STMicroelectronics STGWA75H65DFB2
- Part No.:
- STGWA75H65DFB2
- Manufacturer:
- STMicroelectronics
- Category:
- Single IGBTs
- Package:
- TO-247-3
- Datasheet:
-
STGWA75H65DFB2.pdf
- Description:
- TRENCH GATE FIELD-STOP, 650 V, 7
- Quantity:
- Payment:

- Shipping:

Inventory:3,610
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Product details
Overview
STGWA75H65DFB2 from STMicroelectronics is a 650 V, 75 A high-speed trench gate field-stop IGBT with co-packaged soft-recovery diode in TO-247 long leads package. It delivers low VCE(sat) = 1.55 V (typ. at IC = 75 A, TJ = 25 °C), tight parameter distribution, and minimized tail current for high-efficiency switching in DC fast charging stations and solar inverters.
For engineers reviewing the STGWA75H65DFB2 datasheet, STGWA75H65DFB2 pinout, STGWA75H65DFB2 application, or STGWA75H65DFB2 equivalent, key selection criteria include VCE(sat) temperature coefficient, diode reverse recovery charge (Qrr = 923 nC at TJ = 25 °C), thermal resistance (RthJC = 0.42 °C/W), switching energy (Eon = 1428 µJ, Eoff = 1050 µJ), and safe operating area at TJ = 175 °C.
Technical Context
This IGBT employs ST's proprietary HB2 series trench gate field-stop structure optimized for conduction loss reduction at low currents and lower total switching energy. Its positive VCE(sat) temperature coefficient enables stable parallel operation, while the integrated diode features very fast soft recovery (trr = 88 ns) and low dIrr/dt (1166 A/µs).
The device operates across TJ = –55 to 175 °C with rated VCES = 650 V and continuous IC = 71 A at TC = 100 °C. Dynamic performance is characterized under standardized inductive load conditions (VCC = 400 V, IC = 75 A, RG = 2.2 Ω), confirming turn-off delay td(off) = 100 ns and current fall time tf = 36 ns at 25 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCES | 650 V - Maximum blocking voltage before avalanche; supports 400 V DC bus designs with 1.6× safety margin. |
| IC (TC = 100 °C) | 71 A - Continuous collector current rating at real-world heatsink temperature; defines usable output power in PFC stages. |
| VCE(sat) (25 °C) | 1.55 V (typ.) - Low saturation voltage reduces conduction loss by ~22% vs. prior HB1 generation at 75 A. |
| Eoff | 1050 µJ - Turn-off energy at 25 °C; enables >20 kHz switching in UPS and welding inverters without excessive thermal stress. |
| RthJC (IGBT) | 0.42 °C/W - Junction-to-case thermal resistance; allows 357 W dissipation at TC = 25 °C, critical for compact heatsink design. |
| Qrr (25 °C) | 923 nC - Diode reverse recovery charge; low value minimizes commutation losses and EMI in hard-switched topologies. |
| trr | 88 ns - Reverse recovery time at 25 °C; supports clean zero-voltage switching transitions in resonant converters. |
Pinout & Package
TO-247 long leads package with isolated tab (collector-connected), 3-pin configuration. Standardized mechanical outline per DS13215 Rev 4 Figure 31; creepage/clearance compliant for industrial isolation requirements.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Pin 1) | Gate | Control terminal requiring ±20 V max drive; total gate charge Qg = 207 nC dictates driver strength and layout parasitic sensitivity. |
| C (Tab / Pin 2) | Collector | Main high-side power terminal; electrically connected to metal tab for direct heatsink mounting and low-inductance thermal path. |
| E (Pin 3) | Emitter | Reference node for gate drive and current sensing; low-inductance emitter connection essential for stable high-dI/dt switching. |
Key Features
| Feature | Design Value |
|---|---|
| Co-packaged soft-recovery diode | Enables single-package half-bridge operation with trr = 88 ns and Qrr = 923 nC-reduces external diode count and layout complexity in inverter legs. |
| Positive VCE(sat) tempco | Ensures inherent current sharing in paralleled IGBTs without external ballasting resistors-critical for modular EV charger power stacks. |
| Tight parameter distribution | ±5% VCE(sat) and ±8% Eoff tolerance across production lots-enables predictable thermal modeling and derating in safety-critical UPS systems. |
| Minimized tail current | Reduces turn-off energy (Eoff) by 32% vs. legacy HB1 devices at TJ = 175 °C-extends usable frequency range in solar string inverters. |
| 175 °C maximum junction temperature | Supports operation in high-ambient environments (e.g., outdoor EV chargers) without forced air cooling-lowers system BOM cost. |
Applications
| Welding Inverters | Solar String Inverters |
|---|---|
|
Use Scenario: High-frequency DC-link switching in IGBT-based inverter welders delivering 20–30 kHz PWM for arc stability and spatter reduction. IC Role / Device Role / Timing Role: Main switching device in full-bridge output stage handling 75 A peak load current at 650 V blocking. Use Value: Low VCE(sat) and minimized tail current reduce conduction + switching losses by 18% vs. standard HB1 IGBTs-enabling smaller heatsinks and higher duty cycle operation. |
Use Scenario: DC/AC conversion stage in residential solar string inverters with 600 V DC input and 230 V AC output. IC Role / Device Role / Timing Role: High-side switch in unipolar modulation topology; co-packaged diode handles freewheeling current during dead-time. Use Value: Soft-recovery diode (trr = 88 ns, Qrr = 923 nC) suppresses voltage overshoot and EMI-eliminating need for snubbers and reducing filter component count. |
| DC Fast Charging Stations | Uninterruptible Power Supplies |
|
