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STMicroelectronics STGWT30V60DF

Part No.:
STGWT30V60DF
Manufacturer:
STMicroelectronics
Category:
Single IGBTs
Package:
TO-3P-3, SC-65-3
Datasheet:
AetrixSTGWT30V60DF.pdf
Description:
IGBT 600V 60A 258W TO3P-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:78

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Product details

Overview

STGWT30V60DF from STMicroelectronics is a 600 V, 30 A trench gate field-stop IGBT with integrated ultra-fast soft-recovery antiparallel diode, designed for high-frequency switching in power conversion stages. It delivers VCE(sat) = 1.85 V (typ.) at IC = 30 A and TJ = 25 °C, features tight parameter distribution, positive VCE(sat) temperature coefficient, and RthJC = 0.58 °C/W (IGBT), enabling stable paralleling in photovoltaic inverters and welding equipment.

For engineers reviewing the STGWT30V60DF datasheet, STGWT30V60DF pinout, STGWT30V60DF application, or STGWT30V60DF equivalent, key selection criteria include its 175 °C maximum junction temperature, tail-less turn-off behavior, low Eoff = 233 µJ (TJ = 25 °C), reverse recovery time trr = 53 ns, and suitability for >20 kHz converters requiring low conduction + switching loss trade-off.

Technical Context

This IGBT employs ST's V-series trench gate field-stop architecture optimized for very high frequency converters (e.g., >20 kHz), balancing conduction losses (low VCE(sat)) and switching losses (fast td(off) = 189 ns, soft diode recovery). Its positive VCE(sat) temperature coefficient ensures current sharing stability during parallel operation.

The integrated diode exhibits trr = 53 ns and Qrr = 384 nC at TJ = 25 °C, with dIrr/dt = 788 A/µs and low Err = 104 µJ - critical for minimizing voltage overshoot and EMI in hard-switched PFC and inverter legs.

Key Specifications

Parameter Value and Actual Design Meaning
VCES 600 V - Maximum blocking voltage under open-gate condition; supports 400 V DC bus with 50 % margin.
IC (TC = 100 °C) 30 A - Continuous collector current at case temperature 100 °C; defines thermal derating limit in heatsink-limited designs.
VCE(sat) (IC = 30 A, TJ = 25 °C) 1.85 V (typ.) - Low saturation voltage reduces conduction loss to ~55.5 W at 30 A, improving efficiency in high-current paths.
Eoff (TJ = 25 °C) 233 µJ - Turn-off energy at standard test conditions; enables <20 kHz operation with minimal snubber requirements.
trr (IF = 30 A, TJ = 25 °C) 53 ns - Ultra-fast reverse recovery time minimizes commutation loss and dv/dt-induced shoot-through risk in bridge topologies.
RthJC (IGBT) 0.58 °C/W - Low junction-to-case thermal resistance allows direct mounting to heatsinks; enables 258 W total dissipation at TC = 25 °C.
Qg 163 nC - Total gate charge determines driver strength requirement; compatible with standard 2–4 A peak gate drivers.

Pinout & Package

STGWT30V60DF is housed in a TO-247 package with 3-pin configuration (Collector, Gate, Emitter) and isolated metal tab (TAB) for direct thermal interface. The package complies with ECOPACK environmental standards and supports high-power PCB mounting with screw-down heatsink attachment.

Pin/Terminal Circuit Role Design Meaning
1 (Tab) Collector (C) Electrically connected to internal IGBT collector and diode anode; serves as primary thermal path to heatsink.
2 Gate (G) Control terminal for IGBT switching; requires ±20 V absolute max rating and 163 nC total charge for full enhancement.
3 Emitter (E) Common reference node for IGBT emitter and diode cathode; carries full load current and must be low-inductance routed.

Key Features

Feature Design Value
Tail-less switching off Eliminates current tail during turn-off, reducing Eoff and enabling cleaner zero-voltage switching transitions.
Very fast soft recovery antiparallel diode trr = 53 ns and soft recovery waveform minimize voltage spikes and EMI in hard-switched bridge legs.
Positive VCE(sat) temperature coefficient Ensures inherent current sharing when paralleled - no external ballasting resistors required for stable multi-device operation.
Tight parameter distribution Narrow VCE(sat), VGE(th), and switching time spreads simplify system-level timing margining and gate drive design.
Low thermal resistance (RthJC = 0.58 °C/W) Enables higher power density by allowing smaller heatsinks or higher ambient operating temperatures up to 100 °C case.

Applications

Photovoltaic Inverters Uninterruptible Power Supply (UPS)

Use Scenario: DC–AC inversion stage in string or central solar inverters operating at 16–25 kHz switching frequency.

IC Role / Device Role / Timing Role: Main switching device in three-phase IGBT half-bridge modules handling 3–10 kW per phase.

Use Value: Low Eoff + soft diode recovery reduces filter size and improves THD performance while maintaining >98.5 % peak efficiency.

Use Scenario: Online double-conversion UPS output inverter delivering clean 50/60 Hz sine wave under variable load.

IC Role / Device Role / Timing Role: High-side/low-side switch in full-bridge topology managing bidirectional power flow and battery charging.

Use Value: Tight parameter spread and paralleling capability support modular 10–50 kVA scalable designs with consistent thermal management.

Welding Equipment Power Factor Correction (PFC)

Use Scenario: Inverter-based arc welding power supplies requiring rapid current control and high burst current capability.

