leads
STGWA40M120DF3 FAQ
1.How can I place an order for STGWA40M120DF3 through Aetrix?
Please submit a Request for Quotation (RFQ) for STGWA40M120DF3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STGWA40M120DF3 reliable?
The price and inventory of STGWA40M120DF3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGWA40M120DF3 is usually 5 days.
3.What payment methods are accepted for STGWA40M120DF3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGWA40M120DF3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STGWA40M120DF3?
STGWA40M120DF3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STGWA40M120DF3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STGWA40M120DF3?
For technical support, including STGWA40M120DF3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGWA40M120DF3 requirements.
6.How does Aetrix verify that STGWA40M120DF3 is sourced from the original manufacturer or authorized distributors?
All STGWA40M120DF3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGWA40M120DF3 meets industry standards.
7.What is the process for return or replacement of STGWA40M120DF3?
All STGWA40M120DF3 units undergo pre-shipment inspection (PSI). If there is an issue with STGWA40M120DF3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STGWA40M120DF3 part is unused and in its original packaging.
Return procedure for STGWA40M120DF3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STGWA40M120DF3 Tags
;;2.jpg)
-
STGD3NB60SDT4
STMicroelectronics

-
HGTD1N120BNS9A
onsemi

-
STGF7NB60SL
STMicroelectronics

-
FGD5T120SH
onsemi

-
STGB3NC120HDT4
STMicroelectronics

-
IKP20N60TXKSA1
Infineon Technologies

-
STGW30H60DFB
STMicroelectronics

-
STGB30M65DF2
STMicroelectronics

-
IKB20N60TATMA1
Infineon Technologies

-
STGB30V60DF
STMicroelectronics
-
IKW30N60DTPXKSA1
Infineon Technologies

-
ISL9V3040P3
onsemi
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
