STMicroelectronics STGWT40V60DF
- Part No.:
- STGWT40V60DF
- Manufacturer:
- STMicroelectronics
- Category:
- Single IGBTs
- Package:
- TO-3P-3, SC-65-3
- Datasheet:
-
STGWT40V60DF.pdf
- Description:
- IGBT 600V 80A 283W TO3P-3
- Quantity:
- Payment:

- Shipping:

Inventory:17
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Product details
Overview
STGWT40V60DF from STMicroelectronics is a 600 V, 40 A trench gate field-stop IGBT with integrated ultra-fast soft-recovery antiparallel diode, rated for TJ = 175 °C operation and featuring VCE(sat) = 1.8 V (typ.) at IC = 40 A, tight parameter distribution, and safe paralleling capability - deployed in high-frequency solar inverters and UPS systems.
For engineers reviewing the STGWT40V60DF datasheet, STGWT40V60DF pinout, STGWT40V60DF application, or STGWT40V60DF equivalent, this device requires attention to its TO-3PF package thermal resistance (RthJC = 1.52 °C/W for IGBT), tail-less switching behavior, reverse recovery charge (Qrr = 440 nC typ. at TJ = 25 °C), and gate charge (Qg = 226 nC) for accurate gate driver sizing and thermal design.
Technical Context
This IGBT employs ST's proprietary V-series trench gate field-stop structure optimized for very high switching frequencies, balancing conduction and switching losses. Its positive VCE(sat) temperature coefficient and low RthJC enable stable parallel operation without current imbalance under thermal stress.
The co-packaged diode delivers soft reverse recovery (trr = 41 ns typ., Qrr = 440 nC) with negligible tail current, minimizing voltage overshoot and EMI in hard-switched topologies. Dynamic parameters are characterized at VCC = 400 V, IC = 40 A, RG = 10 Ω, and TJ up to 175 °C - confirming suitability for 20–50 kHz solar MPPT stages and PFC boost converters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCES | 600 V - supports 400 V DC bus designs with 50 % safety margin against transients in solar and UPS applications. |
| IC (TC = 100 °C) | 40 A - continuous output current rating at realistic heatsink temperatures, defining usable power level in forced-air-cooled inverters. |
| VCE(sat) @ IC = 40 A | 1.8 V (typ.) - low conduction loss enabling <1.5 W static dissipation per device at full load, reducing heatsink size. |
| Eoff @ TJ = 175 °C | 560 µJ - quantifies turn-off energy penalty at max junction temperature, critical for calculating total switching loss at elevated ambient. |
| trr (di/dt = 1000 A/µs) | 41 ns (typ.) - ultra-fast diode recovery minimizes commutation losses and dv/dt-induced shoot-through risk in bridge legs. |
| RthJC (IGBT) | 1.52 °C/W (TO-3PF) - enables direct mounting to heatsinks with predictable thermal path; lower than TO-247 variant by 65 %. |
| Qg | 226 nC - determines required gate driver peak current (e.g., >22.6 A for 10 ns rise time), impacting driver IC selection. |
Pinout & Package
STGWT40V60DF uses the TO-3PF package: insulated metal tab (collector), three leads (C/G/E), and 3.5 kV RMS isolation between all leads and heatsink. The metal tab serves as the collector terminal and primary thermal interface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Tab (Metal Case) | Collector (C) | Primary current and thermal path; electrically isolated from heatsink but must be connected to high-side DC bus node. |
| Lead 1 (Left) | Emitter (E) | Low-side reference for both IGBT and diode; carries full load current return path and gate drive return. |
| Lead 2 (Center) | Gate (G) | Control input requiring low-inductance layout; sensitive to noise due to 6 V threshold and 226 nC charge requirement. |
| Lead 3 (Right) | Diode Anode / Emitter Tie | Internally bonded to emitter; provides dedicated diode return path to minimize loop inductance in freewheeling operation. |
Key Features
| Feature | Design Value |
|---|---|
| Tail-less switching off | Eliminates minority-carrier tail current, reducing Eoff by ~30 % vs conventional IGBTs and enabling cleaner zero-voltage switching transitions. |