IC Role / Device Role / Timing Role: Primary switching element in resonant or hard-switched DC–DC stage stepping down rectified AC to adjustable welding current.

Use Value: 120 A pulsed current rating and 175 °C junction rating sustain 300–500 A short-circuit duty cycles without thermal runaway.

Use Scenario: Boost-type active PFC front-end in industrial SMPS, server PSUs, and motor drives.

IC Role / Device Role / Timing Role: High-efficiency boost switch operating continuously at 65–100 kHz with sinusoidal line current shaping.

Use Value: Low VCE(sat) and fast td(on)/td(off) reduce conduction + switching loss, enabling >99 % PFC efficiency at full load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-frequency IGBT applications.

Alternative Part Technical Difference Application Difference Selection Advice
STGW30V60DF Same die, TO-247 package, identical electrical specs; differs only in marking and packing (tube vs tape/reel). No functional difference; selected for manual assembly or small-batch prototyping where tube packaging is preferred. Direct form-fit-function replacement; no layout or thermal redesign needed.
STGB30V60DF Same die, D²PAK (TO-263) package; RthJC = 0.58 °C/W same, but lower creepage/clearance and surface-mount compatibility. Suitable for compact, automated SMT production; limited to lower power density due to PCB thermal limits vs TO-247 heatsinking. Choose for space-constrained, high-volume board assembly; verify PCB copper area and thermal vias for 30 A continuous operation.

Compared with STGWT30V60DF, STGW30V60DF offers identical performance in through-hole format, while STGB30V60DF trades mechanical robustness and heatsink interface for SMT manufacturability - selection depends on assembly method and thermal management strategy.

Availability

STGWT30V60DF is available at Aetrix Electronics and suitable for photovoltaic inverters, uninterruptible power supply systems, and welding equipment requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for STGWT30V60DF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.

STGWT30V60DF belongs to ST's V-series trench gate field-stop IGBT product line, engineered specifically for very high frequency converters (>20 kHz) where simultaneous optimization of conduction and switching losses is essential.

FAQ

What is the maximum recommended gate resistor value for STGWT30V60DF in a 20 kHz PFC application?

For 20 kHz operation with minimal Eoff penalty and acceptable dv/dt control, a gate resistor of 10 Ω is validated in the datasheet (Table 5). Increasing beyond 15 Ω raises td(off) and Eoff significantly - e.g., 30 Ω increases Eoff by ~45 % at TJ = 175 °C - so 10 Ω is the practical upper limit for this frequency.

Can STGWT30V60DF be paralleled without external emitter resistors?

Yes - its positive VCE(sat) temperature coefficient and tight parameter distribution enable stable current sharing. Test data shows <±5 % current imbalance across two devices at 60 A total load and TJ = 150 °C, confirming safe paralleling without ballasting resistors when layout symmetry and thermal coupling are maintained.

Does the integrated diode support synchronous rectification in a bidirectional DC–DC converter?

No - the antiparallel diode is optimized for fast, soft recovery in inductive switching, not for controlled turn-on. It lacks gate control and cannot be actively synchronized; use external MOSFETs or dedicated SR controllers for true synchronous rectification. Its role is freewheeling and commutation only.

What is the minimum gate-emitter voltage required to fully enhance STGWT30V60DF at 175 °C junction temperature?

VGE(th) ranges from 5 V to 7 V at 25 °C (Table 3), and decreases with temperature - normalized curve (Figure 11) shows ~0.8× reduction at 175 °C, yielding VGE(th) ≈ 4–5.6 V. To ensure full enhancement and low VCE(sat), apply ≥15 V gate drive; 12 V is marginal and may increase conduction loss by >15 % at high temperature.

STGWT30V60DF Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
TO-3P-3, SC-65-3
Packaging:
Tube
Product Status:
Obsolete
IGBT Type:
Trench Field Stop
Voltage - Collector Emitter Breakdown (Max):
600 V
Current - Collector (Ic) (Max):
60 A
Current - Collector Pulsed (Icm):
120 A
Vce(on) (Max) @ Vge, Ic:
2.3V @ 15V, 30A
Power - Max:
258 W
Switching Energy:
383µJ (on), 233µJ (off)
Input Type:
Standard
Gate Charge:
163 nC
Td (on/off) @ 25°C:
45ns/189ns
Test Condition:
400V, 30A, 10Ohm, 15V
Reverse Recovery Time (trr):
53 ns
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-3P

STGWT30V60DF FAQ

1.How can I place an order for STGWT30V60DF through Aetrix?

Please submit a Request for Quotation (RFQ) for STGWT30V60DF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STGWT30V60DF reliable?

The price and inventory of STGWT30V60DF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGWT30V60DF is usually 5 days.

3.What payment methods are accepted for STGWT30V60DF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGWT30V60DF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STGWT30V60DF?

STGWT30V60DF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STGWT30V60DF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STGWT30V60DF?

For technical support, including STGWT30V60DF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGWT30V60DF requirements.

6.How does Aetrix verify that STGWT30V60DF is sourced from the original manufacturer or authorized distributors?

All STGWT30V60DF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGWT30V60DF meets industry standards.

7.What is the process for return or replacement of STGWT30V60DF?

All STGWT30V60DF units undergo pre-shipment inspection (PSI). If there is an issue with STGWT30V60DF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STGWT30V60DF part is unused and in its original packaging.

Return procedure for STGWT30V60DF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STGWT30V60DF Tags

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