Use Scenario: Active rectification and DC/DC isolation in liquid-cooled 150–350 kW EV charging modules. IC Role / Device Role / Timing Role: Primary switch in interleaved totem-pole PFC front-end operating at 50–100 kHz with 75 A RMS current. Use Value: Tight parameter distribution (±5% VCE(sat)) ensures balanced current sharing across paralleled modules-improving reliability and thermal uniformity in multi-phase designs. |
Use Scenario: Online double-conversion UPS systems requiring high efficiency (>96%) and fast transfer (<10 ms) between utility and battery backup. IC Role / Device Role / Timing Role: Inverter-stage switch handling 400 V DC bus and 20 kVA three-phase output with 175 °C junction capability. Use Value: RthJC = 0.42 °C/W and 357 W power dissipation enable passive-cooled designs in space-constrained data center cabinets-reducing fan noise and maintenance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed IGBT applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IXYS IXGN75N60B3 | 600 V rating, higher VCE(sat) = 1.8 V (typ.), slower diode (trr = 120 ns), RthJC = 0.55 °C/W. | Lower voltage headroom limits use in 400 V+ DC fast charging; higher conduction loss increases heatsink size in solar inverters. | Select when 600 V rating suffices and cost sensitivity outweighs efficiency gains. |
| Infineon IKW75N65ES5 | 650 V rating, similar VCE(sat) = 1.55 V, but diode Qrr = 1350 nC and Eoff = 1420 µJ at same test conditions. | Higher diode recovery losses increase EMI filtering burden in PFC stages; less suitable for high-frequency (>40 kHz) UPS designs. | Select when robustness against overvoltage transients is prioritized over switching efficiency. |
Compared with IXGN75N60B3 and IKW75N65ES5, STGWA75H65DFB2 offers superior trade-off between conduction loss (1.55 V), diode softness (Qrr = 923 nC), and thermal performance (RthJC = 0.42 °C/W), making it optimal for high-density, high-frequency power conversion where efficiency and thermal management are critical.
Availability
STGWA75H65DFB2 is available at Aetrix Electronics and suitable for welding inverters, solar string inverters, and uninterruptable power supplies requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial OEM programs.
Supply support for STGWA75H65DFB2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.
This device belongs to ST's HB2 series of high-speed trench gate field-stop IGBTs, engineered specifically for high-efficiency, high-frequency power conversion in renewable energy, EV infrastructure, and industrial motor drives.
FAQ
What is the maximum recommended gate resistor value for reliable switching?
The datasheet specifies RG = 2.2 Ω for characterization, and Figure 20 shows td(off) increases from 100 ns to 140 ns when RG rises to 20 Ω. For hard-switched applications above 15 kHz, RG should not exceed 5.6 Ω to maintain Eoff < 1300 µJ and avoid excessive voltage overshoot. Higher values require gate driver current capability ≥ 2 A peak.
Can STGWA75H65DFB2 be used in parallel configurations?
Yes-its positive VCE(sat) temperature coefficient (Figure 5) ensures natural current balancing across paralleled units. Layout must ensure matched gate loop inductance and symmetrical emitter connections; ST recommends ≤ 10 nH difference in gate-emitter loop inductance per unit to prevent dynamic imbalance at di/dt > 1000 A/µs.
How does the diode's reverse recovery behavior change at elevated temperature?
At TJ = 175 °C, Qrr increases to 5431 nC and trr extends to 162 ns (Table 6), raising Eoff by 68% versus 25 °C. This necessitates derating switching frequency or increasing snubber energy absorption in high-ambient applications like outdoor EV chargers.
Is the TO-247 long leads package RoHS-compliant and halogen-free?
Yes-the device carries ECOPACK2 certification per ST's environmental compliance program, meeting RoHS Directive 2011/65/EU and JEDEC JS709C halogen-free requirements. Lead finish is matte tin, and packaging uses lead-free solder-compatible materials per DS13215 Section 4.
STGWA75H65DFB2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- HB2
- Package/Case:
- TO-247-3
- Packaging:
- Tube
- Product Status:
- Active
- IGBT Type:
- Trench Field Stop
- Voltage - Collector Emitter Breakdown (Max):
- 650 V
- Current - Collector (Ic) (Max):
- 115 A
- Current - Collector Pulsed (Icm):
- 225 A
- Vce(on) (Max) @ Vge, Ic:
- 2V @ 15V, 75A
- Power - Max:
- 357 W
- Switching Energy:
- 1.428mJ (on), 1.05mJ (off)
- Input Type:
- Standard
- Gate Charge:
- 207 nC
- Td (on/off) @ 25°C:
- 28ns/100ns
- Test Condition:
- 400V, 75A, 2.2Ohm, 15V
- Reverse Recovery Time (trr):
- 88 ns
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247 Long Leads
STGWA75H65DFB2 FAQ
1.How can I place an order for STGWA75H65DFB2 through Aetrix?
Please submit a Request for Quotation (RFQ) for STGWA75H65DFB2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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5.How can I obtain technical support or documentation for STGWA75H65DFB2?
For technical support, including STGWA75H65DFB2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGWA75H65DFB2 requirements.
6.How does Aetrix verify that STGWA75H65DFB2 is sourced from the original manufacturer or authorized distributors?
All STGWA75H65DFB2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGWA75H65DFB2 meets industry standards.
7.What is the process for return or replacement of STGWA75H65DFB2?
All STGWA75H65DFB2 units undergo pre-shipment inspection (PSI). If there is an issue with STGWA75H65DFB2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STGWA75H65DFB2 part is unused and in its original packaging.
Return procedure for STGWA75H65DFB2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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