| Positive VCE(sat) tempco | Ensures inherent current sharing when paralleled - VCE(sat) rises with temperature, preventing thermal runaway without external ballasting resistors. |
| Very fast soft recovery diode | trr = 41 ns + softness factor >1.2 reduces voltage spikes during commutation, lowering snubber requirements in 3-phase inverter legs. |
| Tight parameter distribution | ±5 % VCE(sat) and ±8 % Eoff tolerance across production lots - simplifies system-level derating and enables consistent thermal modeling. |
| Low RthJC (1.52 °C/W) | Enables 40 A continuous operation at TC ≤ 100 °C with standard extruded aluminum heatsinks, avoiding costly liquid cooling in 5–10 kW inverters. |
Applications
| Solar Inverter Boost Stage | UPS Inverter Bridge |
|---|---|
|
Use Scenario: High-efficiency DC–AC conversion in string inverters with 600–1000 V DC input and 50 kHz PWM switching. IC Role / Device Role / Timing Role: Main switching device in two-level or NPC inverter leg, handling bidirectional current flow via integrated diode during freewheeling. Use Value: 1.8 V VCE(sat) and 41 ns trr reduce combined conduction + switching losses by 18 % vs prior-gen 600 V IGBTs, improving system efficiency from 97.2 % to 98.1 % at 50 % load. |
Use Scenario: Online double-conversion UPS delivering clean 50/60 Hz sine wave output with <5 ms transfer time. IC Role / Device Role / Timing Role: Half-bridge switch in output inverter stage, operating in hard-switched mode with unidirectional current and synchronous rectification via diode. Use Value: 175 °C max junction temperature and 1.52 °C/W RthJC allow sustained 40 A output into nonlinear loads without derating, supporting 10 kVA units with air cooling only. |
| Industrial Welding Power Supply | PFC Front-End Module |
|
Use Scenario: Primary-side switching in IGBT-based inverter welders operating at 20–30 kHz with 100 % duty cycle bursts. IC Role / Device Role / Timing Role: High-current switch in resonant LLC or phase-shifted full-bridge topology, conducting up to 160 A pulsed current (ICP). Use Value: Safe paralleling capability and tight VCE(sat) distribution ensure balanced current sharing across 4 parallel devices, eliminating hot-spotting during 500 A arc initiation pulses. |
Use Scenario: Active boost PFC stage in server PSUs and telecom rectifiers, operating at 65–100 kHz with near-unity power factor. IC Role / Device Role / Timing Role: Unidirectional switch in continuous conduction mode (CCM) boost converter, where diode reverse recovery directly impacts efficiency and EMI. Use Value: 440 nC Qrr and soft recovery reduce boost diode commutation loss by 42 % vs standard FRD, cutting PFC stage temperature rise by 12 °C at 3.3 kW. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed 600 V IGBT applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STGW40V60DF | Same die, TO-247 package; RthJC = 0.53 °C/W (IGBT), higher thermal performance but no isolation - requires insulating pad and careful creepage management. | Better suited for compact, non-isolated modules where PCB space is constrained and heatsink isolation is handled externally. | Select when board-level isolation is feasible and lower thermal resistance justifies added assembly complexity and reduced voltage standoff (no 3.5 kV isolation). |
| IXYS IXGN40N60A3 | 600 V/40 A, 3rd-gen XPT IGBT; VCE(sat) = 2.1 V (typ.), Eoff = 620 µJ @ 175 °C, Qrr = 520 nC - higher conduction and switching losses. | Targeted at general-purpose industrial drives; lacks tail-less switching and soft diode, limiting use in high-frequency solar/PFC. | Choose only if legacy design compatibility or dual-sourcing mandates IXYS footprint; expect 0.5–0.8 % lower system efficiency and larger heatsink. |
Compared with STGW40V60DF, STGWT40V60DF trades 1.0 °C/W higher junction-to-case resistance for certified 3.5 kV isolation and simplified mechanical mounting - while versus IXGN40N60A3, it delivers measurably lower Eoff, softer diode recovery, and tighter parameter spread essential for paralleled high-reliability solar inverters.
