My Inquiry
My Account
Infineon Technologies TDA21101G
- Part No.:
- TDA21101G
- Manufacturer:
- Infineon Technologies
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TDA21101G.pdf
- Description:
- IC HALF BRIDGE DRIVER DSO8
- Quantity:
- Payment:
- Shipping:
Inventory:3,948
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TDA21101G from Infineon Technologies is a dual high-speed MOSFET gate driver IC for synchronous half-bridge topologies, featuring 4 A peak sink/source capability per output, <30 ns rise/fall times, adjustable high-side gate drive voltage (5–12 V), integrated bootstrap diode, and adaptive cross-conduction prevention. It targets multi-phase CPU VRMs on desktop and notebook motherboards.
For engineers reviewing the TDA21101G datasheet, TDA21101G pinout, TDA21101G application, or TDA21101G equivalent, key selection criteria include its 30 V floating high-side drive capability, PVCC-adjustable gate voltage for loss optimization, thermal shutdown at 150 °C, and 1:1 compatibility with HIP6601A/B in P-DSO-8 packaging.
Technical Context
This driver implements adaptive gate control logic to prevent shoot-through by dynamically adjusting turn-on/turn-off timing based on PHASE node voltage transitions. Its high-impedance PVCC pin enables external resistor-based tuning of high-side gate voltage between 5 V and 12 V-directly balancing conduction losses, gate charge energy, and switching losses.
The internal bootstrap diode eliminates an external component while supporting up to 30 V DC bias on the PHASE node. Propagation delays are tightly matched (td(ON)_HS: 58–70 ns; td(ON)_LS: 40–60 ns) and temperature-stable across –25 °C to 125 °C junction range, enabling reliable operation in high-frequency (up to 2 MHz), high-density VRM designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Peak Output Current | 4 A per channel (HS/LS), enabling fast charging of high-Qg MOSFETs in multi-phase CPU supplies |
| Rise/Fall Time | 17–34 ns (typ.), supporting clean switching at up to 2 MHz without excessive EMI |
| High-Side Floating Voltage | 30 V max (PHASE referenced), allowing use in 12 V input VRMs with margin |
| PVCC Adjustment Range | 5–12 V via high-Z pin, permitting fine-tuning of HS gate voltage to minimize total power loss |
| Thermal Shutdown Threshold | 150 °C (with 50 °C hysteresis), protecting against sustained overload in compact PCB layouts |
| Supply Voltage Range (VCC) | 10.8–13.2 V (±10% @ 12 V nominal), compatible with standard VRM auxiliary rails |
| Propagation Delay Match | ≤30 ns difference between HS/LS channels, critical for precise dead-time control in synchronous rectification |
Pinout & Package
Packaged in P-DSO-8 (plastic dual small-outline, 8-pin, exposed pad), this SOIC-compatible surface-mount package supports thermal dissipation up to 0.8 W at 25 °C ambient and features gull-wing leads for automated assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GATEHS (Pin 1) | High-side N-MOS gate driver output | Drives gate of upper MOSFET in half-bridge; clamped to 10 V when PVCC > 10 V |
| BOOT (Pin 2) | Floating bootstrap supply node | Connects to external capacitor; generates gate drive voltage above PHASE for high-side N-MOS |
| PWM (Pin 3) | Digital input control signal | Accepts standard PWM logic (1.8–3.0 V shut-down window); open-circuit triggers safe shutdown |
| GND (Pin 4) | Power and signal reference ground | Common return for VCC, PVCC, and output stages; requires low-inductance layout |
| GATELS (Pin 5) | Low-side N-MOS gate driver output | Directly drives lower MOSFET gate; complements HS drive with matched timing |
| VCC (Pin 6) | Main power supply input | 10.8–13.2 V supply for internal logic and output stages; powers bootstrap circuitry |
| PVCC (Pin 7) | High-impedance gate voltage adjust | Resistor-divider programmable input sets HS gate voltage (5–12 V) to optimize efficiency |
| PHASE (Pin 8) | Half-bridge switching node | Connects to HS/LS MOSFET drain-source junction; referenced for BOOT and internal level-shifting |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap Diode | Eliminates external diode, reducing BOM count and PCB area in space-constrained VRM modules |
| Adaptive Cross-Conduction Prevention | Hardware-level timing control prevents simultaneous HS/LS conduction under dynamic load transients |
| Three-State Input Shutdown | Quiescent current drops to 4.5 mA when PWM input held in 1.8–3.0 V window, enabling system-level power gating |
| 1:1 Pin Compatibility with HIP6601A/B | Enables drop-in replacement in legacy motherboard designs without layout revision |
| Thermal Protection with Hysteresis | Shuts down at 150 °C and re-enables only after cooling to 100 °C, preventing thermal cycling damage |
Applications
| Desktop CPU VRM | Notebook CPU VRM |
|---|---|
Use Scenario: Multi-phase buck converter delivering 1–2 V @ 100+ A to Intel/AMD desktop CPUs on ATX motherboards. IC Role / Device Role / Timing Role: Dual gate driver controlling parallel high-side/low-side N-MOSFET pairs per phase; synchronized to PWM controller with sub-70 ns propagation delay. Use Value: Enables >90% efficiency at 500 kHz–1 MHz switching with minimal dead-time penalty due to matched HS/LS timing. | Use Scenario: Compact 2–3 phase VRM on thin-and-light laptop motherboards with strict thermal and area constraints. IC Role / Device Role / Timing Role: High-density gate driver with integrated bootstrap diode and 30 V PHASE rating, supporting 12 V input rail operation. Use Value: Reduces component count by one diode per phase and maintains stable gate drive despite battery voltage sag during turbo boost. |
| Motor Drive Half-Bridge | Class-D Audio Amplifier |