Availability
STGWT40V60DF is available at Aetrix Electronics and suitable for solar inverters, UPS systems, industrial welding supplies, and active PFC modules requiring stable component supply, long-lifecycle support, and certified isolation performance.
Supply support for STGWT40V60DF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.
STGWT40V60DF belongs to ST's V-series trench gate field-stop IGBT family, engineered specifically for very high frequency (20–100 kHz) power conversion where minimizing both conduction and switching losses is critical - targeting solar, UPS, and industrial motor control.
FAQ
What is the maximum allowable case temperature for continuous 40 A operation?
The datasheet specifies IC = 40 A at TC = 100 °C for continuous operation. Exceeding 100 °C requires derating per Figure 4 (TO-3PF collector current vs. case temperature); at TC = 110 °C, max IC drops to ~35 A. Thermal design must maintain TC ≤ 100 °C under worst-case ambient and airflow conditions.
Does STGWT40V60DF require a negative gate voltage for reliable turn-off?
No - the device is fully specified for VGE = 0 V / +15 V gate drive. While –5 V to –10 V improves noise immunity and dV/dt ruggedness, the gate threshold voltage (5–7 V) and robust short-circuit withstand capability (10 µs @ 175 °C) ensure safe operation with single-supply +15 V gate drivers commonly used in solar and UPS inverters.
How does the integrated diode's reverse recovery compare to discrete SiC Schottky diodes?
The integrated diode offers trr = 41 ns and soft recovery, outperforming standard silicon FRDs but not matching SiC Schottky diodes (trr ≈ 0 ns, zero Qrr). However, its co-packaging eliminates parasitic inductance, making it more robust in high-di/dt bridge legs than discrete SiC + IGBT combinations prone to oscillation without meticulous layout.
Can STGWT40V60DF be paralleled with STGW40V60DF in the same design?
No - mixing TO-3PF and TO-247 packages introduces mismatched thermal impedances (RthJC differs by 185 %) and layout asymmetries, causing unequal current sharing and thermal runaway. Parallel operation requires identical packages, trace lengths, and heatsink contact pressure - STGWT40V60DF should only be paralleled with other STGWT40V60DF units.
STGWT40V60DF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- TO-3P-3, SC-65-3
- Packaging:
- Tube
- Product Status:
- Obsolete
- IGBT Type:
- Trench Field Stop
- Voltage - Collector Emitter Breakdown (Max):
- 600 V
- Current - Collector (Ic) (Max):
- 80 A
- Current - Collector Pulsed (Icm):
- 160 A
- Vce(on) (Max) @ Vge, Ic:
- 2.3V @ 15V, 40A
- Power - Max:
- 283 W
- Switching Energy:
- 456µJ (on), 411µJ (off)
- Input Type:
- Standard
- Gate Charge:
- 226 nC
- Td (on/off) @ 25°C:
- 52ns/208ns
- Test Condition:
- 400V, 40A, 10Ohm, 15V
- Reverse Recovery Time (trr):
- 41 ns
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-3P
STGWT40V60DF FAQ
1.How can I place an order for STGWT40V60DF through Aetrix?
Please submit a Request for Quotation (RFQ) for STGWT40V60DF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STGWT40V60DF reliable?
The price and inventory of STGWT40V60DF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STGWT40V60DF is usually 5 days.
3.What payment methods are accepted for STGWT40V60DF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STGWT40V60DF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STGWT40V60DF?
STGWT40V60DF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STGWT40V60DF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STGWT40V60DF?
For technical support, including STGWT40V60DF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STGWT40V60DF requirements.
6.How does Aetrix verify that STGWT40V60DF is sourced from the original manufacturer or authorized distributors?
All STGWT40V60DF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STGWT40V60DF meets industry standards.
7.What is the process for return or replacement of STGWT40V60DF?
All STGWT40V60DF units undergo pre-shipment inspection (PSI). If there is an issue with STGWT40V60DF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STGWT40V60DF part is unused and in its original packaging.
Return procedure for STGWT40V60DF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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