Use Scenario: Low-voltage BLDC motor driver stage in fan or pump controllers requiring robust shoot-through protection. IC Role / Device Role / Timing Role: Gate driver for N-N half-bridge with adaptive dead-time control and thermal shutdown at 150 °C. Use Value: Prevents MOSFET destruction during rapid direction reversal or stall conditions via hardware-level conduction blocking. | Use Scenario: High-fidelity Class-D amplifier output stage operating at 300–500 kHz with low THD+N requirements. IC Role / Device Role / Timing Role: Fast-switching gate driver delivering <30 ns edge rates to minimize switching distortion in audio band. Use Value: Achieves <0.01% THD+N by minimizing gate drive asymmetry and propagation skew between HS/LS paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel MOSFET gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HIP6601A | Identical pinout and function; no PVCC adjustment-fixed 10 V HS gate drive | Lacks tunable gate voltage; higher conduction loss in low-Rds(on) MOSFETs | Select when design uses legacy HIP6601A layout and fixed 10 V drive suffices |
| IR2110S | Higher VBS rating (600 V), but slower (120 ns typical rise), no integrated bootstrap diode, SOIC-14 package | Suited for high-voltage industrial half-bridges, not optimized for high-frequency VRMs | Select only for >100 V bus applications where TDA21101G's 30 V PHASE limit is insufficient |
Compared with HIP6601A and IR2110S, the TDA21101G uniquely combines VRM-optimized speed (<34 ns edges), integrated bootstrap diode, and programmable HS gate voltage-enabling superior efficiency in 12 V-input, multi-phase CPU power delivery where layout density and thermal margin are critical.
Availability
TDA21101G is available at Aetrix Electronics and suitable for desktop CPU VRMs, notebook CPU VRMs, motor drive half-bridges, and Class-D audio amplifiers requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for TDA21101G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global R&D and manufacturing infrastructure.
The TDA21101G belongs to Infineon's high-speed gate driver product line, engineered specifically for high-efficiency, high-frequency synchronous buck converters in computing power delivery systems.
FAQ
What is the maximum allowable voltage on the PHASE pin?
The PHASE pin supports a DC voltage range of –15 V to +30 V relative to GND. This 30 V maximum enables safe operation in 12 V input VRMs with sufficient headroom for ringing and overshoot. Exceeding 30 V risks permanent damage to the internal level-shifting circuitry and bootstrap clamp structure.
How does the PVCC pin adjust high-side gate voltage?
The PVCC pin is a high-impedance input that sets the high-side gate drive voltage via an external resistor divider from VCC. When PVCC = 5 V, HS gate drive is ~5 V; at PVCC = 12 V, it reaches 10 V (internally clamped). This allows real-time trade-off between Rds(on) loss, gate charge loss, and switching loss.
Does the TDA21101G require an external bootstrap diode?
No. The TDA21101G integrates a bootstrap diode internally, connecting VCC to BOOT during low-side conduction. This eliminates the need for an external diode, reducing component count and PCB footprint-critical for dense VRM layouts where every mm² matters.
What happens when the PWM input is left floating or disconnected?
When the PWM input is open (e.g., controller powered down or in high-Z state), the internal circuit detects VPWM ≈ 2.0 V and activates shutdown mode: both GATEHS and GATELS outputs disable, forcing MOSFETs OFF. This failsafe behavior prevents unintended switching and ensures system safety during controller initialization or fault conditions.
TDA21101G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Half Bridge
- Applications:
- DC-DC Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- -
- Current - Peak Output:
- 4A
- Voltage - Supply:
- 10.8V ~ 13.2V
- Voltage - Load:
- 5V ~ 13.2V
- Operating Temperature:
- -25°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Over Temperature, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-DSO-8
TDA21101G FAQ
1.How can I place an order for TDA21101G through Aetrix?
Please submit a Request for Quotation (RFQ) for TDA21101G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TDA21101G reliable?
The price and inventory of TDA21101G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA21101G is usually 5 days.
3.What payment methods are accepted for TDA21101G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA21101G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TDA21101G?
TDA21101G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TDA21101G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TDA21101G?
For technical support, including TDA21101G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA21101G requirements.
6.How does Aetrix verify that TDA21101G is sourced from the original manufacturer or authorized distributors?
All TDA21101G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA21101G meets industry standards.
7.What is the process for return or replacement of TDA21101G?
All TDA21101G units undergo pre-shipment inspection (PSI). If there is an issue with TDA21101G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TDA21101G part is unused and in its original packaging.
Return procedure for TDA21101G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TDA21101G Tags
-
NCP1393BDR2G
onsemi
-
A3909GLNTR-T
Allegro MicroSystems
-
NCP51530BDR2G
onsemi
-
A3909GLYTR-T
Allegro MicroSystems
-
SIC631CD-T1-GE3
Vishay Siliconix
-
BTN70301EPAXUMA1
Infineon Technologies
-
TDA21520AUMA1
Infineon Technologies
-
AOZ5116QI
Alpha & Omega Semiconductor Inc.
-
IRSM005-301MHTR
Infineon Technologies
-
IRSM005-301MH
Infineon Technologies
-
MP6610GJ-Z
Monolithic Power Systems Inc.
-
DRV8908QPWPRQ1
Texas Instruments
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
